Abstract: Herein disclosed is a microcomputer MCU adopting the general purpose register method. The microcomputer is enabled to have a small program capacity or a high program memory using efficiency and a low system cost, while enjoying the advantage of simplification of the instruction decoding as in the RISC machine having a fixed length instruction format of the prior art, by adopting a fixed length instruction format having a power of 2 but a smaller bit number than that of the maximum data word length fed to instruction execution means. And, the control of the coded division is executed by noting the code bits.

Abstract: In a semiconductor memory, switch circuits are provided so as to inhibit voltage and signal supplies to each of the normal memory blocks when so required. On the other hand, a ROM is provided on the chip so as to store the address of a defective memory block which consumes an excessively large stand-by current when the semiconductor memory is in the stand-by mode. The switch circuits are controlled by the output of the ROM so as to inhibit the voltage and signal supply to the defective memory block. Then, a spare memory block which is substituted for the defective normal memory block receives the voltage and signal supply.

Abstract: When the data of a mask pattern of a phase shift mask is to be made, the pattern data is separated into a real pattern data layer having the data of real patterns and a phase shift pattern data layer having the data of phase shift patterns. After this, it is verified whether or not the mask pattern satisfies the regulation of the gap of in-phase patterns, in which lights having transmitted through patterns adjacent to each other are in phase. It is also verified whether or not the mask pattern satisfies the regulation of the gap of out-of-phase patterns, in which lights having transmitted through patterns adjacent to each other are out of phase.

Abstract: In a semiconductor device including a power MOSFET (M.sub.0) for the output stage, a temperature detection circuit produces an output signal upon detecting an abnormal rise in the chip temperature, the signal turns on a set input element (M.sub.1) in a latch circuit so that the latch circuit becomes a set state, the set output of the latch circuit turns on a control element (M.sub.5), causing the power MOSFET to become non-conductive so that it is protected from destruction. The latch circuit is not brought to a reset state even if the external gate terminal of the device is brought to zero volt. With a voltage outside the range of the normal input signal, e.g., a large negative voltage, being applied to the external gate terminal, the gate capacitance of the control element (M.sub.5) discharges, and consequently the latch circuit is brought to the reset state and the protective operation is cancelled.

Abstract: A semiconductor device is fabricated by forming first metal balls on electrode pads of a semiconductor chip. The first metal balls each can have a sharp tipped anchor. All of the anchors simultaneously flattened slightly only to the extent of equalizing the height thereof. The first metal balls are bonded to electrodes formed on a substrate with wirings by embedding the anchors into the electrodes. Alternatively, second metal balls can be formed on the electrodes which are then flattened to equalize the height thereof. The first metal balls, either with or without the anchors, are bonded to the second metal balls. The first and second metal balls are preferably heated during the bonding step to soften the second metal balls.

Abstract: A parallel computer network wherein an arbitration circuit for performing arbitrating operation over a plurality of processing requests at the same time at high speed is provided in a crossbar network control circuit to thereby prevent the processing requests not selected from being kept awaited for a long time. The arbitration circuit includes a priority bit change circuit which has a plurality of adders for adding a preset value to the priority information of the each awaited processing request and also has a plurality of comparators for detecting the requests being awaited.

Abstract: Any one of the internal circuits of a semiconductor integrated circuit is made to operate both at a relatively high operating voltage having a predetermined allowable range and at a relatively low operating voltage also having a predetermined allowable range. The operating voltage is supplied from the outside. Moreover, the operating conditions of the internal circuits constituting the semiconductor integrated circuit are individually set restrictive to the relatively high operating voltage having a predetermined allowable range and to the relatively low operating voltage having a predetermined allowable range. The semiconductor integrated circuit is made to operate selectively at these operating voltages. Since the internal circuits are operated at these two kinds of operating voltages, an arrangement of internal circuits can be simplified and at the same time the semiconductor integrated circuit is usable in not only the conventional system but also a low-voltage one.

Abstract: A plurality of memory cells have their sources and drains formed integrally with n.sup.+ -buried layers acting as first data lines in a semiconductor substrate. The n.sup.+ -buried layers are connected with second data lines through transfer MISFETs. These transfer MISFETs have their gates made of the same layer of polycrystalline silicon as that of the floating gates of memory cells are shunted at each predetermined number of bits by Al lines having a lower resistance than that of the polycrystalline silicon.

Abstract: Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

Abstract: An electrically rewritable flash memory device which has a memory cell array arranged in rows and columns of memory cells and which is divided into a plurality of memory blocks having different memory capacities. Each memory block having one or more rows of memory cells. A common voltage control circuit is provided for each of the memory blocks for applying a first potential to a common conductor for a memory block containing a memory cell selected with a selection voltage applied to its associated data line conductor for a writing operation and a second potential higher than the first potential to a common conductor for a memory block containing a memory cell unselected with the selection voltage applied to its associated data line conductor and containing no selected memory cell for a writing operation.

Abstract: One object of the present invention is to provide the reduced projection exposure method which enables the exposure of various and fine patterns in manufacturing process of semiconductor devices or semiconductor integrated circuit devices. Structure of the present invention to attain the above object is to carry out the reduced projection exposure using a phase shift mask provided with a prescribed correction pattern on the end of the mask pattern domain of a constant mode or the boundary of the mask pattern domain of plural modes. According to this structure, as the end effects etc. are canceled by the correction pattern, the various and fine patterns can be exposed.

Abstract: Write column selection MOSFETs of memory cells MC are coupled with, for example, the earth potential of the circuit. Write column selection signals supplied to these MOSFETs are formed selectively according to the column selection address signal and the write data. Thereby the write column selection MOSFETs of the memory cells MC function as a substantial write means. That is, the write column selection signal lines are used as the data lines at the same time.

Abstract: A pipelined A/D converter which minimizes differential non-linearity by preventing mismatching between converting stages. The A/D converter includes a plurality of converting stages connected in a cascade form wherein each of the converting stages includes an ADC unit for converting an analog input into a digital output. The digital outputs from said converting stages form a conversion output. Each preceding converting stage except a last converting stage further includes an amplifier for deriving and amplifying a conversion residue representing a quantization error resulting from the conversion performed by the preceding converting stage based on the digital output outputted by the ADC unit of the preceding converting stage and the analog input inputted to the preceding converting stage. The amplified conversion residue from the preceding converting stage is supplied as an analog input to a succeeding converting stage.

Abstract: A semiconductor memory is provided which includes a voltage converter supplying an internal supply voltage in proportion to the greater one of two reference voltages to a circuit in the semiconductor memory. The voltage converter includes a circuit which is provided for generating a first voltage whose dependency on an external supply voltage is regulated to a predetermined small value, while another circuit is provided for generating a second voltage whose dependency on the external supplying voltage is larger than the dependency of the first voltage. The voltage converter includes MOS transistors and differential amplifiers interconnected with one another, as well as a voltage dividing circuit. The memory also includes a word line booster for boosting the internal supply voltage.

Abstract: Disclosed is a one-chip ULSI which can carry out the fixed operation in a wide range of power supply voltage (1 V to 5.5 V). This one-chip ULSI is composed of a voltage converter circuit(s) which serves to a fixed internal voltage for a wide range of power supply voltage, an input/output buffer which can be adapted to several input/output levels, a dynamid RAM(s) which can operate at a power supply voltage of 2 V or less, etc. This one-chip ULSI can be applied to compact and portable electronic devices such as a lap-top type personal computer, an electronic pocket note book, a solid-state camera, etc.

Abstract: By forming an isolated semiconductor layer or electrode layer on a semiconductor surface between neighboring field effect transistors and element separating trenches which are deep enough to reach at least the semi-insulating substrate or the hetero junction interface on the buffer layer, low frequency oscillation of a compound semiconductor integrated circuit can be reduced. By controlling the thickness of the buffer layer having a hetero junction to at most 150 nm, the low frequency oscillation can be reduced. By forming materials separating adjacent elements with a width of at most 2 .mu.m which reach from the element region surface to the buffer layer having hetero junction so as to enclose the element regions and etched regions in the neighborhood of the elements or so as to enclose the element regions in the etched regions and by controlling the angle of the sides of the etched regions against the semiconductor layer surface to 10.degree. to 60.degree., wires can be prevented from short-circuiting.

Abstract: A process for architecting a figure input/output interface of an instance is provided in an object-oriented design supporting system or the like. An applicable graphic editor is provided with a figure editor, which expands a function for defining a method to draw a user figure and also a function for defining a slot of a figure attribute when the user figure is designated; and furthermore expands a function to produce an instance when the user figure is drawn and also a function for coupling the instances when the figures are connected with each other. Then, input/output figures of a design component are defined and inputted with employment of this applicable graphic editor. In the output, a slot of the displayed instance is updated and then a display is deformed. As a result, the formation of the figure input/output for the instance such as the design component is available by only operating the screen of the applicable graphic editor.

Abstract: A multiport memory is provided which permits both random access and serial access. In order to reduce parasitic capacitance and improve operating speed, the serial input/output lines are each divided into two parts at their middle points. Sense amplifiers for the serial input/output lines are provided at upper and lower ends of the serial access memory elements to respectively amplify signals from the divided lines. Additional features are provided for improving both the serial and random operation. For example, during the serial read mode, the column selector for random access is simultaneously operated, and read data passing through the random access column selector is used as head data for the serial output operation to be delivered through the serial output circuit. Also, a serial selector can be controlled by a select signal formed by a Gray Code counter to improve operating speed.

Abstract: Between an external terminal and the gate of one of output MOSFETs whose source or drain is connected to the external terminal, there is connected a P-channel type first protective MOSFET whose gate is connected to a high voltage side power supply terminal and which has a channel length equal to or larger than that of the output MOSFET, or an N-channel type second protective MOSFET whose gate is connected to a low voltage side power supply terminal and which has a channel length equal to or larger then that of the output MOSFET. When the external terminal is discharged by device charge, one of the protective MOSFETs is turned on, and the charge on the gate side of the output MOSFET can be likewise released by device charge to prevent ESD (Electro-Static Discharge) breakdown.

Abstract: Herein disclosed is a semiconductor integrated circuit for testing test data of two kinds of non-inverted and inverted statuses of all bits by itself with a prospective data of one kind to compress and output the test results. The semiconductor integrated circuit includes a decide circuit 25 for deciding a first status, in which the prospective data latched by a pattern register and the read data of a memory cell array are coincident, a second status, in which the read data is coincident with the logically inverted data of the prospective data, and a third statuses other than the first and second statuses through an exclusive OR gate to generate signals of 2 bits capable of discriminating the individual statuses. These statuses are informed to the outside of the semiconductor integrated circuit in accordance with high- and low-levels and a high-impedance.