Patents Assigned to Hosiden Electronics Co., Ltd.
  • Patent number: 7204009
    Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: April 17, 2007
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Takao Kawamura, Yoshiaki Ohbayashi, Mamoru Yasuda
  • Patent number: 7080442
    Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: July 25, 2006
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Takao Kawamura, Yoshiaki Ohbayashi, Mamoru Yasuda
  • Publication number: 20030035558
    Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).
    Type: Application
    Filed: October 21, 2002
    Publication date: February 20, 2003
    Applicant: Hosiden Electronics Co., Ltd.
    Inventors: Takao Kawamura, Yoshiaki Ohbayashi, Mamoru Yasuda
  • Patent number: 5248963
    Abstract: In the case of erasing a display on an active matrix type liquid crystal display which has a source bus drive circuit (16) and a gate bus drive circuit (17), pixel signals for turning OFF pixels of one row are applied to the source bus drive circuit, and at the same time, a clear signal (CL) is provided to the gate bus drive circuit (17), from which a voltage for turning ON transistors (13) provided in association with the respective pixels is applied to gate buses (15.sub.l through 15.sub.m) all at once. A power holding circuit (22) is provided for holding power of an operating power supply (V.sub.1) for a predetermined period of time after the power supply of the display is turned OFF, and a voltage drop detector (24) is provided for detecting the turning OFF of said power supply, and its detection signal is used to produce the clear signal (CL), which is provided to the gate bus drive circuit (17).
    Type: Grant
    Filed: February 26, 1992
    Date of Patent: September 28, 1993
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Masaru Yasui, Noriyoshi Uenishi
  • Patent number: 5086347
    Abstract: In an active matrix liquid crystal display device in which source and gate buses are arranged in a matrix form, thin film transistors are provided at intersections of the source and gate buses and display electrodes are driven by applying voltage thereto via the thin film transistors, source and gate bus repair conductive layers are provided which extend along the source buses in opposing relation thereto across an insulating layer. When any one of the source or gate buses is broken, the repair conductive layer and the broken bus can be connected at both side of the broken portion by laser welding.
    Type: Grant
    Filed: December 6, 1989
    Date of Patent: February 4, 1992
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Yasuhiro Ukai, Tomihisa Sunata, Teizo Yukawa
  • Patent number: 5075518
    Abstract: A jack with switch comprises a body that has a plug insertion hole and a switch chamber which is adjacent to the plug insertion hole. The plug insertion hole and the switch chamber communicate with one another. The switch chamber contains a separator partly projecting into the plug insertion hole, a movable contactor piece, and a stationary contactor piece. When a plug is inserted into the plug insertion hole, the separator is transversely displaced to space the movable contactor piece apart from the stationary contactor piece. When the separator is displaced or moved by a predetermined extent, the separator hits a projected wall portion formed in the switch chamber in order to restrict further displacement of the separator. Even if the plug is wrenched in the jack, the movable contactor piece is prevented from excessive displacement.
    Type: Grant
    Filed: March 30, 1990
    Date of Patent: December 24, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Kouji Matsumoto
  • Patent number: 5061205
    Abstract: An electrical connector for flat arranged terminals provided on a flexible sheet is more compact in size and reduces the number of parts via one-piece formation. A body portion and a cover portion of the connector are configured by insert molding to contain a frame having parallel conductive contact lines as an insert. The body is configured to be spaced from the cover, but connected by a pair of hinge portions. The contact lines extending from two sides of the body are cut off from the prior stage frame, and the lines extending from one side are each bent on the body to form a leaf spring. The lines extending from another side of the body are curtailed. Then, the cover is bent over the body to fit each other. In the fitting, the cover is withheld first at a position that provides a clearance to receive the flexible sheet having terminals to be connected.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: October 29, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Hisao Toramoto
  • Patent number: 5061648
    Abstract: A thin-film transistor comprises a source electrode and a drain electrode formed in a spaced-apart relation to each other on a substrate, a semiconductor layer formed over the source and drain electrodes, a gate insulating film formed on the semiconductor layer and a gate electrode on the gate insulating film. First and second ohmic contact layers are formed in the entirety of the surface regions of the semiconductor layer which are in contact with the source and drain electrodes.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: October 29, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Shigeo Aoki, Yasuhiro Ukai
  • Patent number: 5051101
    Abstract: A multi-pole connector having a slider adapted to be moved, by the tip of a card inserted into the connector, from a first position where the slider supports contacts of contact pieces disposed side by side in the housing of the connector, to a second position where the slider is located rearward of the contacts is related. When the slider is moved between the first position and the second position with the card tip coming in contact with the slider, the contacts are slidingly transferred between the external contact pieces of the card and the contact supporting surfaces of the slider which are set at the same levels or substantially at the same levels as those of the external contact pieces. When the slider is moved from the first position to the second position or when the slider is located in the second position, the card is locked to the slider by the engagement pieces which are swung as supported by guide surfaces formed in the housing.
    Type: Grant
    Filed: July 24, 1989
    Date of Patent: September 24, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Yasuhiro Komatsu
  • Patent number: 5041022
    Abstract: A socket with a lock, in which a plurality of socket contacts (13) are held in a body (11) of a resin material, the body has an annular groove (14) cut therein outside the contacts and a ring-shaped metal cover (15) is secured in the annular groove along its outer peripheral surface. The ring-shaped cover (15) has an engaging edge for locking use (16) and at least one inwardly protruding lug (17).
    Type: Grant
    Filed: May 3, 1990
    Date of Patent: August 20, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Shigemi Sekiguchi
  • Patent number: 5038459
    Abstract: A one-piece diaphragm unit for a condenser microphone fabricated by gripping a diaphragm with predetermined tension, between metallic first and second rings, and electron beam welding the two rings and diaphragm together. Preferably, one of the first and second rings is provided with an edge flange which is raised about its inner periphery and extends inwardly of the other ring, biasing thereinto the diaphragm. When the diaphragm unit is built in the condenser microphone, a support plate of an insulating material is disposed in engagement with the first ring.
    Type: Grant
    Filed: January 16, 1990
    Date of Patent: August 13, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Mamoru Yasuda, Hitoshi Toda
  • Patent number: 5035652
    Abstract: In a multipin connector socket a rectangular body of an insulating material, with socket contacts housed therein in rows and columns, is received in a tubular metallic shield cover, which is, in turn, received in a square tubular case of an insulating material, defining therebetween a square groove for receiving a shell of the mating connector plug inserted thereinto from the front. The front of the socket portion of the case is covered with a metallic square tubular ground cover, and lugs set up from the shield cover are engaged with slots of the ground cover, by which the shield cover and the ground cover are electrically connected to each other. Spring pieces extending from the ground cover project into the square groove for elastically contacting the shell of the mating connector plug when the plug is inserted into the square groove.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: July 30, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Yasuji Shibano
  • Patent number: D318457
    Type: Grant
    Filed: January 11, 1989
    Date of Patent: July 23, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Hirofumi Inaba, Yasunori Nishikawa
  • Patent number: D319427
    Type: Grant
    Filed: February 21, 1989
    Date of Patent: August 27, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Norio Ichitsubo
  • Patent number: D320003
    Type: Grant
    Filed: November 16, 1988
    Date of Patent: September 17, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Yasuhiro Komatsu
  • Patent number: D322604
    Type: Grant
    Filed: March 29, 1989
    Date of Patent: December 24, 1991
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Yasuhiro Komatsu
  • Patent number: D322959
    Type: Grant
    Filed: December 22, 1989
    Date of Patent: January 7, 1992
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Toshio Sazaki
  • Patent number: D324846
    Type: Grant
    Filed: February 21, 1989
    Date of Patent: March 24, 1992
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Yasuji Shibano
  • Patent number: D325191
    Type: Grant
    Filed: February 21, 1989
    Date of Patent: April 7, 1992
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Yasuji Shibano
  • Patent number: RE35039
    Abstract: The invention relates to a method of manufacturing a jack comprising a step of punching a sheet metal by which a plurality of contact piece elements to be individual contact pieces of a jack are formed into a state of being partially connected to one another and arranged in parallel, a step of bending both ends of each contact piece element downward, a step of cutting off each contact piece element arranged in parallel by a cutter to form individual contact pieces, and a step of forcedly incorporating each contact piece into a jack body positioned right under a punching stroke of the cutter positioned right under a punching stroke of the cutter used in the cutting step whereby a complete automatization of the manufacturing is attained, considerably increasing productivity and decreasing an equipment cost as much.
    Type: Grant
    Filed: November 30, 1988
    Date of Patent: September 26, 1995
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Toru Masuda, Yasuji Shibano