Abstract: A magnetic memory structure that includes a two-terminal resistive memory element electrically connected with a selector structure. The selector structure includes a semiconductor pillar structure formed on a semiconductor substrate. The selector structure is surrounded by a gate dielectric layer, and the semiconductor pillar structure and gate dielectric layer are surrounded by an electrically conductive gate structure. The semiconductor pillar has first and second dimensions in a plane parallel with the surface of the semiconductor substrate that are unequal with one another. The semiconductor pillar structure can have a cross-section parallel with the semiconductor substrate surface that is in the shape of a: rectangle; oval elongated polygon, etc. The length of the longer dimension can be adjusted to provide a desired amount of current though the semiconductor pillar structure to drive the two-terminal resistive memory element.

Abstract: A Magnetic Tunnel Junction (MTJ) device can include a second Precessional Spin Current (PSC) magnetic layer of Ruthenium (Ru) having a predetermined thickness and a predetermined smoothness. An etching process for smoothing the PSC magnetic layer can be performed in-situ with various deposition processes after a high temperature annealing of the MTJ formation.

Abstract: A magnetic memory device comprises a cylindrical core and a plurality of layers surrounding the core. The plurality of layers include a metallic buffer layer, a ferromagnetic storage layer, a barrier layer, and a ferromagnetic reference layer. The cylindrical core, the metallic buffer layer, the ferromagnetic storage layer, the barrier layer, and the ferromagnetic reference layer collectively form a magnetic tunnel junction. A magnetization of the ferromagnetic layer storage parallels an interface between the metallic buffer layer and ferromagnetic storage layer.

Abstract: A vertical transistor structure having a metal gate wordline. The vertical transistor structure can include an epitaxially grown semiconductor column surrounded by a thin gate dielectric layer. A gate structure can surround the semiconductor column and the gate dielectric layer. The device can include first and second dielectric layers and an electrically conductive metal layer located between the first and second dielectric layers. The electrically conductive metal of the gate structure can be tungsten (W). In addition, a thin layer of Ti or TiN can be formed between the metal gate layer and the first and second dielectric layers and the gate dielectric layer. The metal gate layer can be formed with or without the use of a sacrificial layer.

Abstract: An arbitration control circuit in a pseudo-static random access memory (PSRAM) device includes a set-reset latch circuit receiving a normal access request signal and a refresh access request signal as first and second input signals and generating a first output signal having zero or more signal transitions in response to the order the first input signal and the second input signal is asserted. The arbitration control circuit further includes a unidirectional delay circuit applying a unidirectional delay to the first output signal and a D-flip-flop circuit latching the first output signal as data in response to the delayed signal as clock. The D-flip-flop generates a second output signal having a first logical state indicative of granting the normal access request and a second logical state indicative of granting the refresh access request to the memory cells of the PSRAM device.

Abstract: A clocked driver circuit can include a level shifter latch and a driver. The level shifter latch can be configured to receive an input signal upon a clock signal and generate a level shifted output signal. The driver can be configured to receive the level shifted output signal from the level shifter and drive the output signal on a line. The signal levels of the output signal can be greater than the signal level of the input signal.

Abstract: A three dimensional magnetic random access memory array that includes a sourceline formed on a substrate and a magnetic memory element pillar that includes a plurality of magnetic memory element pillars formed over the substrate. The three dimensional magnetic random access memory array also includes a transistor formed between the magnetic memory element pillar, the transistor being functional to electrically connect the sourceline and magnetic memory element pillar. A plurality of magnetic memory element pillars may be formed over the substrate with a transistor between each memory element pillar to selectively connect or disconnect each of the magnetic memory element pillars. The transistor can include an epitaxial semiconductor structure having a gate dielectric formed at a side of the epitaxial semiconductor and a gate material formed on the gat dielectric such that the gate dielectric material is between the gate material and the semiconductor material.

Abstract: A memory device for storing data comprises a memory bank comprising a plurality of addressable memory cells and a pipeline configured to process write operations of a first plurality of data words addressed to the memory bank. The memory also comprises a cache memory operable for storing a second plurality of data words and associated memory addresses, wherein the second plurality of data words are a subset of the first plurality of data words, wherein the cache memory is associated with the memory bank and wherein further each data word of the second plurality of data words is either awaiting write verification associated with the memory bank or is to be re-written into the memory bank, and wherein a write verification operation associated with a data word of the second plurality of data words is performed a predetermined period of time after the data word is written into the memory.

Abstract: A magnetoresistive random-access memory (MRAM) is disclosed. MRAM device has a magnetic tunnel junction stack having a significantly improved performance of the free layer in the magnetic tunnel junction structure. The MRAM device utilizes a precessional spin current (PSC) magnetic layer in conjunction with a perpendicular MTJ where the in-plane magnetization direction of the PSC magnetic layer is free to rotate. The precessional spin current magnetic layer is constructed with a material having a face centered cubic crystal structure, such as permalloy.

Abstract: In accordance with one embodiment, a method includes forming a cleavable donor substrate, the substrate including monocrystalline Si, forming a dielectric layer above the substrate in a film thickness direction, and cleaving the substrate into an upper portion having the dielectric layer and a lower portion. In one embodiment, the cleavable substrate is formed using a sacrificial buffer layer above the substrate in the film thickness direction, and forming a strained Si layer above the sacrificial buffer layer in the film thickness direction, followed by etching away the sacrificial buffer layer to cleave the substrate. In another embodiment, the cleavable substrate is formed by implanting ions into the substrate to a peak implant position located below an upper surface of the substrate, annealing the substrate and dielectric layer in an inert environment to form blisters at the peak implant position, and cleaving the substrate using the blisters.

Abstract: Embodiments of the present invention facilitate efficient and effective increased memory cell density configuration. In one embodiment, a memory system comprises: an array of addressable memory cells, wherein the addressable memory cells of the array comprise magnetic random access memory (MRAM) cells and wherein further the array is organized into a plurality of banks; an engine configured to control access to the addressable memory cells organized into the plurality of banks; and a pipeline configured to perform access control and communication operations between the engine and the array of addressable memory cells. At least a portion of operations associated with accessing at least a portion of one of the plurality of memory banks via the pipeline are performed substantially concurrently or in parallel with at least a portion of operations associated with accessing at least another portion of one of the plurality of memory banks via the pipeline.

Abstract: A method for manufacturing a magnetic memory array provides back end of line annealing for associated processing circuitry without causing thermal damage to magnetic memory elements of the magnetic memory array. An array of magnetic memory element pillars is formed on a wafer, and the magnetic memory elements are surrounded by a dielectric isolation material. After the pillars have been formed and surrounded by the dielectric isolation material an annealing process is performed to both anneal the memory element pillars to form a desired grain structure in the memory element pillars and also to perform back end of line thermal processing for circuitry associated with the memory element array.

Abstract: A DRAM memory cell and memory cell array incorporating a metal silicide bit line buried within a doped portion of a semiconductor substrate and a vertical semiconductor structure electrically connected with a memory element such as a capacitive memory element. The buried metal silicide layer functions as a bit buried bit line which can provide a bit line voltage to the capacitive memory element via the vertical transistor structure. The buried metal silicide layer can be formed by allotaxy or mesotaxy. The vertical semiconductor structure can be formed by epitaxially growing a semiconductor material on an etched surface of the doped portion of the semiconductor substrate.

Abstract: A magnetic memory element having a Ru hard mask layer. The use of Ru advantageously allows for closer spacing of adjacent magnetic memory elements leading to increased data density. In addition, the use of Ru as a hard mask reduces parasitic electrical resistance by virtue of the fact that Ru does not oxidize in ordinary manufacturing environments. The magnetic memory element can be formed by depositing a plurality of memory element layers, depositing a Ru hard mask layer, depositing a RIEable layer over the Ru hard mask layer, and forming a photoresist mask over the hard mask layer. A reactive ion etching can be performed to transfer the image of the photoresist mask onto the RIEable layer to form a RIEable mask. An ion etching can then be performed to transfer the image of the RIAable mask onto the underlying Ru hard mask and underlying memory element layers.

Abstract: A sense amplifier circuit implements a sense scheme using sense amplifier feedback control to disconnect the bit lines from the sense circuit during the read operation after the bit line signals are sensed. In this manner, read disturbance during the read operation is prevented. In some embodiments, the sense amplifier circuit includes a pair of pass gates to couple a pair of differential bit lines to a sense circuit. The sense amplifier circuit further includes a feedback control circuit to open the pair of pass gates in response to at least one of the sensed signals at the sense circuit changing logical state. The pair of pass gates are opened to disconnect the pair of differential bit lines from the sense circuit.

Abstract: A magnetic random access memory chip having magnetic memory elements with different performance characteristics formed on the same chip. The magnetic memory elements can be magnetic random access memory elements. The memory chip can have a first set of magnetic random access chips having a first set of physical and performance characteristics formed in a first area of the sensor and a second set of magnetic random access chips having a second set of performance characteristics formed in a second area of the chip. For example, the first set of magnetic random access memory elements can have performance characteristics that match or exceed those of a non-volatile memory, whereas the second set of magnetic random access memory elements can have performance characteristic that match or exceed those of a static random access memory element.

Abstract: A dynamic random access memory element that includes a vertical semiconductor transistor element formed on a substrate and electrically connected with a memory element such as a capacitive memory element. The memory element is located above the semiconductor substrate such that the vertical transistor is between the memory element and the substrate. The vertical semiconductor transistor is formed on a heavily doped region of the substrate that is separated from other portions of the substrate by a dielectric isolation layer. The heavily doped region of the semiconductor substrate provides electrical connection between the vertical transistor structure and a bit line. The dynamic random access memory element also includes a word line that includes an electrically conductive gate layer that is separated from the semiconductor pillar by a gate dielectric layer.

Abstract: A structure for providing an inverter circuit employing two vertical transistor structures formed on a semiconductor substrate. The vertical semiconductor structures each include a semiconductor pillar structure and a surrounding gate dielectric. A gate structure is formed to at least partially surround the first and second vertical transistor structures. The semiconductor substrate is formed into first and section regions that are separated by a dielectric isolation structure. The first region includes a P+ doped portion and an N+ doped portion, and the second region includes an N+ doped portion and a P+ doped portion. The N+ and P+ doped portions of the first and second regions can be arranged such that the N+ doped portion of the first region is adjacent to the P+ doped portion of the second region, and the P+ doped portion of the first region is adjacent to the N+ doped portion of the second region.

Abstract: A magnetic memory element having a magnetic free layer and a magnetic reference layer with a non-magnetic barrier layer between the magnetic reference layer and the magnetic free layer. A spin current layer (which may be a precessional spin current layer) is located adjacent to the magnetic free layer and is separated from the magnetic free layer by a non-magnetic coupling layer. A material layer adjacent to and in contact with the spin current layer, has a material composition and thickness that are chosen to provide a desired effective magnetization in the spin current layer. The material layer, which may be a capping layer or a seed layer, can be constructed of a material other than tantalum which may include one or more of Zr, Mo, Ru, Rh, Pd, Hf, W, Ir, Pt and/or alloys and/or nitrides of these elements.

Abstract: A magnetoresistive random-access memory (MRAM) is disclosed. MRAM device has a magnetic tunnel junction stack having a significantly improved performance of the free layer in the magnetic tunnel junction structure. The MRAM device utilizes a precessional spin current (PSC) magnetic structure in conjunction with a perpendicular MTJ where the in-plane magnetization direction of the PSC magnetic layer is free to rotate. The precessional spin current magnetic layer a first and second precessional spin current ferromagnetic layer separated by a nonmagnetic precessional spin current insertion layer.