Abstract: Examples include techniques to mirror a command/address or interpret command/address logic at a memory device. A memory device located on a dual in-line memory module (DIMM) may include circuitry having logic capable of receiving a command/address signal and mirror a command/address or interpret command/address logic indicated in the command/address signal based on one or more strap pins for the memory device.

Abstract: Integrated circuit structures configured with low loss transmission lines are disclosed. The structures are implemented with group III-nitride (III-N) semiconductor materials, and are well-suited for use in radio frequency (RF) applications where high frequency signal loss is a concern. The III-N materials are effectively used as a conductive ground shield between a transmission line and the underlying substrate, so as to significantly suppress electromagnetic field penetration at the substrate. In an embodiment, a group III-N polarization layer is provided over a gallium nitride layer, and an n-type doped layer of indium gallium nitride (InzGa1-zN) is provided over or adjacent to the polarization layer, wherein z is in the range of 0.0 to 1.0. In addition to providing transmission line ground shielding in some locations, the III-N materials can also be used to form one or more active and/or passive components (e.g., power amplifier, RF switch, RF filter, RF diode, etc).

Abstract: Embodiments of the present disclosure are directed towards a memory device with vertical string drivers, in accordance with some embodiments. In one embodiment, the memory device includes a plurality of wordlines formed in a stack of multiple tiers. The device further includes a semiconductor layer disposed on top of the plurality of wordlines. The device further includes a plurality of string drivers disposed in the semiconductor layer substantially perpendicular to the tier stack of the plurality of wordlines. The semiconductor layer provides respective gate connections for the plurality of string drivers. In some embodiments, the semiconductor layer may be fabricated of polysilicon. Other embodiments may be described and/or claimed.

Abstract: An electronic device may include a substrate, and the substrate may include one or more layers. The one or more layers may include a first dielectric material and one or more electrical traces. A cavity may be defined in the substrate, and the cavity may be adapted to receive one or more electrical components. One or more lateral traces may extend through a wall of the cavity. The lateral traces may provide electrical communication pathways between the substrate and the electrical components.

Abstract: A device is configured to be in communication with one or more host cores via a first communication path. A first set of processing-in-memory (PIM) cores and a second set of PIM cores are configured to be in communication with a memory included in the device over a second communication path, wherein the first set of PIM cores have greater processing power than the second set of PIM cores, and wherein the second communication path has a greater bandwidth for data transfer than the first communication path. Code offloaded by the one or more host cores are executed in the first set of PIM cores and the second set of PIM cores.

Abstract: Particular embodiments described herein provide for a silicon layer, where the silicon layer includes a profile and a thermal conductor coupled to the silicon layer, where the thermal conductor includes one or more residual stresses. The thermal conductor is modified based on the one or more residual stress such that when pressure is applied to the thermal conductor, a profile of the thermal conductor at least approximately matches the profile of the silicon layer. In an example, the thermal conductor is modified by removing material from one or more areas of the thermal conductor and the thermal conductor is coupled to the silicon layer by one or more pressure inducing mechanisms.

Abstract: Technologies for processor core soft-offlining include a computing device having a processor with multiple processor cores. On boot, an operating system queries a firmware interface to retrieve a potential offline set of processor cores. The operating system prevents the processor cores of the potential offline set from receiving device interrupts. The computing device detects a platform management event from the firmware interface and, in response to the platform management event, queries the firmware interface to determine a requested offline set of processor cores. Each of the processor cores in the requested offline set is included in the potential offline set. The computing device brings the processor cores of the requested offline set into a low-power state, and then the computing device may start performing a platform management operation. The platform management event may include a memory hot-plug event or a specialized workload event. Other embodiments are described and claimed.

Abstract: Technologies for end of frame marking and detection in streaming digital media content include a source computing device communicatively coupled to a destination computing device. The source computing device is configured to encode a frame of digital media content and insert an end of frame marker into a transport stream header of a network packet that includes an encoded payload corresponding to a chunk of data of the frame of digital media content. The destination computing device is configured to de-packetize received network packets and parse the transport stream headers of the received network packets to determine whether the network packet corresponds to an end of frame of the frame of digital media content. The destination computing device is further configured to transmit the encoded payloads of the received network packets to a decoder in response to a determination that the end of frame network packet has been received. Other embodiments are described and claimed.

Abstract: Dynamic bus inversion (DBI) for programmable levels of a ratio of ones and zeros. A transmitting device identifies a number and/or ratio of ones and zeros in a noninverted version of a signal to be transmitted (“noninverted signal”) and a number and/or ratio of ones and zeros in an inverted version of the signal (“inverted signal”). The transmitting device can calculate whether a difference of ones and zeros in the noninverted signal or a difference of ones and zeros in the inverted signal provides a calculated average ratio of ones to zeros closer to a target ratio. The transmitting device sends the signal that achieves provides the calculated average ratio closer to the target ratio.

Abstract: In one embodiment, an apparatus comprises a controller comprising circuitry, the controller to generate an error correction code for a memory line, the memory line comprising a plurality of first data blocks, wherein the error correction code comprises parity bits generated based on first portions of a plurality of second data blocks, wherein the plurality of second data blocks are the first data blocks or diffused data blocks generated from the plurality of first data blocks; generate a metadata block corresponding to the memory line, wherein the metadata block comprises the error correction code for the memory line and at least one metadata bit; encode the first data blocks and the metadata block; and provide the encoded data blocks and the encoded metadata block for storage on a memory module.

Abstract: A method, apparatus and system enable indirect remote interaction with a web browser. In one embodiment, remote user gestures may be captured and processed to determine an action to be taken by the web browser.

Abstract: Techniques are disclosed for forming high frequency film bulk acoustic resonator (FBAR) devices having multiple resonator thicknesses on a common substrate. A piezoelectric stack is formed in an STI trench and overgrown onto the STI material. In some cases, the piezoelectric stack can include epitaxially grown AlN. In some cases, the piezoelectric stack can include single crystal (epitaxial) AlN in combination with polycrystalline (e.g., sputtered) AlN. The piezoelectric stack thus forms a central portion having a first resonator thickness and end wings extending from the central portion having a different resonator thickness. Each wing may also have different thicknesses. Thus, multiple resonator thicknesses can be achieved on a common substrate, and hence, multiple resonant frequencies on that same substrate. The end wings can have metal electrodes formed thereon, and the central portion can have a plurality of IDT electrodes patterned thereon.

Abstract: An apparatus and method for performing dual concurrent multiplications of packed data elements.

Abstract: In one example an input/output interface to receive motion tracking data from at least one remote motion sensing device and a controller coupled to the input/output interface and comprising logic, at least partially including hardware logic, to receive the motion tracking data, generate estimated position data using the motion tracking data; and present the estimated position data on a display device coupled to the electronic device. Other examples may be described.

Abstract: Techniques are disclosed for producing integrated circuit structures that include one or more geometrically manipulated polarization layers. The disclosed structures can be formed, for instance, using spacer erosion methods in which more than one type of spacer material is deposited on a polarization layer, and the spacer materials and underlying regions of the polarization layer may then be selectively etched in sequence to provide a desired profile shape to the polarization layer. Geometrically manipulated polarization layers as disclosed herein may be formed to be thinner in regions closer to the gate than in other regions, in some embodiments. The disclosed structures may eliminate the need for a field plate and may also be configured with polarization layers that are shorter in lateral length than polarization layers of uniform thickness without sacrificing performance capability. Additionally, the disclosed techniques may provide increased voltage breakdown without sacrificing Ron.

Abstract: Embodiments of the present disclosure are directed towards apparatuses and methods for temperature management of a non-volatile memory device, e.g., an open-channel solid state device (OCSSD). In embodiments, an apparatus includes a temperature manager operatively coupled to the processor to submit a request for a temperature of an individual die of a memory device and based at least in part on a response to the request that includes the received temperature of the individual die, control access to the individual die by selectively restricting access to the individual die, while permitting access to another individual die on the memory device. In embodiments, the request is submitted via an input/output (I/O) path or I/O queue and includes a physical address of the individual memory die. Additional embodiments may be described and claimed.

Abstract: A system for multiple subject attention tracking includes: an input video controller to receive images of a plurality of people in an audience viewing an event occurring in a presentation area; a gaze detection circuit to: determine a plurality of gaze vectors of respective people of the plurality of people based on the images; and identify a fixation area using the plurality of gaze vectors; and a presentation controller to control at least one of a camera or a spotlight, to focus on the fixation area.

Abstract: Embodiments described herein provide an apparatus comprising a processor to allocate a first memory space for data for a graphics workload, the first memory comprising a first plurality of addressable memory locations, allocate a second memory space for compression metadata relating to the data for the graphics workload, the second memory space comprising a second plurality of addressable memory locations and having an amount of memory corresponding to a predetermined ratio of the amount of memory allocated to first memory space, and configure a direct memory mapping between the first plurality of addressable memory locations and the second plurality of addressable memory locations. Other embodiments may be described and claimed.

Abstract: In some embodiments, an apparatus includes one or more communication sub-systems; and an identity mirror component in communication with the one or more communication sub-systems. In response to selection, on an another device, of the apparatus from among a plurality of devices, receive, from the another device, carrier user identity information and carrier authentication key information associated with the carrier user identity information. Cause the one or more communication sub-systems to connect to a carrier network using the carrier user identity information and the carrier authentication key information, wherein to connect to the carrier network is conditioned on the another device being disconnected from the carrier network and the another device is to retain the carrier user identity information and the carrier authentication key information in an Internet protocol (IP) multimedia services identity module (ISIM).

Abstract: The present disclosure relates to memory array access control. An apparatus includes partition control circuitry to control at least one partition of a memory array, the at least one partition control circuitry also to receive a controlled clock signal to enable execution of a legitimate memory access command and to generate an active/idle signal having an active state when executing the legitimate memory access command and an idle state when executing the legitimate memory access command is complete; wherein the clock signal is disabled when the active/idle signal is in an idle state.