Abstract: Some exemplary embodiments of a direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor devices, have been disclosed. One exemplary structure comprises a first contact lead frame portion, a paddle portion, and an extended contact lead frame portion held together by a mold compound. A first semiconductor device is attached to a top side of the paddle portion and is enclosed by said mold compound, while a second semiconductor device is attached to a bottom side of said paddle portion and is in electrical contact with said the first semiconductor device. The extended contact lead frame portion is in direct electrical contact with the second semiconductor device without using a bond wire. Alternative exemplary embodiments may include additional extended lead frame portions, paddle portions, and semiconductor devices in various configurations.

Abstract: A power semiconductor device that includes common conduction regions, charge compensation regions, each adjacent a respective common conduction region, and a stand off region over the common conduction regions and charge compensation regions.

Abstract: III-nitride materials are used to form isolation structures in high voltage ICs to isolate low voltage and high voltage functions on a monolithic power IC. Critical performance parameters are improved using III-nitride materials, due to the improved breakdown performance and thermal performance available in III-nitride semiconductor materials. An isolation structure may include a dielectric layer that is epitaxially grown using a III-nitride material to provide a simplified manufacturing process. The process permits the use of planar manufacturing technology to avoid additional manufacturing costs. High voltage power ICs have improved performance in a smaller package in comparison to corresponding silicon structures.

Abstract: A control circuit for use in controlling a phase of a multi-phase voltage converter in accordance with an embodiment of the present invention includes a driver operable to provide a first control signal to a high side switch of a half-bridge of the phase and a second control signal to a low side switch of the half bridge, such that a desired output voltage is provided by the phase, current sensing circuitry operable to detect the output current of the phase, a comparator operable to compare the output current to a threshold current value and a disabling device operable to provide an enable/disable signal to disable the driver when the output current is below the threshold current value.

Abstract: A high reliability power module which includes a plurality of hermetically sealed packages each having electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.

Abstract: An inverter for driving a motor includes one or more power stages for producing one or more power signals for energizing the motor, each power stage including first and second III-nitride based bi-directional switching devices connected in series between a DC voltage bus and ground.

Abstract: A method for fabricating an IC package that includes depositing conductive adhesive bodies on the leads, and then adhering the electrodes of an IC device to the so disposed conductive adhesive bodies.

Abstract: An over temperature detector circuit for use in a switching converter including one or more power switches in accordance with an embodiment of the present application includes a silent sense generator connected to at least one power switch and operable to detect a noise level of the switch and to provide a generator output signal indicative of absence of switching noise and a comparator operable to compare a temperature sensor signal from a temperature sensor with a reference voltage to provide an alarm signal indicating an over temperature condition when the temperature sensor signal exceeds the reference voltage, wherein the alarm signal does not indicate an over temperature condition when the generator output signal does not indicate absence of switching noise.

Abstract: A planar transformer arrangement and method provide isolation between an input signal and an output signal.

Abstract: A power arrangement that includes a monolithically integrated III-nitride power stage having III-nitride power switches and III-nitride driver switches.

Abstract: A copper strap for a semiconductor device package having a contact electrically connected to a die electrode, a leg portion electrically connected to a lead frame, a web portion positioned between the contact and the leg portion and connected to the leg portion and a connection region connecting the web portion to the contact. The contact includes a body having a plurality of formations, each of the plurality of formations having a concavity and an opposing convexity positioned to generally face the die electrode.

Abstract: In one embodiment a self-aligned vertical group III-V transistor comprises a group III-V layer having a first conductivity type formed over a group III-V drift body having a second conductivity type opposite the first conductivity type, a pinch-off region formed by dopant implantation of the group III-V layer. The pinch-off region is doped so as to have the second conductivity type, and extends through the group III-V layer to the group III-V drift body. The self-aligned vertical group III-V transistor also comprises a pinch-off insulation body formed over the pinch-off region, the pinch-off region and the pinch-off insulation body being self-aligned. In one embodiment, the present invention may take the form of a self-aligned vertical N-channel field-effect transistor (FET) in gallium nitride GaN.

Abstract: A laser ablated wafer for a semiconductor device, such as a MOSFET or other power device, and a method of producing such a wafer to achieve a lower electrical resistance are provided. The method includes forming first holes, slots or trenches on a first surface of the wafer and focusing a laser beam to form second trenches on a bottom surface of the wafer, and filling the trenches, for example using aluminum or other metallic filling, to provide conductive electrodes or conductive surfaces for the semiconductor device. In such a wafer each trench on the second surface may be deeper, for example more than one hundred microns deep and tens of microns wide.

Abstract: According to one embodiment, a high electron mobility transistor (HEMT) comprises an insulator layer comprising a first group III-V intrinsic layer doped with a rare earth additive. The HEMT also comprises a second group III-V intrinsic layer formed over the insulator layer, and a group III-V semiconductor layer formed over the second group III-V intrinsic layer. In one embodiment, a method for fabricating a HEMT comprises forming a first group III-V intrinsic layer and doping the first group III-V intrinsic layer with a rare earth additive to produce an insulator layer. The method also comprises forming a second group III-V intrinsic layer over the insulator layer, and further forming a group III-V semiconductor layer over the second group III-V intrinsic layer. A two-dimensional electron gas (2DEG) is formed at a heterojunction interface of the group III-V semiconductor layer and the second group III-V intrinsic layer.

Abstract: According to one disclosed embodiment, a monolithic vertically integrated composite device comprises a double sided semiconductor substrate having first and second sides, a group IV semiconductor layer formed over the first side and comprising at least one group IV semiconductor device, and a group III-V semiconductor body formed over the second side and comprising at least one group III-V semiconductor device electrically coupled to the at least one group IV semiconductor device. The composite device may further comprise a substrate via and/or a through-wafer via providing electric coupling. In one embodiment, the group IV semiconductor layer may comprise an epitaxial silicon layer, and the at least one group IV semiconductor device may be a combined FET and Schottky diode (FETKY) fabricated on the epitaxial silicon layer. In one embodiment, the at least one group III-V semiconductor device may be a III-nitride high electron mobility transistor (HEMT).

Abstract: A circuit comprising a gate driver including first and second switching stages for driving respective sync and control switches, at least one of which is a normally ON depletion mode device, and another circuit connected to the first and second switching stages and including first and second circuits. The first circuit is coupled to the first switching stage and to the sync switch, the first switching stage having a first state wherein the sync switch is on, and a second state wherein a first bias voltage is switched to the gate of the sync switch to turn it off. The second circuit has a first state wherein the control switch is on when the sync switch is off, and a second state wherein the control switch is switched off when the sync switch is on by switching a second bias voltage to the gate of the control switch.

Abstract: An automotive drive system for a high voltage electric motor comprises a microcontroller and ECU powered by a low voltage (12 volt) bus net which controls the drives of a high voltage inverter powered by a 100 volt or higher source, which, in turn, drives the motor. To provide good electrical insulation between the low voltage and high voltage systems, the low voltage control signals are produced by a low voltage signal input chip which has a bottom electrode which produces a control potential responsive to the ECU output and a high voltage driver IC which drives the power devices of the high voltage inverter. The high voltage driver IC has a top electrode which drives the high voltage IC function. The bottom electrode of the LV input chip is coupled to the top electrode of the high voltage driver IC through an insulation layer, defining a capacitive coupler which defines an isolation barrier between the low voltage net and the high voltage system insulation.

Abstract: A III-nitride heterojunction semiconductor device that includes a power electrode that is electrically connected to a conductive substrate through a trench in the heterojunction thereof.

Abstract: A flip chip Schottky die is provided, which includes three contact bumps extending from a top surface of the die for electrically connecting with a board, a first and second bump being cathode contacts, and a third bump being an anode contact and having a larger surface than each of the first and second bumps for a 0.5 ampere device. Each bump is substantially rectangular at its base, but may have a curved or arched top surface on a square die. Also, provided is a contact bump useful in a flip chip device, such as a MOSFET or diode for a current of 1.0 amperes that includes a solder body of PbSn or a solder body free of lead comprising SnAgCu. Such a contact bump is substantially rectangular, and a height of approximately 120 ?m.

Abstract: An enhancement mode III-nitride power semiconductor device that includes normally-off channels along the sidewalls of a recess and a process for fabricating the same, the device including a first power electrode, a second power electrode, and a gate disposed between the first power electrode and the second power electrode over at least a sidewall of the recess.