Abstract: The present invention is related to a method for reducing the metal contamination on a surface of a semiconductor substrate wherein said substrate is submitted to a wet cleaning or rinsing process in a solution capable of oxidising said surface and containing a substance strongly dissociating in said solution whereby creating an amount of ions of at least one species in said solution, at least one of the ion species being such that the ions of the species are binding to the oxidised surface in such a way that said amount of ions is substantially reducing the amount of metal ions bound to the oxidised surface. Wet treatments such as rinsing, cleaning, in wet benches, batches and single wafer wet-cleaning equipment and single or double-side cleaning or etching applications can use the method of the present invention.

Abstract: Test circuitry and test methods performing supply current measurement is presented. The test circuitry can be but is not limited to be on-chip. The supply current, also denoted test current, can be transient. The test circuitry and methods do not cause additional power supply voltage degradation. The test circuitry and methods provide detection capabilities for open defects, causing significant reduction of the transient supply current.

Abstract: An apparatus and method for testing supply connections of an electronic device by using a current mirror configuration through using a particular connection of the branches of the current mirror to the supply line is provided. Such connection results in unbalanced operation of the current mirror but depending whether the supply connection under test is proper or not, the unbalance is essentially different, resulting in a high sensitivity of the test device.

Abstract: Test circuitry and test methods performing supply current measurement is presented. The test circuitry can be but is not limited to be on-chip. The supply current, also denoted test current, can be transient. The test circuitry and methods do not cause additional power supply voltage degradation. The test circuitry and methods provide detection capabilities for open defects, causing significant reduction of the transient supply current.

Abstract: A method, i.e. the so-called Cube-Assembling Method (CAM), is disclosed for locally refining a n-dimensional mesh in a predetermined domain, wherein the mesh comprises nodes and n−1 planes connecting these nodes thereby dividing said domain in n-dimensional first elements. By applying a mesh on a domain, the domain can be introduced in a computer aided design environment for optimization purposes. Concerning the mesh, one of the issues is to perform the optimization using the appropriate amount of nodes at the appropriate location The method of the present invention succeeds in adding or removing nodes locally. The assembling is done over the elements, being e.g. squares or cubes or hypercubes dependent of the dimension of the mesh. Like the finite-box method, the CAM method is easy to program, even in higher dimensions. However, the CAM method does not suffer from the restriction that only one line may terminate at the side of a box.

Abstract: A method and apparatus for dispensing a liquid on the surface of a localized zone of a substrate, for example for cleaning of etching purposes. Along with the liquid, a gaseous tensio-active substance is supplied, which is miscible with said liquid and when mixed with the liquid, reduces the surface tension of said liquid, thus containing the liquid in a local zone of the substrate surface.

Abstract: A system for the measurement of a supply current of an electronic circuit is disclosed. The system includes: a first part for applying and controlling at least one voltage and one current on the circuit; a second part being fed by an input voltage and delivering a first output voltage and a first output current on a first terminal and a second output current on a second terminal, the first output voltage being essentially equal to the input voltage, said second output current being essentially proportional to the first output current being the supply current; a switch in between the first and the second part, being controlled by trigger means controlled by the first part, for turning the switch off or on whereby switching the second part in measurement mode or in bypass mode.

Abstract: A method is disclosed for the formation of ferro-electric films using a multi coating process based on a sol-gel technique. In particular a method is disclosed to fabricate high-quality thickness scaled PZT films of an alkoxide-type liquid chemical PZT precursor solution, preferably a Pb(ZrxTi1−x)O3 precursor solution, using a sol-gel technique. At least two coated layers are deposited, but the precise number of coated layers depends on the desired thickness of the ferro-electric film. According to the method of the invention, the electrical characteristics of the film as formed are not dependent on the number of coated layers. There are a number of properties, characteristic for the method of the present invention, and resulting in said excellent electrical characteristics. In fact said method can comprise a multi coating process wherein a reduced number of coated layers is used but where intermediate crystallization steps are performed.

Abstract: A method of fabricating an infrared detector, a method of controlling the stress in a polycrystalline SiGE layer and an infrared detector device is disclosed. The method of fabricating includes the steps of forming a sacrificial layer on a substrate; patterning said sacrificial layer; establishing a layer consisting essentially of polycrystalline SiGe on said sacrificial layer; depositing an infrared absorber on said polycrystalline SiGe layer; and thereafter removing the sacrificial layer. The method of controlling the stress in a polycrystalline SiGe layer deposited on a substrate is based on varying the deposition pressure. The infrared detector device comprises an active area and an infrared absorber, wherein the active area comprises a polycrystalline SiGe layer, and is suspended above a substrate.

Abstract: The present invention is related to a method of removing particles and a liquid from a surface of a substrate using at least one rotating cleaning pad. The approach, according to the present invention, is a technique wherein a sharp liquid-vapor boundary is created on the surface of the substrate adjacent to the last wetted rotating cleaning pad of a plurality of rotating cleaning pads and particularly between this last wetted rotating cleaning pad and a first edge of the substrate.

Abstract: A method of fabricating an infrared detector, a method of controlling the stress in a polycrystalline SiGE layer and an infrared detector device is disclosed. The method of fabricating includes the steps of forming a sacrificial layer on a substrate; patterning said sacrificial layer; establishing a layer consisting essentially of polycrystalline SiGe on said sacrificial layer; depositing an infrared absorber on said polycrystalline SiGe layer; and thereafter removing the sacrificial layer. The method of controlling the stress in a polycrystalline SiGe layer deposited on a substrate is based on varying the deposition pressure. The infrared detector device comprises an active area and an infrared absorber, wherein the active area comprises a polycrystalline SiGe layer, and is suspended above a substrate.

Abstract: An open apparatus is described for the processing of planar thin semiconductor substrates, particularly for the processing of solar cells. The apparatus includes a first zone for the drying and burn-out of organic components from solid or liquid based dopant sources pre-applied to the substrates. The zone is isolated from the remaining zones of the apparatus by an isolating section to prevent cross-contamination between burn-out zone and the remaining processing zones. All the zones of the apparatus may be formed from a quartz tube around which heaters are placed for raising the temperature inside the quartz tube. Each zone may be purged with a suitable mixture of gases, e.g. inert gases such as argon, as well as oxygen and nitrogen. The zones may also be provided with gaseous dopants such as POCl3 and the present invention includes the sequential diffusion of more than one dopant into the substrates. Some of the zones may be used for driving-in the dopants alternatively, for other processes, e.g. oxidation.

Abstract: A method of erasing and a method of programming a nonvolatile memory cell in a chip is disclosed. Said cell comprises a semiconductor substrate including a source and a drain region and a channel therebetween, a floating gate extending over a portion of said channel, a control gate extending over another portion of the channel region, and a program gate capacitively coupled through a dielectric layer to said floating gate. The methods or schemes are using substantially the lowest possible voltage to erase a nonvolatile memory cell of the floating-gate type without having the SILC problem. Therefore, these schemes are expected to allow a further scaling of the minimum feature size of Flash memory products which is necessary for cost reduction and density increase. The present invention also aims to further decrease the voltages necessary to erase/program the memory device without degrading the corresponding performance.

Abstract: A contacted array of programmable and erasable semiconductor memory devices. Each of the memory devices has a split gate structure, including a source region, a drain region, a channel extending between the source and drain regions, a floating gate extending over a portion of the channel with a first dielectric layer therebetween, a control gate extending over a portion of the floating gate through a second dielectric layer, and a program gate extending above the floating gate with a dielectric layer therebetween. The program gate forms a capacitor with the floating gate with a coupling ratio sufficient to couple a voltage at least as high as the drain voltage to the floating gate, thereby establishing a high voltage at a point in the channel between the control gate and the floating gate and ensuring a high hot-electron injection towards the floating gate.

Abstract: The present invention is a design apparatus compiled on a computer environment for generating from a behavioral description of a system comprising at least one digital system part, an implementable description for said system, said behavioral description being represented on said computer environment as a first set of objects with a first set of relations therebetween, said implementable description being represented on said computer environment as a second set of objects with a second set of relations therebetween, said first and second set of objects being part of a design environment.

Abstract: A method of fabricating an infrared detector, a method of controlling the stress in a polycrystalline SiGE layer and an infrared detector device is disclosed. The method of fabricating includes the steps of forming a sacrificial layer on a substrate; patterning said sacrificial layer; establishing a layer consisting essentially of polycrystalline SiGe on said sacrificial layer; depositing an infrared absorber on said polycrystalline SiGe layer; and thereafter removing the sacrificial layer. The method of controlling the stress in a polycrystalline SiGe layer deposited on a substrate is based on varying the deposition pressure. The infrared detector device comprises an active area and an infrared absorber, wherein the active area comprises a polycrystalline SiGe layer, and is suspended above a substrate.

Abstract: The present invention is related to a system for transferring a beam of electromagnetic radiation having a vacuum wavelength. The system according to the invention includes a first dielectric medium, a second dielectric medium and a dielectric layer in between the first and the second medium. The dielectric layer has a periodicity of the dielectric properties parallel to the layer. The periodicity has a period that is smaller than the wavelength of the electromagnetic radiation in the second dielectric medium.

Abstract: A method of erasing and a method of programming a nonvolatile memory cell in a chip is disclosed. Said cell comprises a semiconductor substrate including a source and a drain region and a channel therebetween, a floating gate extending over a portion of said channel, a control gate extending over another portion of the channel region, and a program gate capacitively coupled through a dielectric layer to said floating gate. The methods or schemes are using substantially the lowest possible voltage to erase a nonvolatile memory cell of the floating-gate type without having the SILC problem. Therefore, these schemes are expected to allow a further scaling of the minimum feature size of Flash memory products which is necessary for cost reduction and density increase. The present invention also aims to further decrease the voltages necessary to erase/program the memory device without degrading the corresponding performance.

Abstract: Chemically sensitive sensors, suitable for detecting analytes in fluids (in gaseous or liquid phase), characterised in that the chemically sensitive sensors comprise a chemically sensitive probe, which comprises one or a blend of several arylene alkenylene oligomers.

Abstract: An integrated tunable optical filter comprising a substrate made of a semiconducting material. The substrate includes first and second sections. The first section forms a tunable transmission filter, based on a codirectional coupler having a low selectivity. The second section forms a reflection filter with a reflection spectrum containing a number of peaks. A first injector, designed for current injection into said first section, is provided. Thus, the filter response of the first section is shifted in wavelength over a large wavelength range. There is also a second injector, designed for current injection into the second section. As a result, the reflective spectrum of the second section is slightly shifted in wavelength, in such a way that one reflection peak of the reflection spectrum corresponds to the coupling wavelength of the first section. Consequently, the total filter response has a very narrow bandwidth and wide tunability.