Patents Assigned to Japan Aviation Electronics Industry, Limited
  • Publication number: 20240072479
    Abstract: A terminal-accommodation portion of a housing pierces a terminal-holding portion in a front-rear direction. A recess portion pierces the terminal-holding portion in a width direction and is opened upward. The recess portion communicates with the terminal-accommodation portions through an aperture formed in a bottom portion thereof. A latched portion of the terminal-accommodation portion protrudes in the recess portion. A protrusion portion of a retainer is provided with a latching portion and a retaining portion. When the protrusion portion is accommodated in the recess portion, the protrusion portion is positioned upward of the bottom portion of the recess portion. The latching portion is positioned downward of the latched portion. The retaining portion is positioned rearward of and faces a retained portion of a terminal.
    Type: Application
    Filed: May 18, 2023
    Publication date: February 29, 2024
    Applicant: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya MORISHITA, Yusuke OBATA
  • Patent number: 11916317
    Abstract: An RFID tag is provided with a base member, an antenna portion and an IC chip. A split-ring resonator portion of the antenna portion has a first part and a second part. First end portions of the first part are provided with a first facing portion and a first connection portion, respectively. Second end portions of the second part are provided with a second facing portion and a second connection portion, respectively. The first and the second facing portions are apart from and face each other. A third end portion of the impedance matching portion is connected to the first part between the first facing portion and the first connection portion, and another third end portion is connected to the second part between the second facing portion and the second connection portion. The IC chip is connected to the first connection portion and the second connection portion.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: February 27, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Jun Uchida
  • Patent number: 11916344
    Abstract: A cable assembly comprises a cable, a holding member and a contact. The holding member holds the cable. The contact is located above the holding member in an upper-lower direction. The cable comprises a conductive wire. The conductive wire has a fixed portion. The holding member has a predetermined surface. The contact has a facing surface. The facing surface is in contact with the predetermined surface in the upper-lower direction or faces the predetermined surface with a distance formed therebetween in the upper-lower direction. The fixed portion is fixed and connected to the predetermined surface.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: February 27, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Kentaro Toda
  • Publication number: 20240063565
    Abstract: A connector electrically connecting a module substrate and a main substrate includes: a housing mounted on the main substrate; contacts held on the housing, the contacts including contact parts and connection parts connected to the main substrate; a frame including a flat board part and side board parts, the flat board part fixed to the main substrate, one of a cam groove and a projection formed on the side board parts; a slider attached between the side board parts during the projection's insertion into the cam groove, the other of the cam groove and the projection formed at opposite side portions; a plate contained between the side board parts, the plate forming an insertion space between the plate and the housing, where when the slider slides in the module substrate's insertion direction into the insertion space, the slider presses the module substrate against the contact parts through the plate.
    Type: Application
    Filed: July 6, 2023
    Publication date: February 22, 2024
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu HASHIGUCHI
  • Publication number: 20240062028
    Abstract: A connector electrically connecting a module substrate and a main substrate includes: a housing mounted on the main substrate; contacts held on the housing and including contact parts and connection parts connected to the main substrate; a frame including side board parts sandwiching a flat board part and the main substrate, the side board parts forming one of a cam groove and a projection; and a slider having opposite side portions forming the other of the cam groove and the projection, forming an insertion space between the slider and the housing upon the projection's insertion into the cam groove and the slider's attachment to the frame, pressing the module substrate against the contact parts upon the slider sliding in the module substrate's insertion direction, sandwiching main substrate, the housing and the module substrate between the slider and the flat board part.
    Type: Application
    Filed: July 6, 2023
    Publication date: February 22, 2024
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu HASHIGUCHI
  • Patent number: 11905612
    Abstract: In a plating method for mounting a tubular workpiece having openings at both ends in an axial direction thereof on a power feeding clip and immersing the tubular workpiece in a circulated plating solution to plate the tubular workpiece, the mounting of the tubular workpiece on the power feeding clip is performed by inserting the power feeding clip into the tubular workpiece from one of the openings of the tubular workpiece. The power feeding clip is configured by a folded metal plate, and includes a plurality of elastic contact pieces that can elastically contact the inner surface of the tubular workpiece to hold the tubular workpiece and supply power to the tubular workpiece, and a restraining part that is located inside the tubular workpiece and restrains flow of the plating solution in the axial direction.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: February 20, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Takeharu Naito, Osamu Hashiguchi, Yumiko Kobori, Akifumi Nakamura, Yosuke Honda, Masanori Takahashi
  • Publication number: 20240033949
    Abstract: A wireless connector for wirelessly transmitting a to-be-transmitted target that is electric power and/or information, has a first unit and a second unit removably attached from the outside of a first object and a second object, respectively. The first unit includes a first transmission/reception part for wirelessly transmitting the to-be-transmitted target; and a first housing to which a first connector part for transmitting the to-be-transmitted target to/from the first object by being attached to the first object is fixed. The second unit includes a second transmission/reception part for wirelessly transmitting the to-be-transmitted target to/from the first transmission/reception part; and a second housing to which a second connector part for transmitting the to-be-transmitted target to/from the second object by being attached to the second object is fixed.
    Type: Application
    Filed: October 2, 2020
    Publication date: February 1, 2024
    Applicant: Japan Aviation Electronics Industry, Limited
    Inventors: Hideyuki NOGUCHI, Masayoshi YONEDA, Hiromasa TANAKA, Yuuri NAKAMURA, Hidehiko KURODA
  • Publication number: 20240039209
    Abstract: A module is composed of a terminal that is attached to a cable and an insulator that accommodates the terminal. The insulator includes two spring pieces and two protrusions that are formed on the two respective spring pieces. A housing has through holes on mutually opposed positions on respective side walls surrounding an accommodation space. The module is accommodated in the accommodation space in a manner such that the two protrusions thereof are fitted from an inside into the respective through holes. A hood is composed of two split bodies. The hood can be fixed on the housing in a manner such that projecting portions of the split bodies are fitted from an outside into the respective through holes and the two split bodies are coupled to each other with a coupling means.
    Type: Application
    Filed: July 24, 2023
    Publication date: February 1, 2024
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Hideyuki KANNO
  • Patent number: 11888247
    Abstract: A connector assembly comprises a connector and a mating connector mateable with each other. The mating connector comprises a mating lock member having a mating lock portion. The connector comprises a holding member and a lock member. The holding member has a holding portion and a stop portion. The lock member has a held portion and a lock portion. The held portion is held by the holding portion. The lock portion is located below the mating lock portion and faces the mating lock portion in the upper-lower direction under the mated state. The coupling portion has an abutment portion. When the lock portion is moved toward the held portion in the first horizontal direction in accordance with removal of the connector from the mating connector, the abutment portion is brought into abutment with the stop portion so that a movement of the lock portion is restricted.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: January 30, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Keisuke Nakamura, Tetsuya Komoto
  • Patent number: 11888265
    Abstract: A shield-type connector includes: an inner shell made of metal and provided in an inner housing; an outer shell made of metal and provided in an outer housing; and a cover shell made of metal and contacting with both of the inner shell and the outer shell, in which the inner shell, the outer shell and the cover shell include contact portions that contact with each other, and the contact portion of the cover shell is inserted between the contact portion of the inner shell and the contact portion of the outer shell.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: January 30, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Takashi Kumaki, Hiroto Nishimori, Tomoyuki Hirano
  • Patent number: 11888219
    Abstract: An antenna is configured to be soldered on a circuit board. The antenna comprises a main portion, at least one soldering terminal and at least one fixed portion. The main portion has a height in a vertical direction. The main portion is, at least in part, positioned below the soldering terminal in the vertical direction when the soldering terminal is soldered on the circuit board. The soldering terminal extends from the main portion along a horizontal plane perpendicular to the vertical direction. When the soldering terminal is soldered on the circuit board, the fixed portion is fixed on the circuit board at a location different from a location of the soldering terminal.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: January 30, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Osamu Hashiguchi, Jun Uchida
  • Publication number: 20240028174
    Abstract: In the present invention a detection unit of a touch panel has sensor electrodes and a plurality of lead-out wires connected to the sensor electrodes. Each lead-out wire is provided with a wiring main section. The sensor electrodes are provided with a plurality of electrode main sections and a plurality of connection sections. The wiring main sections and electrode main sections are formed by repeatedly arranging side by side, in a first direction, unit patterns having a prescribed shape. In a second direction two adjacent electrode main sections are connected to each other by at least one connection section. Connections sections which are near to each other in the second direction are in different positions in the first direction.
    Type: Application
    Filed: October 12, 2020
    Publication date: January 25, 2024
    Applicant: Japan Aviation Electronics Industry, Limited
    Inventors: Yuji KITAMURA, Makoto DANNO, Joji AKIZUKI
  • Patent number: 11881470
    Abstract: In a mounting structure in which an electronic component is mounted on a wiring board, a wiring sheet including an adhesive layer interposes between the electronic component and the wiring board and the electronic component is indirectly mounted on the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet and the adhesive layer of the wiring sheet is directly fitted to the wiring board. Conduction between the electronic component and the wiring board is attained by conduction between the electronic component and the wiring sheet and conduction between the wiring sheet and the wiring board.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: January 23, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Ryosuke Mitsui, Junya Sato, Atsushi Tanaka, Kosuke Matsuo
  • Patent number: D1011522
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: January 16, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1012069
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: January 23, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Jun Uchida
  • Patent number: D1014437
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: February 13, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Tomoya Kurosawa
  • Patent number: D1014441
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: February 13, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Tomoya Kurosawa
  • Patent number: D1015277
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: February 20, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Takashi Omodachi
  • Patent number: D1016021
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: February 27, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Yusuke Obata
  • Patent number: D1016753
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: March 5, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Takeshi Takahashi, Ryota Mizutani