Abstract: The present invention is a combustion system employing a urea-to-ammonia vapor reactor system. The urea-to-ammonia reactor housing enclosed in a bypass flow duct that receives a secondary flue gas stream at a split point from a main flue gas stream containing nitrogen oxides (NOx) emanating from a boiler. The bypass flow duct allows the secondary flue gas stream to flow past the enclosed reactor housing where injected aqueous urea in atomized or non-atomized form, is gasified to ammonia vapor. The resulting gaseous mixtures of ammonia, its by-products and the secondary flue gas stream subsequently rejoin the main stream, before the main flue gases are treated through a Selective Catalytic Reduction (SCR) reactor apparatus. A residence time of the secondary stream within the bypass flow duct, which may be increased by a recirculation loop, enables effective conversion of urea to ammonia to be used in the SCR apparatus.

Abstract: The present invention is a combustion system employing a urea-to-ammonia vapor reactor system. The urea-to-ammonia reactor housing enclosed in a bypass flow duct that receives a secondary flue gas stream at a split point from a main flue gas stream containing nitrogen oxides (NOx) emanating from a boiler. The bypass flow duct allows the secondary flue gas stream to flow past the enclosed reactor housing where injected aqueous urea in atomized or non-atomized form, is gasified to ammonia vapor. The resulting gaseous mixtures of ammonia, its by-products and the secondary flue gas stream subsequently rejoin the main stream, before the main flue gases are treated through a Selective Catalytic Reduction (SCR) reactor apparatus. A residence time of the secondary stream within the bypass flow duct, which may be increased by a recirculation loop, enables effective conversion of urea to ammonia to be used in the SCR apparatus.

Abstract: A system and method of maintaining an optimal temperature range for a catalyst section in a HRSG comprising placing a portion of the exhaust stream in a heat exchanger and superheater, diverting a second portion around the heat exchanger and superheater, combining the two portions and contacting the two portions with a catalyst section. Alternatively, a system of heat exchangers are employed to address the fluctuating exhaust temperature caused by the intermittent use of the duct burners.

Abstract: The present invention is a method for selective reduction of nitrogen oxides in a gas stream with ammonia wherein the ammonia is vaporized prior to contacting it with the carrying fluid. The present invention also comprises a reducing agent dispersion system for use in substantially uniformly mixing a reducing agent with nitrogen oxides in a flue gas stream comprising a header and a plurality of lances. Further, the present invention comprises a novel reactor design for use in selective reduction of nitrogen oxides in a gas stream.

Abstract: The present invention is a combustion system employing a urea-to-ammonia vapor reactor system. The urea-to-ammonia reactor housing enclosed in a bypass flow duct that receives a secondary flue gas stream at a split point from a main flue gas stream containing nitrogen oxides (NOx) emanating from a boiler. The bypass flow duct allows the secondary flue gas stream to flow past the enclosed reactor housing where injected aqueous urea in atomized or non-atomized form, is gasified to ammonia vapor. The resulting gaseous mixtures of ammonia, its by-products and the secondary flue gas stream subsequently rejoin the main stream, before the main flue gases are treated through a Selective Catalytic Reduction (SCR) reactor apparatus. A residence time of the secondary stream within the bypass flow duct, which may be increased by a recirculation loop, enables effective conversion of urea to ammonia to be used in the SCR apparatus.

Abstract: Described is an interface material composition that includes rubber, phase change material and thermally conductive filler.

Abstract: Described is a resin mixture for an organosilicon-containing composition suitable for use as an adhesive and capable of rapid curing at low temperature. The composition comprises about 10 to 80 wt. % of an organic compound component and about 20 to 90 wt. % of one of boron nitride, silica or silver. The organic compound component comprises the reaction product of about 40 to 90 wt. %, of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form. The resin mixture includes unsaturated liquid rubber having an attached functional group, and an average molecular weight of about 2,000 to 10,000.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A lyophilized imaging agent formulation and methods for making same are disclosed, such formulations comprise a targeting molecule such as antibody or chemotactic peptide, a linker such as diethylenetriaminepentaacetic acid (DTPA) or succinimidyl 6-hydrazinium nicotinate hydrochloride (SHNH), drying protectant such as mannitol, maltose or tricine, and excipient such as polysorbate 80, in citrate buffer. The formulations of the invention are lyophilized and may be stored stably for extended periods of time. Following reconstitution with diluent, the formulations are administered to a subject for scintigraphic imaging or therapeutic use. Also contemplated is a kit comprising a two-vial system wherein a first vial comprises a lyophilized formulation of imaging agent in the form of a lyophilized cake, and a second vial comprises a pharmaceutically acceptable carrier or diluent.

Abstract: Described is a compliant and crosslinkable thermal interface material of at least one malenized rubber with maleic anhydride adducted to the molecule and at least one hydroxyl terminated olefin rubbers, and a method of making and using same; as well as a method of improving thermal conductivity of polymer systems.

Abstract: A method for increasing the toughness of a platinum-based binary alloy system through heat treatment. An additional embodiment concerns a method whereby the material is first annealed and then heated appropriately to achieve an increase in tensile strength without a decrease in ductility. By selecting a binary composition within its defined miscibility gap and heat treating it for a prolonged period of time at a temperature that is within the miscibility gap but below the recrystallization temperature, an increased tensile strength and ductility is obtained with respect to the initial conditions of the composition. An exemplary embodiment concerns platinum-iridium alloys, particularly those compositions where iridium is present at either 20% or 25%. One particular application of this method concerns the manufacuture of corkscrew fixation devices used in the biomedical industry.

Abstract: Ultra-high purity hydrogen is produced from a hydrogen stream containing impurities including carbon monoxide and carbon dioxide, by first depleting the stream of carbon monoxide and carbon dioxide, than passing it through a semipermeable membrane such as a palladium-silver membrane, to remove methane, water and other impurities. Preferably, a methanation catalyst is used in the first step to convert the carbon monoxide and carbon dioxide to methane and water. This stream, free of carbon monoxide and carbon dioxide, is then passed through the semipermeable membrane to separate the remaining impurities.

Abstract: A resin composition, for use as a die attach adhesive, heat sink attach adhesive, encapsulant or underfill, comprises a resin system, including a mixture of an epoxy resin and a cyanate ester resin, and a polyamide catalyst. The composition is curable in one minute at 200.degree. C. and has a pot life of at least 18 hours at room temperature. The resin composition is flexible, develops high adhesion, high moisture resistance, low weight loss during curing and requires no solvents.

Abstract: Described is an organosilicon-containing composition suitable for use as an adhesive and capable of rapid curing at low temperature. The composition comprises about 10 to 80 wt. % of an organic compound component and about 20 to 90 wt. % of one of boron nitride or silver. The organic compound component comprises the reaction product of about 40 to 90 wt. % of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form.

Abstract: A method is described for decreasing bleed from an organic-based formulation comprising incorporating in the organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.6 angstroms; (b) a ratio of formula weight to number of heavy atom bonds of 13 to 16 grams; (c) a ratio of formula weight to end-to-end distance of 18 to 22 grams/angstrom; (d) a ratio of heavy atoms to heavy atom bonds of 1 to 1.1; (e) a ratio of weight fraction of carbon to formula weight of 0.7 to 0.95; (f) a ratio of formula weight to number of carbon to carbon bonds of 14 to 20 grams; and/or (g) 1 to 2 heteroatoms.Also described as an organic-based formulation is disclosed that comprises a filler, a resin and an organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.

Abstract: A composition suitable for use as an underfill for an interconnection between a semiconductor device and a substrate, as a semiconductor device encapsulant, a dam, an adhesive for direct chip attachment, and as an electrical connection for semiconductor device and a substrate. The composition contains about 40 to 90 wt. % of an electrically conductive or non-conductive filler and a cyanate ester and epoxy resin component. The cyanate ester/epoxy resin component comprises about 10 to 70 wt. % cyanate ester material, about 30 to 90 wt. % of epoxy resin, about 0.1 to 1.5 wt. % metal chelate/amine solid curing catalyst and about 0.1 to 5 wt. % of a coupling agent.

Abstract: Described is an organosilicon-containing composition with enhanced adhesive properties having about 10 to 80 wt. % of an organic compound component, about 20 to 90 wt. % of one of boron nitride or silver and at least about 0.1 wt. % carbon fibers. The component comprises the reaction product of about 40 to 90 wt. % of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form.

Abstract: The invention relates to a method of detecting a site of infection or inflammation, and a method for treating such infection or inflammation, in an individual by administering to the individual a diagnostically or therapeutically effective amount of detectably labeled, therapeutic, or therapeutically-conjugated, chemotactic peptide that accumulates substantially at the infected or inflamed site, said chemotactic peptide having the general structureX--Y--Leu--Phe--?Z!.sub.n --Wwherein:X is an amino protecting group,Y is an amino acid residue,Z is a spacer sequence,n is 0 or 1, andW is a labeling or attachment substituent.

Abstract: A method is described for determining high performing anti-bleed agents by comparing the structural characteristics of a compound to specified ranges of structurally-based variables. These structurally-based variables are determined by first comparing the structural characteristics of the best performing anti-bleed agents in a first set of computer simulations of anti-bleed agent candidates in a die attach adhesive on a substrate. The effects of other anti-bleed agent candidates are determined by plotting the structurally-based variables against modeled bleed. Predictive ranges are determined by the performance groups of the candidates with the coincidentally lowest bleed. Also disclosed are organic-based formulations suitable for assembling semiconductor devices including die attach adhesive useful for bonding a semiconductor device to a substrate that incorporates selected anti-bleed agents and which may additionally contain a filler.

Abstract: Bifunctional aromatic compounds which are capable of linking metal ions to biologically useful molecules. The bifunctional compounds are characterized as having a hydrazine or hydrazide group and a protein reactive group. The hydrazine or hydrazide group may be protected as a lower alkyl hydrazone. Conjugates of the bifunctional compounds with macromolecules are also described and labelled macromolecules comprised of the conjugates and metal ions are provided. Additionally, a method is provided for forming a labelled macromolecule by reacting a conjugate with a metal species. The compounds and method of this invention are particularly useful in the fields of biology and medicine for imaging and/or therapy.