Abstract: A (+)-charged dye transition metal complex, particularly a complex of platinum and a (+)-charged dye such as rhodamine 123. These products demonstrate antitumor and radio-sensitizing activity.

Abstract: In a process wherein diesel exhaust gas is passed through a filter to remove particulate therefrom before discharge and particulate deposited on the filter is combusted, the improvement which comprises combusting the particulate with a gas containing NO.sub.2, which may be catalytically generated in the exhaust system.

Abstract: A silver-glass paste consisting essentially of silver flake, silver oxide, lead borate glass, resin, thixotrope and solvent.

Abstract: A water-soluble solder paste consisting essentially of solder powder, water-soluble organic activator and polyethylene glycol vehicle.

Abstract: Silver flake having an organo-silver surfactant thereon. Preferably the surfactant is silver stearate. The flake is made by milling silver powder and the surfactant in a liquid medium in which the surfactant is insoluble. The flake makes possible silver-filled paste of improved properties.

Abstract: The present invention relates to a method of potentiating radiation therapy using Co(III) complexes of water soluble, synthetic meso-substituted porphyrins. The method results in the sensitization of both well oxygenated (oxic) and oxygen deficient (hypoxic) tumor cells.

Abstract: Apparatus for effecting high temperature catalytic conversion treatment of exhaust gases flowing in a large volume exhaust path comprising a plurality of separate catalyst panel assemblies, and a panel support assembly arranged to be mounted within the exhaust path and to separately removably support each of the plurality of catalyst panel assemblies so that high temperature exhaust gases within the exhaust path will flow therethrough in operation and each panel assembly can be conveniently serviced by simple removal. The panel support assembly includes an outer ambient temperature peripheral frame structure, an inner high temperature peripheral frame structure mounted within the outer peripheral frame structure for temperature responsive expansion and contraction with respect thereto, and an expansible and contractible high temperature resistant peripheral seal assembly between the inner and outer peripheral frame structures for maintaining a flow preventing seal therebetween.

Abstract: An SCR catalyst consisting essentially of iron sulfate or oxysulfur iron compound carried by a mixture of ceria and alumina on a support.

Abstract: A composition comprising a pharmaceutically acceptable polysaccharide carrier which has been chemically activated and then linked to platinum in either a +2 or +4 oxidation state through a bidentate oxygen-containing ligand including an amine group coupled to the activated polysaccharide. The composition may be used to link platinum metal remotely to a monoclonal antibody via the oxygen-containing ligand and the polysaccharide carrier such as dextran. The composition is optionally radiolabeled.

Abstract: An SCR catalyst consisting essentially of vanadium carried by a mixture of ceria and alumina on a support.

Abstract: An SCR catalyst consisting essentially of at least one oxysulfur compound of manganese, nickel or mixtures thereof, carried by a supported mixture of ceria and alumina. The catalyst is characterized by its high activity and by its stability even when used in the absence of sulfur oxides.

Abstract: Hypoxic cells are rendered more sensitive to destruction by X-rays or other high energy radiation by treatment with cobalt or iron coordination compounds.

Abstract: A catalyst composition comprising a PGM complex bound to a carboxylated polymer containing not more than 5 mol equivalents of carboxylate groups per gram of polymer.

Abstract: An SCR catalyst consisting essentially of iron sulfate or oxysulfur iron compound carried by a mixture of ceria and alumina on a support.

Abstract: An SCR catalyst consisting essentially of at least one oxysulfur compound of manganese, nickel of mixtures thereof, carried by a supported mixture of ceria and alumina. The catalyst is characterized by its high activity and by its stability even when used in the absence of sulfur oxides.

Abstract: A method and apparatus for regenerating a catalyzed particulate filter in the exhaust stream of a combustion source (particularly a diesel engine) are provided that do not necessitate excessive heating of the exhaust stream flowing from the combustion source. During regeneration the intake air is supplied in a pulsed manner, preferably but not necessarily, to less than all of the cylinders of the engine so that the combined engine exhaust carries sufficient "fuel", primarily in the form of a carbon monoxide and a hydrocarbon fraction, that will be catalytically oxidized thereby generating an exotherm. Due to the liberation of heat during that carbon monoxide and hydrocarbon oxidation above the light-off temperature of the filter, the particulates stored by the filter will be ignited and burned cleaning and regenerating the filter.

Abstract: A heat generating element particularly well suited for use in an electrical space heater and method of making same include an electrically nonconductive substrate on which is coated a layer of an electrically nonconductive ceramic material having finely divided, micron size metallic particles dispersed therein. A path of electrical conductivity is established in the otherwise nonconductive ceramic material by burnishing the surface of the ceramic material between two separated points. Thus, as electrical current flows along the burnished path, heat will be generated due to the electrical resistance thereof.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.