Abstract: Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.

Abstract: Described is a method of reducing resin bleed of a cyanate ester-containing die attach adhesive produced by curing a liquid resin system that contains cyanate ester monomer or mixtures that include cyanate ester monomer by adding an additive comprising at least one alkylene aromatic compound and curing the liquid resin system with the alkylene aromatic compound . Also disclosed is a die attach adhesive that comprises a resin system with an alkylene aromatic compound.

Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

Abstract: Platinum complexes, having anti-tumor activity, which include at least one functional ketone group or aldehyde, optionally conjugated as a linkable hydrazone complex. The functional ketone and aldehyde groups and the functionalized hydrazone complexes are linkable to antibodies, proteins, peptides and compounds having free amine, hydrazine or hydrazide functionality. Such agents are useful as targeted site-specific or disease specific chemotherapeutic agents.

Abstract: Low-moisture outgassing of hermetic packages can be achieved with a monomer having at least one OCN functional group.

Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

Abstract: Bifunctional aromatic compounds which are capable of linking metal ions to biologically useful molecules. The bifunctional compounds are characterized as having a hydrazine or hydrazide group and a protein reactive group. The hydrazine or hydrazide group may be protected as a lower alkyl hydrazone. Conjugates of the bifunctional compounds with macromolecules are also described and labelled macromolecules comprised of the conjugates and metal ions are provided. Additionally, a method is provided for forming a labelled macromolecule by reacting a conjugate with a metal species. The compounds and method of this invention are particularly useful in the fields of biology and medicine for imaging and/or therapy.

Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

Abstract: Described is a rapidly curing adhesive formulation and a method of reducing the curing time of an adhesive formulation containing cyanate ester.

Abstract: This invention is a method for producing hydrocyanic acid by using an element which comprises a foraminous structure fabricated from a material consisting essentially of a metal selected from the group consisting of platinum, rhodium, palladium and alloys of mixtures thereof characterized by (a) a novel configuration whereby the initial product of the formula: curve the flat ratio (C/F) multiplied by mesh size (N) and wire diameter (d.sub.w), for said element is greater than at least about 0.08 and (b) where, for a given methane and ammonia throughput, the conversion efficiency is a function of the curve to flat ratio (C/F), wire diameter (d.sub.w) and mesh size (N) combination and conversion efficiency is improved by increasing the mesh size (N) for a given wire diameter, increasing the wire diameter (d.sub.w) for a given mesh size, and increasing the curve to flat ratio (C/F) to a ratio of above 1.0. Preferably the initial product of the formula is greater than 0.

Abstract: A sealing glass composition suitable for bonding ceramic surfaces at low temperatures and which includes in weight percent 5-50% thallium oxide, 10-40% vanadium oxide, 5-30% tellurium oxide, 1.5-15% arsenic oxide and 1-5% phosphorous oxide. Other additives may be included, such as bismuth oxide. A paste formulated from said glass and a filler for the purpose of adjusting the fluidity and/or dielectric constant of the paste.

Abstract: This invention is a catalytic element for use in the catalytic oxidation of ammonia. The element comprises a foraminous structure fabricated from a material consisting essentially of a metal selected from the group consisting of platinum, rhodium, palladium and alloys of mixtures thereof characterized by (a) a novel configuration whereby the initial product of the formula: curve to the flat ratio (C/F) multiplied by mesh count in inches (N) and wire diameter (d.sub.W), for said element is at least about 0.08 and (b) where, for a given hydrogen throughput, the conversion efficiency is a function of the curve to flat ratio (C/F), wire diameter (d.sub.W) and mesh count (N) combination and conversion efficiency is improved by increasing the mesh count (N) for a given wire diameter, increasing the wire diameter (d.sub.W) for a given mesh count, and increasing the curve to flat ratio (C/F) to a ratio of above 1.0. Preferably the initial product of the formula is greater than 0.2, more preferably 0.

Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

Abstract: A Pt(IV) complex of the formula ##STR1## wherein A and A' are NH.sub.3 or an amino group; R and R.sup.1 are hydrogen, alkyl, alkenyl, aryl, aralkyl, alkylamino or alkoxy or functionalized derivatives thereof; and X is halogen or alkyl mono- or dicarboxylate. The complexes have high antitumor activity, particularly when administered orally.

Abstract: A silver-glass paste comprising silver flake, lead vanadium telluride glass, resin, surfactant and a mixture of solvents, said mixture comprising at least two solvents selected from the group consisting of glycol ether, isoparaffin, and terpineol, each of said solvents having a boiling point of from about 170.degree. C. to about 230.degree. C. and a surface tension of from about 20 to about 30 dynes/cm.sup.2.

Abstract: Bifunctional aromatic compounds which are capable of linking metal ions to biologically useful molecules. The bifunctional compounds are characterized as having a hydrazine or hydrazide group and a protein reactive group. The hydrazine or hydrazide group may be protected as a lower alkyl hydrazone. Conjugates of the bifunctional compounds with macromolecules are also described and labelled macromolecules comprised of the conjugates and metal ions are provided. Additionally, a method is provided for forming a labelled macromolecule by reacting a conjugate with a metal species The compounds and method of this invention are particularly useful in the fields of biology and medicine for imaging and/or therapy.

Abstract: A coated, embrittlement resistant optical fiber thermometer fiber is disclosed, which can be a sapphire or silica fiber with a metallic coating which prevents the fiber from becoming brittle at high temperature, and enhances transmission of radiation through the fiber. The coating can be applied over a thin "conductive" film attached to the fiber exterior using vacuum metallization, sputtering, or organo-metallic deposition. The coating may comprise pure platinum electroplated over a thin conductive film. The fiber may include a first end terminating in a blackbody radiator in a furnace and a second end terminating at a receptor apparatus. A coated fiber of the present invention provides a hermetic seal around the fiber to prevent its exposure to hydroxyl ions in the atmosphere. Fibers of the invention will remain flexible even after exposure to temperatures well over 1000 degrees Centigrade. The coating also prevents unwanted external radiation from entering the fiber.

Abstract: A (+)-charged dye transition metal complex, particularly a complex of platinum and a (+)-charged dye such as rhodamine 123. These products demonstrate antitumor and radio-sensitizing activity.

Abstract: Described is a method of reducing the moisture content in a hermetic package containing a semiconductor device by including a small amount of cyanate ester within the package.