Abstract: A floating or compliant plate test socket device and method is disclosed. Three primary components, a fixed frame (20) receives a floating or compliant plate (22), sit together atop a housing (24) which contains contact pins used for the electrical test of the DUT (device under test). In fixed plate (20) are bearings for reducing friction when the floating plate is driven downward by the DUT inserter. Embedded in sidewalls (40) are a plurality of vertical raceways (46) which receive bearings (48). The raceways are borings, which have gap in the boring, in the fixed plate sidewalls (40) with the boring center spaced from the sidewall sufficiently that part of the bore removes part of the sidewall but allows the ball bearings to partially protrude from the gap formed in the incomplete semicircular boarding without the bearings being able to freely escape.

Abstract: Terminals of a device under test are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact partially or completely laterally surrounds the force contact, so that it need not have its own resiliency. The sense contact has a forked end with prongs that extend to opposite sides of the force contact. Alternatively, the sense contact surrounds the force contact and slides laterally to match a lateral translation component of a lateral cross-section of the force contact during longitudinal compression of the force contact. Alternatively, the sense contact includes rods that have ends on opposite sides of the force contact, and extend parallel.

Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board including a rocker base protrusion, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

Abstract: Terminals (2, 502) of a device under test (DUT) are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact (770) partially or completely laterally surrounds the force contact (700). In order to increase the contact surface, the force contact, in a spring pin (700) configuration contacts the device under test terminal at that portion of the lead which is curved or angled, rather than orthogonal to the pin.

Abstract: In a first slot of a plurality of adjacent slots in alignment with traces on a load board of a tester, first and second conductor layers, each to make electrical contact with both a load board trace and a DUT lead. Each of the first and second contacts receives force from a resilient element extending across the slots and that urges a contact point on the contact against at least one trace and a DUT lead. Insulation between said first and second contacts in the first slot electrically insulates the first and second contacts from each other within the first slot.

Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.

Abstract: A floating or compliant plate test socket device and method is disclosed. Three primary components, a fixed frame 20 receives a floating or compliant plate 22, sit together atop a housing 24 which contains contact pins used for the electrical test of the DUT (device under test). In fixed plate 20 are bearings for reducing friction when the floating plate is driven downward by the DUT inserter. Embedded in sidewalls 40 are a plurality of vertical raceways 46 which receive bearings 48. The raceways are borings, which have gap in the boring, in the fixed plate sidewalls 40 with the boring center spaced from the sidewall sufficiently that part of the bore removes part of the sidewall but allows the ball bearings to partially protrude from the gap formed in the incomplete semicircular boarding without the bearings being able to freely escape.

Abstract: A test fixture (120) is disclosed for electrically testing a device under test (130) by forming a plurality of temporary mechanical and electrical connections between terminals (131) on the device under test (130) and contact pads (161) on the load board (160). The test fixture (120) has a replaceable membrane (150) that includes vias (151), with each via (151) being associated with a terminal (131) on the device under test (130) and a contact pad (161) on the load board (160). In some cases, each via (151) has an electrically conducting wall for conducting current between the terminal (131) and the contact pad (161). In some cases, each via (151) includes a spring (152) that provides a mechanical resisting force to the terminal (131) when the device under test (130) is engaged with the test fixture (120).

Abstract: Terminals (2, 502) of a device under test (DUT) are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact (770) partially or completely laterally surrounds the force contact (700). In order to increase the contact surface, the force contact, in a spring pin (700) configuration contacts the device under test terminal at that portion of the lead which is curved or angled, rather than orthogonal to the pin.

Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface.

Abstract: A system for testing a microcircuit having a center ground (CG) terminal has an insert for electrically connecting the CG terminal to a ground contact on a load board. The insert is held within a housing by compression and frictional interaction between a resilient projection carried by the insert and a slot in a wall of an aperture holding the insert.

Abstract: A contact for use in a contact set assembly. The contact spans a space which separates a lead of an integrated circuit to be tested and a pad of a load board interfacing with the tester. The contact construction provides electrical communication between integrated circuit lead and the load board pad. Included is an insulating lamina which comprises, in part, a contact. A conductive lamina overlies at least a portion of the insulating lamina. The laminar construction and size and shape of conductive traces applied to a ceramic lamina enable parameters of the contact to be provided.

Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the contact is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested.

Abstract: An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with traces on a load board. Mounting is accomplished by means of a pair of elastomers, and the elastomers maintain each contact such that, when the front end of a contact is engaged by the lead or pad of the device to be tested and urged into its corresponding slot, an arcuate surface at a rear end of each contact rolls across its corresponding trace with virtually no translational or rotational sliding.

Abstract: A contact test set for use in testing integrated circuits. The set includes a housing having oppositely-facing surfaces and one or more slots extending through the housing between the surfaces. A first surface, during use of the test set, is approached by an integrated circuit to be tested, and a second surface is proximate the load board at a test site. A contact is received in a slot, each contact having a first end engagable by a lead of the integrated circuit device. A second end of each contact is in engagement with a corresponding terminal. Each contact is movable between a first orientation, unengaged by a corresponding lead of an IC and a second orientation in which the IC is engaged by the corresponding lead of an IC and urged into its slot. An elastomer biases the contact to its first orientation. The contact, when moved between its first and second orientations, does not slide across a terminal of the load board.

Abstract: A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.

Abstract: An actuator for pressing a plurality of circuit contacts carried on a microcircuit package against a plurality of test contacts has a frame having a top surface and a bottom surface facing away from the top surface. The frame has first and second end slots each intersecting the top surface at opposite ends thereof. A loader foot is carried by the frame's bottom surface for applying force to a microcircuit. First and second latch elements, each respectively mounted within the frame's first and second end slots are each shiftable between a latched position and an unlatched position within the frame's first and second slots, each said latch element when in the latched position for gripping an edge of an alignment plate and when in the unlatched position for releasing the alignment plate. An actuator element mounted on the frame's top surface receives manual force and converts the received manual force to force applied to the latch elements to shift the latch elements between the latched and unlatched positions.

Abstract: A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.