Abstract: A contact test set for use in testing integrated circuits. The set includes a housing having oppositely-facing surfaces and one or more slots extending through the housing between the surfaces. A first surface, during use of the test set, is approached by an integrated circuit to be tested, and a second surface is proximate the load board at a test site. A contact is received in a slot, each contact having a first end engagable by a lead of the integrated circuit device. A second end of each contact is in engagement with a corresponding terminal. Each contact is movable between a first orientation, unengaged by a corresponding lead of an IC and a second orientation in which the IC is engaged by the corresponding lead of an IC and urged into its slot. An elastomer biases the contact to its first orientation. The contact, when moved between its first and second orientations, does not slide across a terminal of the load board.

Abstract: An interface apparatus for reception and delivery of a package from a first location to a second location. The apparatus comprises a nest assembly having an interior defining a nest for receiving a package. The nest is formed by a plurality of sidewalls each having an interior surface, an exterior surface, and an end surface extending between the interior and exterior surfaces. In one embodiment, the interface between the interior surface and the end surface is constructed and arranged having at least a portion of the interface surface substantially conforming to the shape of the angled portion of the leads.

Abstract: An actuator for use in an IC package test fixture has a base element and a float. The float is attached to the base element with a gimbaled mount. At least one resilient element such as a compression spring biases the float away from the base element and against a retainer. The float has a presser surface for pressing against an IC package surface opposite the IC package contacts, to thereby force the contacts of the IC package against test contacts. The float's gimbaled mount in one embodiment provides up to two rotational degrees of freedom and one translational degree of freedom in the motion of the float. The resilient element provides a predetermined preload force at the presser surface.

Abstract: A grounding assembly for testing which can be readily changed is provided by an insert which is retained within an opening in a test socket. Flexible projections from the socket fit within grooves in the insert to provide the retention means. The insert is positioned within an opening in the socket adjacent to an opening containing a device under test (DUT). The insert is also between the DUT and a test board, and has contacts arranged such they connect ground contacts on the DUT to opposing contacts on the test board. The insert can provide different numbers, arrangements, and types of contacts as well as different materials for both the contact and contact body by merely changing the insert.

Abstract: An assembly contained within a housing slideably connects device leads to apparatus terminals with predetermined forces. Parallel slots through the housing contain “S” shaped rotatable contacts. The connection force is obtained by compressing two elastomeric members extending through holes perpendicular to the slots and opposite to the contact ends by rotating the contacts. The leads and terminals are opposite and parallel to opposite ends of the contacts, and their connection is provided by this contact rotation. The contact rotations are provided by the nose ends of the contacts extending outward slightly from the slots such that, when the device under test is pressed against the housing, the contacts will be forced within the housing to rotate the contacts and compress the elastomeric members. This provides both a sliding and predetermined force electrical connection between the leads, terminals and contacts.

Abstract: The present invention includes an interconnect contact and system. The contact generally includes a first contact element, a second contact element, and a biasing member. The first contact element has a contacting surface and an engagement surface. The second contact element has a contacting surface and an engagement surface. The engagement surfaces of the elements are generally constructed to contact each other. The biasing member provides a mechanism to move at least one element of the contact.

Abstract: An interface apparatus for reception and delivery of a package from a first location to a second location. The apparatus comprises a nest assembly having an interior defining a nest for receiving a package. The nest is formed by a plurality of sidewalls each having an interior surface, an exterior surface, and an end surface extending between the interior and exterior surfaces. In one embodiment, the interface between the interior surface and the end surface is constructed and arranged having at least a portion of the interface surface substantially conforming to the shape of the angled portion of the leads.

Abstract: An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the “distorting” nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may “process” the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

Abstract: An actuator for use in an IC package test fixture has a base element and a float. The float is attached to the base element with a gimbaled mount. At least one resilient element such as a compression spring biases the float away from the base element and against a retainer. The float has a presser surface for pressing against an IC package surface opposite the IC package contacts, to thereby force the contacts of the IC package against test contacts. The float's gimbaled mount in one embodiment provides up to two rotational degrees of freedom and one translational degree of freedom in the motion of the float. The resilient element provides a predetermined preload force at the presser surface.

Abstract: An improvement to contacts for automatic test apparatus used in the testing of semiconductors. At least two contacts with first and second ends for engaging test points of a device under test (DUT) extend the first end different distances toward the DUT. The test apparatus is arranged to support and carry a DUT at a predetermined rate toward the two contacts. The contact with the greatest first end extension, which contacts the DUT first, has the second end connected to ground and the other contact has the second end connected to a test voltage. Each first and second end of said contacts have support means arranged to permit the ends to deflect a predetermined distance under a predetermined force. This permits the apparatus to engage both ends of both contacts at predetermined contact forces. A plurality of sets of contacts with a given extension and/or a plurality of different extensions for sets of contacts can also be used.

Abstract: A high performance electromechanical device which improves electrical continuity between a device under test (DUT) and a socket (or contactor), ideally suited for, but not limited to, automated semiconductor test. An ultrasonic transducer is incorporated into the test set-up such that its ultrasonic energy is coupled either into the DUT and thereby into the contacts of the socket or is coupled into the contacts of the socket and thereby into the leads (or equivalent I/O) of the DUT. This coupled ultrasonic energy generates a high frequency mechanical wipe action of microscopic amplitude between the contacting surfaces, thereby displacing oxides and other debris from the contact site. This enhances electrical continuity by reducing apparent contact resistance and by reducing the apparent contact resistance force rate. This high frequency/low amplitude mechanical wipe action can be varied and controlled to yield an effective wipe which is from 10 times to 100,000 times greater than the current state of the art.

Abstract: An interconnection device for interconnecting a number of first terminals to a number of second terminals. The interconnection device includes a conductive housing and a number of contacts that are insulated from the conductive housing. This configuration may provide shielding to the number of contacts from outside sources of electro-magnetic interference. Further, a number of conductive ribs may be provided between adjacent contacts, thereby shielding the contacts from cross-talk interference between adjacent contacts. Finally, the impedance of each contact in the interconnection device may be controlled to provide a stable bandpass, and may be programmable to match, or correct for, the input impedance of a corresponding device.

Abstract: An insert for use within integrated circuit (IC) chip carriers to provide universality across device types and applications at a low design and fabrication cost. The present invention functions as a generic carrier floor and/or adaptor insert which enables reception of both quad-flat-pack (QFP) and thin-quad-flat-pack (TQFP) ICs within frames of a variety of existing carriers, or alternatively, may allow both QFP and TQFP ICs to utilize a single IC carrier frame, a feature which currently prevailing embodiments would require two unique IC carriers.

Abstract: An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the "distorting" nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may "process" the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

Abstract: An electrical connector that uses an elastomeric element to provide a short path, high performance, electrical interconnection that is mechanically stable and reliable. In accordance with the present invention, lateral movement of the contacts is controlled by providing contact receiving slots formed in a rigid housing and/or an alignment plate. Movement of the contacts during actuation is controlled, at least in part, by specifying the compression properties of an elastomeric element, providing a contact stop portion in the housing, and/or providing a pre-load between the contacts and the corresponding printed circuit board terminals. Because the movement of the contacts is controlled, the wiping action between the contacts and the device leads and/or the printed circuit board pads is also controlled, resulting in a more reliable contacting system.

Abstract: Apparatus for use in testing a semiconductor device located on a wafer. The apparatus includes a wafer body. A device contact region is located on the wafer body. Further, an active component region is coupled to the device contact region. A mechanism is provided for coupling the active component region to a remote testing device. The active component region may include test signal conditioning circuits and device testing circuits. The active component region may be formed integral the wafer body by silicon wafer processing techniques, such as silicon doping.

Abstract: An interconnecting device for electrically interconnecting a number of device terminals to a number of board terminals. The interconnecting device includes a housing which has a number of contact receiving slots wherein each slot receives one of a number of contacts. A shielding layer is provided to enhance noise immunity by shielding each contact against electromagnetic interference (EMI). The shielding layer absorbs stray radiated EMI from each one of the number of contacts and dissipates the absorbed energy as thermal energy.

Abstract: A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus may include a contact engagable by the lead and further engagable by the spaced terminal. An elastomeric element is provided to bias the contact in an original position. As the contact is engaged by the lead, the elastomeric element may deform to permit movement of the contact. It is contemplated that the elastomeric element may be shaped, relative to the contact, to provide at least one spatial relief region between the elastomeric element and the contact. Further, it is contemplated that the elastomeric element may have one or more cavities formed therein to provide at least one spatial relief region. Finally, it is contemplated that the contact housing may be designed to provide at least one spatial relief region adjacent the elastomeric element.

Abstract: A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus includes a conductive element comprising a first contact, a shoulder, and a second contact. The first contact is attached to the shoulder and extends upward therefrom, and the second contact is attached to the shoulder and extends downward therefrom. The first contact is electrically coupled to the lead of the device when the lead of the device is brought into engagement with the first contact. The second contact is electrically coupled to the terminal. A support member is positioned below the shoulder of the conductive element and an elastomeric material is positioned between the shoulder of the conductive element and the support member. The elastomeric material resiliently biases the conductive element in an original position.

Abstract: A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus includes a conductive element comprising a first contact, a shoulder, and a second contact. The first contact is attached to the shoulder and extends upward therefrom, and the second contact is attached to the shoulder and extends downward therefrom. The first contact is electrically coupled to the lead of the device when the lead of the device is brought into engagement with the first contact. The second contact is electrically coupled to the terminal. A support member is positioned below the shoulder of the conductive element and a resilient biasing means comprising an elastomeric material is positioned between the shoulder of the conductive element and the support member. The resilient biasing means resiliently biases the conductive element in an original position.