Patents Assigned to JSR Corporation
  • Patent number: 8795954
    Abstract: A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed using a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer and a radiation-sensitive acid generator. The polymer has a weight average molecular weight in terms of the polystyrene equivalent of greater than 6,000 and includes a first structural unit that includes an acid-labile group. The polymer includes less than 5 mol % or 0 mol % of a second structural unit that includes a hydroxyl group.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: August 5, 2014
    Assignee: JSR Corporation
    Inventors: Hirokazu Sakakibara, Taiichi Furukawa, Reiko Kimura, Masafumi Hori
  • Patent number: 8791020
    Abstract: A pattern-forming method includes forming a silicon-containing film on a substrate, the silicon-containing film having a mass ratio of silicon atoms to carbon atoms of 2 to 12. A shape transfer target layer is formed on the silicon-containing film. A fine pattern is transferred to the shape transfer target layer using a stamper that has a fine pattern to form a resist pattern. The silicon-containing film and the substrate are dry-etched using the resist pattern as a mask to form a pattern on the substrate in nanoimprint lithography. According to another aspect of the invention, a silicon-containing film includes silicon atoms and carbon atoms. A mass ratio of silicon atoms to carbon atoms is 2 to 12. The silicon-containing film is used for a pattern-forming method employed in nanoimprint lithography.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: July 29, 2014
    Assignee: JSR Corporation
    Inventors: Takashi Mori, Masato Tanaka, Yukio Nishimura, Yoshikazu Yamaguchi
  • Patent number: 8771923
    Abstract: A radiation-sensitive composition includes a low-molecular-weight compound, a solvent and a radiation-sensitive acid-generator other than the low-molecular-weight compound. The low-molecular-weight compound has one or more acid-dissociable groups which decompose by an action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon application of an active ray or radiation per molecule. The low-molecular-weight compound has a polystyrene-reduced number-average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 500 to 4,000. The low-molecular-weight compound is not obtained from chain growth polymerization of a monomer with an unsaturated bond. A content of the low-molecular-weight compound is 80 mass % or more of 100 mass % of a total solid component of the radiation-sensitive composition. The low-molecular-weight compound is a compound shown by a following formula (1).
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: July 8, 2014
    Assignee: JSR Corporation
    Inventors: Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai
  • Patent number: 8765355
    Abstract: A radiation sensitive resin composition includes a first polymer having a group represented by a following formula (1), and a radiation sensitive acid generator. n is an integer of 2 to 4. X represents a single bond or a bivalent organic group. A represents a (n+1) valent linking group. Each Q independently represents a group that includes an alkali-dissociable group.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: July 1, 2014
    Assignee: JSR Corporation
    Inventors: Takakazu Kimoto, Mitsuo Sato, Yusuke Asano, Tomohiro Kakizawa
  • Patent number: 8758978
    Abstract: A radiation-sensitive resin composition includes a first polymer, a second polymer and a radiation-sensitive acid generator. The first polymer includes a repeating unit (I) shown by the following general formula (1), a fluorine atom in a molecule of the first polymer. The second a polymer includes an acid-labile group, and is insoluble or scarcely soluble in an alkali. R1 represents a hydrogen atom or the like, each of X1 and R2 represents a single bond or the like, R3 represents a hydrogen atom or the like, and R4 represents an acid-labile group.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: June 24, 2014
    Assignee: JSR Corporation
    Inventors: Mitsuo Satou, Tomohiro Kakizawa
  • Patent number: 8748650
    Abstract: A method for production of an N-carboxy amino acid anhydride with efficiency is provided. The method for production of an N-carboxy amino acid anhydride includes a step of reaction of an amino acid organic salt compound with a carbonic acid diester.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: June 10, 2014
    Assignee: JSR Corporation
    Inventors: Takeshi Endo, Koichi Koga, Atsushi Sudo
  • Patent number: 8741008
    Abstract: A chemical mechanical polishing aqueous dispersion includes (A) a graft polymer that includes an anionic functional group in a trunk polymer, and (B) abrasive grains.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: June 3, 2014
    Assignee: JSR Corporation
    Inventors: Masayuki Motonari, Eiichirou Kunitani, Tomikazu Ueno, Takahiro Iijima, Takashi Matsuda
  • Publication number: 20140145126
    Abstract: A photosensitive composition, suitable for a hardened film capable of sufficiently blocking light in the visible range and sufficiently transmitting light in the near infrared region, is provided. The photosensitive composition contains a colorant, a compound having an ethylenic unsaturated group, a photopolymerization initiator and a solvent. The colorant contains (A1) to (A3); (A1) a colorant of the following formula (1): (A2) a blue colorant, a green colorant, or both, and (A3) a yellow colorant, a red colorant, or both. R1 and R2 is a hydrogen atom, a hydroxyl group, a methoxy group or an acetyl group. R3 and R4 is a phenylene group or a direct bond. R5 and R6 is a direct bond or an alkanediyl group having 1 to 10 carbon atoms, with the proviso that R3 and R5 are not simultaneously direct bonds, and R4 and R6 are not simultaneously direct bonds.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 29, 2014
    Applicant: JSR Corporation
    Inventors: Yuuki SUEMITSU, Mibuko SHIMADA, Yuusuke MURATA
  • Patent number: 8734904
    Abstract: Methods are disclosed for forming topographical features. In one method, a pre-patterned structure is provided which comprises i) a support member having a surface and ii) an element for topographically guiding segregation of a polymer mixture including a first polymer and a second polymer, the element comprising a feature having a sidewall adjoined to the surface. The polymer mixture is disposed on the pre-patterned structure, wherein the disposed polymer mixture has contact with the sidewall and the surface. The first polymer and the second polymer are segregated in a plane parallel to the surface, thereby forming a segregated structure comprising a first polymer domain and a second polymer domain.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: May 27, 2014
    Assignees: International Business Machines Corporation, JSR Corporation
    Inventors: Joy Cheng, Hayato Namai, Charles Thomas Rettner, Daniel Paul Sanders, Ratnam Sooriyakumaran
  • Patent number: 8728706
    Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” indicates a bonding hand bonded to R1.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: May 20, 2014
    Assignee: JSR Corporation
    Inventors: Yuusuke Asano, Mitsuo Satou, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
  • Patent number: 8729219
    Abstract: A polyarylene block copolymer can provide a solid polymer electrolyte and proton conductive membrane having high proton conductivity, high dimensional stability, and high mechanical strength. The polyarylene block copolymer also has reduced swelling in hot water and reduced shrinkage in drying. The polyarylene block copolymer includes a polymer segment having a sulfonic acid group, and a polymer segment having substantially no sulfonic acid group.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: May 20, 2014
    Assignee: JSR Corporation
    Inventors: Yoshitaka Yamakawa, Toshiaki Kadota, Takuya Murakami, Yuuji Tsunoda
  • Publication number: 20140134544
    Abstract: A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.
    Type: Application
    Filed: January 17, 2014
    Publication date: May 15, 2014
    Applicant: JSR Corporation
    Inventors: Yusuke ANNO, Takashi MORI, Hirokazu SAKAKIBARA, Taiichi FURUKAWA, Kazunori TAKANASHI, Hiromitsu TANAKA, Shin-ya MINEGISHI
  • Patent number: 8722306
    Abstract: A radiation-sensitive resin composition includes a resin (A1) that includes a repeating unit shown by the following formula (1-1) and a repeating unit shown by the following formula (1-2), and a radiation-sensitive acid generator (B). The radiation-sensitive resin composition exhibits excellent sensitivity, and can reduce a mask error factor (MEEF). wherein R1, R2, and R3 individually represent a linear or branched alkyl group having 1 to 4 carbon atoms, R4 represents a hydrogen atom, a linear or branched alkyl group having 2 to 4 carbon atoms, a linear or branched fluoroalkyl group having 1 to 4 carbon atoms, or a linear or branched alkoxy group having 1 to 4 carbon atoms, and q represents an integer from 0 to 3.
    Type: Grant
    Filed: May 26, 2008
    Date of Patent: May 13, 2014
    Assignee: JSR Corporation
    Inventors: Hirokazu Sakakibara, Makoto Shimizu, Takehiko Naruoka, Tomoki Nagai, Yoshifumi Oizumi
  • Patent number: 8715901
    Abstract: A resin composition which, in forming a fine pattern by a heat treatment of a resist pattern formed by using a photoresist, can be applied onto the resist pattern, can cause the resist pattern to smoothly shrink by heat treatment, and can be easily washed away by a treatment with an alkaline aqueous solution, and a method for efficiently forming a fine resist pattern using the resin composition are provided. The resin composition comprises a resin containing a hydroxyl group, a crosslinking component, and an alcohol solvent containing water in an amount of 10 wt % or less for the total solvent, wherein the alcohol in the alcohol solvent is a monovalent alcohol having 1 to 8 carbon atoms.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: May 6, 2014
    Assignee: JSR Corporation
    Inventors: Hirokazu Sakakibara, Takayoshi Abe, Takashi Chiba, Toru Kimura
  • Patent number: 8715916
    Abstract: A pattern-forming method includes forming a resist underlayer film on a substrate using a resist underlayer film-forming composition. The resist underlayer film-forming composition includes a base component, and a crosslinking agent. The crosslinking agent has a partial structure represented by a following general formula (i). X represents an oxygen atom, a sulfur atom, or —NR—. R represents a hydrogen atom, an alkyl group having 1 to 9 carbon atoms, or an aryl group having 6 to 30 carbon atoms. n1 is an integer from 1 to 6. R1 represents a hydrogen atom, an alkyl group having 1 to 9 carbon atoms, or an aryl group having 6 to 30 carbon atoms.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: May 6, 2014
    Assignee: JSR Corporation
    Inventors: Shin-ya Minegishi, Shin-ya Nakafuji, Takanori Nakano
  • Patent number: 8709652
    Abstract: An electrode binder composition is used to produce an electrode used for an electrical storage device, and includes (A) a polymer, (B) a compound represented by the following general formula (1), and (C) a liquid medium, the polymer (A) being fluorine-containing polymer particles or diene polymer particles, and a concentration of the compound (B) in the electrode binder composition being 5 to 500 ppm. wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, or a monovalent alkyl group, and n is an integer from 0 to 5.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: April 29, 2014
    Assignee: JSR Corporation
    Inventors: Maki Maegawa, Tatsuaki Honda, Tatsuya Abe, Hiroyuki Miyauchi
  • Patent number: 8703395
    Abstract: A pattern-forming method includes applying a photoresist composition to a substrate to form a resist film. The photoresist composition includes an acid generator and a first polymer that includes an acid-dissociable group. The resist film is exposed. The resist film is developed using a developer having an organic solvent content of 80 mass % or more to form a prepattern of the resist film. A polymer film having a phase separation structure in a space defined by the prepattern is formed using a composition that includes a plurality of second polymers. A part of the phase separation structure of the polymer film is removed.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: April 22, 2014
    Assignee: JSR Corporation
    Inventors: Hayato Namai, Hiroki Nakagawa, Kentaro Harada, Takehiko Naruoka
  • Patent number: 8703401
    Abstract: A pattern-forming method includes forming a resist film on a substrate using a photoresist composition, exposing the resist film, and developing the exposed resist film using a negative developer that includes an organic solvent. The photoresist composition includes (A) a polymer that includes a structural unit (I) including an acid-labile group that dissociates due to an acid, the solubility of the polymer in the developer decreasing upon dissociation of the acid-labile group, and (B) a photoacid generator. The developer includes a nitrogen-containing compound.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: April 22, 2014
    Assignee: JSR Corporation
    Inventors: Taiichi Furukawa, Hirokazu Sakakibara
  • Patent number: 8703289
    Abstract: The organic polymer particles comprise a carboxyl group and 2,3-dihydroxypropyl group, and the magnetic particles for diagnostics comprise fine magnetic material particles and a polymer part containing a hydrophilic polymer part and a crosslinked polymer part, a dry coating film obtained from a water dispersion thereof having a contact angle with water of 5° to 60°. The process for producing the carboxyl group-containing particles comprises a step of producing an ester bond by reacting a hydroxyl group in organic polymer particles having the hydroxyl group with a carboxylic anhydride. The organic polymer particles comprise a hydroxyl group originating from a 2,3-dihydroxypropyl group and a polyoxyethylene group.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: April 22, 2014
    Assignee: JSR Corporation
    Inventors: Kouji Tamori, Tetsuo Fukuta, Mitsuhiro Murata, Masaru Ueno, Satoshi Katayose, Eiji Takamoto, Kiyoshi Kasai
  • Patent number: 8697335
    Abstract: A radiation-sensitive resin composition includes a compound, a resin and a radiation-sensitive acid generator. The compound has a structure in which a group represented by a following formula (1) is bound to a nitrogen atom. The resin has an acid-dissociative dissolution-controlling group and has a property such that alkali solubility of the resin increases by an action of an acid. In the formula (1), Y is a monovalent group having 5 to 20 carbon atoms, and “*” represents a bonding hand with the nitrogen atom. In the formula (i), R1, R2 and R3 each independently represent a linear or branched alkyl group having 1 to 4 carbon atoms or a monovalent alicyclic hydrocarbon group having 4 to 12 carbon atoms, or R1 and R2 are linked with each other to form a bivalent alicyclic hydrocarbon group, and “*” represents a bonding hand with the oxygen atom.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: April 15, 2014
    Assignee: JSR Corporation
    Inventors: Kazuo Nakahara, Mitsuo Sato