Abstract: There are provided an ultrasonic cleaning apparatus and an ultrasonic cleaning method capable of suppressing occurrence of damage on a substrate to be cleaned and capable of performing cleaning at a high cleaning level for highly precise substrates and the like used in an electronics industry. Occurrence of damage on the substrate to be cleaned is suppressed by holding an object to be cleaned so as to be positioned out of a region where perpendiculars extend from an oscillating surface of an ultrasonic transducer to a liquid surface (an ultrasonic-irradiated region) under and in the vicinity of the liquid surface of a cleaning solution, exciting a capillary wave on a surface of the cleaning solution by an ultrasonic wave, and separating particulate contamination of the object to be cleaned by an acoustic pressure generated by the capillary wave without irradiating the object to be cleaned directly with the ultrasonic wave.

Abstract: To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.

Abstract: An ultrasonic cleaning apparatus and an ultrasonic cleaning method for an edge face of a substrate help prevent re-contamination caused by splashing or the like of ultrasonic wave propagating water sprayed onto an edge face of an object to be cleaned. An ultrasonic wave transmitting tube provided to continue from the spot shower and configured to transmit and spray the ultrasonic wave propagating water to the substrate is provided, the ultrasonic wave transmitting tube is installed so as not to be positioned on the substrate, the substrate is retained so that the surface of the substrate assumes a horizontal state, and ultrasonic wave propagating water is sprayed to the edge face, which constitutes an outer periphery of the substrate arranged in a space from the ultrasonic wave transmitting tube in a direction of tangent line of the edge face while rotating the substrate by a rotatable rotation retaining portion.

Abstract: A driving mechanism including a first rod (103a), a second rod (104a), a first planar motor (106) moving on a plane, a center planar motor (105) moving on the plane and a moving portion (101), in which one end of the first rod is rotatably connected to the moving portion by a first rotation fulcrum (125a), the other end of the first rod is rotatably connected to the first planar motor by a second rotation fulcrum (126a), one end of the second rod is rotatably connected by a third rotation fulcrum (128a) provided on the first rod. The other end of the second rod is rotatably connected to the center planar motor by a fourth rotation fulcrum (127a), and the moving portion is moved so as to recede from the center planar motor when the first planar motor is moved near to the center planar motor.

Abstract: An ultrasonic cleaning apparatus includes: an ultrasonic vibrator (11); a liquid storage part (12) provided in contact with the ultrasonic vibrator; an inflow port (12a) that makes a cleaning liquid (13) flow in the liquid storage part; and an outflow port (12b) that makes the cleaning liquid flow out of the liquid storage part. A contact surface (11a), of the ultrasonic vibrator, which comes into contact with the cleaning liquid, is disposed lower than each of the inflow port and the outflow port.

Abstract: [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.

Abstract: A driving mechanism including a first rod (103a), a second rod (104a), a first planar motor (106) moving on a plane, a center planar motor (105) moving on the plane and a moving portion (101), in which one end of the first rod is rotatably connected to the moving portion by a first rotation fulcrum (125a), the other end of the first rod is rotatably connected to the first planar motor by a second rotation fulcrum (126a), one end of the second rod is rotatably connected by a third rotation fulcrum (128a) provided on the first rod. The other end of the second rod is rotatably connected to the center planar motor by a fourth rotation fulcrum (127a), and the moving portion is moved so as to recede from the center planar motor when the first planar motor is moved near to the center planar motor.

Abstract: A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.

Abstract: An ultrasonic cleaning apparatus and an ultrasonic cleaning method for an edge face of a substrate help prevent re-contamination caused by splashing or the like of ultrasonic wave propagating water sprayed onto an edge face of an object to be cleaned. An ultrasonic wave transmitting tube provided to continue from the spot shower and configured to transmit and spray the ultrasonic wave propagating water to the substrate is provided, the ultrasonic wave transmitting tube is installed so as not to be positioned on the substrate, the substrate is retained so that the surface of the substrate assumes a horizontal state, and ultrasonic wave propagating water is sprayed to the edge face, which constitutes an outer periphery of the substrate arranged in a space from the ultrasonic wave transmitting tube in a direction of tangent line of the edge face while rotating the substrate by a rotatable rotation retaining portion.

Abstract: An ultrasonic cleaning device includes an ultrasonic transducer (13) for providing ultrasonic energy to a propagation liquid (15), an ultrasonic propagation tube (12) for flowing the propagation liquid provided with the ultrasonic energy by the ultrasonic transducer, a holding mechanism disposed below the ultrasonic propagation tube for holding an object to be cleaned (21), and a cleaning liquid supply mechanism for supplying a cleaning liquid to a cleaning surface of the object to be cleaned held by the holding mechanism. The ultrasonic propagation tube (12) is disposed so that a side surface thereof may contact a liquid film (19) of the cleaning liquid formed on the cleaning surface by supplying the cleaning liquid to the cleaning surface by the cleaning liquid supply mechanism.

Abstract: The invention provides an ultrasonic cleaning apparatus in which unevenness of sound pressure among a plurality of oscillating elements is solved by emitting uniform ultrasonic waves, the rate of removal of fine particles is improved, and the uneven cleaning is avoided. The ultrasonic cleaning apparatus includes a cleaning bath that stores an object to be cleaned and cleaning solvent; a plurality of oscillating elements attached to the cleaning bath; a plurality of oscillators connected respectively to the plurality of oscillating elements for exciting the plurality of oscillating elements; and a controller connected to the plurality of oscillators for controlling the plurality of oscillators to output signals having the same phase or substantially the same phase to the plurality of oscillating elements.

Abstract: A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.

Abstract: An ultrasonic generator is provided, in which the control system can easily be changed in accordance with a cleaning application and a cleaning process. The ultrasonic generator according to the present invention, which causes an ultrasonic transducer to oscillate a signal for ultrasonic vibration, includes a programmable multiple control circuit having a signal generation circuit for generating a signal, and an output adjustment circuit for adjusting the output of the signal from the programmable multiple control circuit, wherein the programmable multiple control circuit has a power control circuit electrically connected to the output adjustment circuit, a phase comparison circuit electrically connected to the output adjustment circuit, a frequency control circuit electrically connected to the phase comparison circuit, and a signal modulation circuit electrically connected to the frequency control circuit via the signal generation circuit.

Abstract: An object of the present invention is to provide a method for controlling microorganisms in food materials, by which bacterial groups that cause deterioration of the quality of food materials such as poultry and pathogenic microorganisms that cause food poisoning can be efficiently controlled. Specifically, the present invention relates to a method for controlling microorganisms in food materials, comprising a step of subjecting a food material immersed in a sterilizing solution to repeated treatment with negative pressure and ordinary pressure and/or a step of subjecting the food material immersed in the sterilizing solution to resonant ultrasonication.

Abstract: An ultrasonic transducer device component changes a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. The ultrasonic transducer device component includes a connection unit for use in applying ultrasonic transducer to cleaning fluid for cleaning objects, and for connection with a generator main body that generates an ultrasonic vibration signal; and a transducer connected to a connection unit. The connection unit includes an output transformer for adjusting an output of the ultrasonic vibration signal; a coil capacitor electrically connected to the output transformer; and a current detector electrically connected to the coil capacitor.

Abstract: Improvement of productivity and product quality is achieved by improving bonding properties and reducing adverse effects caused by heating by supplying heated gaseous matter or gas to a limited area and during a limited period required for bonding.

Abstract: An ultrasonic cleaning method of using ultrasonic vibrations to clean an object that is immersed in a cleaning liquid in a cleaning tank is provided. The method includes generating a frequency modulated signal including at least two frequency modulated portions having modulation widths different from each other with a single frequency as a center frequency, such that among the at least two frequency modulated portions a frequency modulated portion having a smaller modulation width is generated at a timing when a frequency modulated portion having a larger modulation width reaches the center frequency. The method further includes generating the ultrasonic vibrations based on the frequency modulated signal and transferring the ultrasonic vibrations to the cleaning tank to clean the object.

Abstract: To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.

Abstract: An ultrasonic transducer device component changes a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. The ultrasonic transducer device component includes a connection unit for use in applying ultrasonic transducer to cleaning fluid for cleaning objects, and for connection with a generator main body that generates an ultrasonic vibration signal; and a transducer connected to a connection unit. The connection unit includes an output transformer for adjusting an output of the ultrasonic vibration signal; a coil capacitor electrically connected to the output transformer; and a current detector electrically connected to the coil capacitor.

Abstract: There are provided an ultrasonic cleaning apparatus and an ultrasonic cleaning method capable of suppressing occurrence of damage on a substrate to be cleaned and capable of performing cleaning at a high cleaning level for highly precise substrates and the like used in an electronics industry. Occurrence of damage on the substrate to be cleaned is suppressed by holding an object to be cleaned so as to be positioned out of a region where perpendiculars extend from an oscillating surface of an ultrasonic transducer to a liquid surface (an ultrasonic-irradiated region) under and in the vicinity of the liquid surface of a cleaning solution, exciting a capillary wave on a surface of the cleaning solution by an ultrasonic wave, and separating particulate contamination of the object to be cleaned by an acoustic pressure generated by the capillary wave without irradiating the object to be cleaned directly with the ultrasonic wave.