Patents Assigned to Kaijo Corporation
  • Wire bonder with bonding arm angle sensor
    Patent number: 5180094
    Abstract: A wire bonder processes an angle sensor which detects, without making contact, the angle of rotation of a bonding arm provided so as to be allowed to freely oscillate centered on a shaft supported by a head base, and is able to easily determine the amount of movement of a bonding tool and a distance to a bonding stage.
    Type: Grant
    Filed: February 25, 1992
    Date of Patent: January 19, 1993
    Assignee: Kaijo Corporation
    Inventors: Katsuro Yanagida, Yoshikatsu Hayashizaki
  • Wire bonder and wire bonding method
    Patent number: 5156320
    Abstract: A wire bonder and wire bonding method where there is repeatedly calculated the dislocation dy of the end of a capillary, based on the oscillation an elevation angle of a bonding arm which performs oscillating motion, on the end of which said capillary is provided. As a result of controlling the driving of an XY table based on the dislocation dy, the position of the end of the capillary is successively corrected so that the end of said capillary is positioned on a straight line which connects a first bonding point and a second bonding point.
    Type: Grant
    Filed: February 25, 1992
    Date of Patent: October 20, 1992
    Assignee: Kaijo Corporation
    Inventor: Katsuro Yanagida