Patents Assigned to Kaijo Corporation
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Patent number: 8558431Abstract: An ultrasonic transducer device component changes a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. The ultrasonic transducer device component includes a connection unit for use in applying ultrasonic transducer to cleaning fluid for cleaning objects, and for connection with a generator main body that generates an ultrasonic vibration signal; and a transducer connected to a connection unit. The connection unit includes an output transformer for adjusting an output of the ultrasonic vibration signal; a coil capacitor electrically connected to the output transformer; and a current detector electrically connected to the coil capacitor.Type: GrantFiled: June 26, 2009Date of Patent: October 15, 2013Assignee: Kaijo CorporationInventors: Hiroshi Hasegawa, Takehiko Ishizuka, Satoshi Domon
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Publication number: 20130256385Abstract: To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.Type: ApplicationFiled: May 28, 2012Publication date: October 3, 2013Applicant: KAIJO CORPORATIONInventor: Akio Sugito
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Publication number: 20130220390Abstract: An ultrasonic cleaning device includes an ultrasonic transducer (13) for providing ultrasonic energy to a propagation liquid (15), an ultrasonic propagation tube (12) for flowing the propagation liquid provided with the ultrasonic energy by the ultrasonic transducer, a holding mechanism disposed below the ultrasonic propagation tube for holding an object to be cleaned (21), and a cleaning liquid supply mechanism for supplying a cleaning liquid to a cleaning surface of the object to be cleaned held by the holding mechanism, and the ultrasonic propagation tube (12) is disposed so that a side surface thereof may contact a liquid film (19) of the cleaning liquid formed on the cleaning surface by supplying the cleaning liquid to the cleaning surface by the cleaning liquid supply mechanism.Type: ApplicationFiled: April 4, 2013Publication date: August 29, 2013Applicant: KAIJO CORPORATIONInventor: KAIJO CORPORATION
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Patent number: 8448655Abstract: An ultrasonic cleaning device is provided which can easily cope with an increase in a diameter of a cleaning surface of an object to be cleaned. An ultrasonic cleaning device according to the present invention includes an ultrasonic transducer 13 for providing ultrasonic energy to a propagation liquid 15, an ultrasonic propagation tube 12 for flowing the propagation liquid provided with the ultrasonic energy by the ultrasonic transducer, a holding mechanism disposed below the ultrasonic propagation tube for holding an object to be cleaned 21, and a cleaning liquid supply mechanism for supplying a cleaning liquid to a cleaning surface of the object to be cleaned held by the holding mechanism, and the ultrasonic propagation tube 12 is disposed so that a side surface thereof may contact a liquid film 19 of the cleaning liquid formed on the cleaning surface by supplying the cleaning liquid to the cleaning surface by the cleaning liquid supply mechanism.Type: GrantFiled: August 19, 2009Date of Patent: May 28, 2013Assignee: Kaijo CorporationInventors: Kazunari Suzuki, Ki Han
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Publication number: 20130125935Abstract: An ultrasonic cleaning device including an ultrasonic transducer (13) for providing ultrasonic energy to a propagation liquid (15), an ultrasonic propagation tube (12) for flowing the propagation liquid provided with the ultrasonic energy by the ultrasonic transducer, a holding mechanism disposed below the ultrasonic propagation tube for holding an object to be cleaned (21), and a cleaning liquid supply mechanism for supplying a cleaning liquid to a cleaning surface of the object to be cleaned held by the holding mechanism, and the ultrasonic propagation tube (12) is disposed so that a side surface thereof may contact a liquid film (19) of the cleaning liquid formed on the cleaning surface by supplying the cleaning liquid to the cleaning surface by the cleaning liquid supply mechanism.Type: ApplicationFiled: December 3, 2012Publication date: May 23, 2013Applicant: KAIJO CORPORATIONInventor: KAIJO CORPORATION
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Publication number: 20130048013Abstract: An ultrasonic cleaning method of using ultrasonic vibrations to clean an object that is immersed in a cleaning liquid in a cleaning tank is provided. The method includes generating a frequency modulated signal including at least two frequency modulated portions having modulation widths different from each other with a single frequency as a center frequency, such that among the at least two frequency modulated portions a frequency modulated portion having a smaller modulation width is generated at a timing when a frequency modulated portion having a larger modulation width reaches the center frequency. The method further includes generating the ultrasonic vibrations based on the frequency modulated signal and transferring the ultrasonic vibrations to the cleaning tank to clean the object.Type: ApplicationFiled: October 26, 2012Publication date: February 28, 2013Applicant: Kaijo CorporationInventors: Hiroshi HASEGAWA, Tomoharu KAMAMURA, Yasuhiro IMAZEKI
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Publication number: 20120027898Abstract: An object of the present invention is to provide a method for controlling microorganisms in food materials, by which bacterial groups that cause deterioration of the quality of food materials such as poultry and pathogenic microorganisms that cause food poisoning can be efficiently controlled. Specifically, the present invention relates to a method for controlling microorganisms in food materials, comprising a step of subjecting a food material immersed in a sterilizing solution to repeated treatment with negative pressure and ordinary pressure and/or a step of subjecting the food material immersed in the sterilizing solution to resonant ultrasonication.Type: ApplicationFiled: March 18, 2011Publication date: February 2, 2012Applicants: KAIJO CORPORATION, UNIVERSITY OF MIYAZAKIInventors: Naoki Misawa, Junichiro Soejima, Katsuhiro Koyama
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Patent number: 8087418Abstract: A deaeration device for bubbling dissolved air in the cleaning liquid by cavitation is connected on a cleaning-liquid circulation path so as to bubble the dissolved air in the cleaning liquid flowing through the cleaning-liquid circulation path, and the bubbled dissolved air flows back to the cleaning tank together with the cleaning liquid so that the bubbled dissolved air is ejected from the liquid surface of the cleaning tank to the outside of the tank. Moreover, a propeller-type pump is used as the circulating pump, and the dissolved air concentration of the cleaning liquid is controlled within a range of 2.5 to 3.5 mg/l.Type: GrantFiled: April 13, 2010Date of Patent: January 3, 2012Assignee: Kaijo CorporationInventors: Kazuyuki Saiki, Masaru Hase, Katsuhiro Koyama, Katsutada Sakazaki
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Patent number: 8042725Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.Type: GrantFiled: April 22, 2010Date of Patent: October 25, 2011Assignee: Kaijo CorporationInventors: Toru Arahata, Shinobu Ishii, Hiromi Fujisawa
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Patent number: 8016182Abstract: A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.Type: GrantFiled: May 10, 2005Date of Patent: September 13, 2011Assignee: Kaijo CorporationInventors: Mizuho Shirato, Hiromi Fujisawa, Tadahisa Akita
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Patent number: 7975899Abstract: A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing an amount of antioxidant gas that is used are provided. The work clamp includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a lower opening portion 11a provided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion 11 provided above the interior hollow portion, for exposing the bonding area, a cavity 13 covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports 14a, 14b provided at the cavity, for introducing the antioxidant gas into the cavity, and holes 21 connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.Type: GrantFiled: March 10, 2007Date of Patent: July 12, 2011Assignee: Kaijo CorporationInventors: Riki Jindo, Hideki Yoshino, Mami Kushima
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Publication number: 20110079253Abstract: The invention provides an ultrasonic cleaning apparatus in which unevenness of sound pressure among a plurality of oscillating elements is solved by emitting uniform ultrasonic waves, the rate of removal of fine particles is improved, and the uneven cleaning is avoided. The ultrasonic cleaning apparatus includes a cleaning bath that stores an object to be cleaned and cleaning solvent; a plurality of oscillating elements attached to the cleaning bath; a plurality of oscillators connected respectively to the plurality of oscillating elements for exciting the plurality of oscillating elements; and a controller connected to the plurality of oscillators for controlling the plurality of oscillators to output signals having the same phase or substantially the same phase to the plurality of oscillating elements.Type: ApplicationFiled: September 10, 2007Publication date: April 7, 2011Applicant: Kaijo CorporationInventors: Hiroshi Hasegawa, Tomoharu Kamamura
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Patent number: 7899239Abstract: An inspection method of determining the bonded status of a wire ball bonded to a pad of a semiconductor chip is provided. An image of the bonding position between the pad and the ball is taken by an image-taking unit for detection of an in focus height of the pad, in focus height of an upper surface of the bonded ball, an external diameter of the bonded ball, and a ball bonded point respectively while switching a color of a coaxial illuminating light depending on the specific position for the inspection. Blue light can be used in the detection of the pad and an external diameter of the bonded ball while red or yellow light is used for detecting an upper surface of the bonded ball and the ball bonded point.Type: GrantFiled: September 28, 2005Date of Patent: March 1, 2011Assignee: Kaijo CorporationInventors: Kimiji Nishimaki, Noritaka Horiuchi
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Publication number: 20110030741Abstract: Provided is an ultrasonic transducer device component that can change a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. An ultrasonic transducer device component according to the present invention comprises: a connection unit 25 for use in applying ultrasonic transducer to cleaning fluid for cleaning objects to be cleaned, and for connection with a generator main body 24 that generates an ultrasonic vibration signal; and a transducer 26 connected to said connection unit, and said connection unit includes: an output transformer 33 for adjusting an output of said ultrasonic vibration signal; a coil capacitor 34 electrically connected to said output transformer; and a current detector 35 electrically connected to said coil capacitor.Type: ApplicationFiled: June 26, 2009Publication date: February 10, 2011Applicant: KAIJO CORPORATIONInventors: Hiroshi Hasegawa, Takehiko Ishizuka, Satoshi Domon
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Patent number: 7815095Abstract: A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to the ball and a major portion extending from the neck portion to the second bonding point. The neck portion includes a riser part which extends, from the bonded ball, obliquely upward in a direction toward the second bonding point, and the riser part is formed by a top portion of the ball which has entered an opening of a capillary and been shaped at the time of ball bonding. The riser part is formed by inclining the top portion of the ball, which enters the opening of the capillary at the time of ball bonding, which inclining is done by moving the capillary obliquely upward toward the second bonding point.Type: GrantFiled: January 4, 2006Date of Patent: October 19, 2010Assignee: Kaijo CorporationInventors: Hiromi Fujisawa, Masaru Ishibashi, Rei Imai
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Publication number: 20100206940Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.Type: ApplicationFiled: April 22, 2010Publication date: August 19, 2010Applicant: KAIJO CORPORATIONInventors: Toru Arahata, Shinobu Ishii, Hiromi Fujisawa
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Patent number: 7748599Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.Type: GrantFiled: November 3, 2008Date of Patent: July 6, 2010Assignee: Kaijo CorporationInventors: Toru Arahata, Shinobu Ishii, Hiromi Fujisawa
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Patent number: 7726325Abstract: A deaeration device for bubbling dissolved air in the cleaning liquid by cavitation is connected on a cleaning-liquid circulation path so as to bubble the dissolved air in the cleaning liquid flowing through the cleaning-liquid circulation path by the deaeration device, and the bubbled dissolved air flows back to the cleaning tank together with the cleaning liquid so that the bubbled dissolved air is ejected from the liquid surface of the cleaning tank to the outside of the tank. Moreover, a propeller-type pump is used as the circulating pump, and the dissolved air concentration of the cleaning liquid is controlled within a range of 2.5 to 3.5 mg/l.Type: GrantFiled: June 13, 2006Date of Patent: June 1, 2010Assignee: Kaijo CorporationInventors: Kazuyuki Saiki, Masaru Hase, Katsuhiro Koyama, Katsutada Sakazaki
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Publication number: 20100059574Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.Type: ApplicationFiled: November 3, 2008Publication date: March 11, 2010Applicant: KAIJO CORPORATIONInventors: Toru ARAHATA, Shinobu Ishii, Hiromi Fujisawa
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Patent number: 7422024Abstract: An ultrasonic shower cleaning apparatus is disclosed which is capable of efficiently cleaning both surfaces of an article and configured to have a reduced size enabling an installation space thereof to be decreased. A pair of ultrasonic shower cleaning mechanisms each include a nozzle, a disc-shaped ultrasonic transducer arranged so as to face a backward end of the nozzle and an inlet port for a cleaning liquid formed opposite to a side surface of the nozzle. The ultrasonic shower cleaning mechanisms are integrally incorporated in one casing in such a manner that axes of the nozzles cross each other at a predetermined angle. The casing is provided with one inlet branch port connected to the inlet ports of the ultrasonic shower cleaning mechanisms. The casing may have a groove formed therein in which an edge of the article arranged between the two nozzles can be inserted.Type: GrantFiled: July 30, 2004Date of Patent: September 9, 2008Assignee: Kaijo CorporationInventors: Seigo Takahashi, Junpei Ohkawara, Kazunari Suzuki