Abstract: A light-emitting diode package component is provided. The light-emitting diode package component includes a substrate, a light-emitting chip, a die attach adhesive, a reflective structure, and a molding layer. The light-emitting chip is disposed on the substrate for generating an initial light beam with an initial wavelength. The die attach adhesive is disposed between the light-emitting chip and the substrate so that the light-emitting chip is mounted on the substrate. The reflective structure defining an accommodating space is disposed on the substrate and surrounds the light-emitting chip. The molding layer is disposed in the accommodating space and covers the light-emitting chip. The die attach adhesive includes a first wavelength conversion material, a portion of the initial light beam entering into the die attach adhesive excites the first wavelength conversion material to produce an excitation light with a first wavelength that is greater than the initial wavelength.

Abstract: A light-emitting device and a manufacturing method thereof are provided. The light-emitting device includes a substrate, an epitaxial blocking layer, and a light-emitting epitaxial structure. The substrate has a surface, in which the surface includes a plurality of protruding parts and a plurality of recess parts relative to the protruding parts. The epitaxial blocking layer disposed on the substrate covers the recess parts and exposes the protruding parts. The light-emitting epitaxial structure disposed on the substrate is connected to the protruding parts and is disposed above the recess parts. The light-emitting epitaxial structure is formed by using the protruding parts as a growth surface thereof so as to have a better crystalline quality.

Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.

Abstract: A light-emitting diode package structure and a manufacturing method thereof are provided. The light-emitting diode package structure includes a first substrate, a second substrate, a light-emitting module, and a driving module. The first substrate includes a light-emitting region defined thereon and a load circuit configured in the light-emitting region. The second substrate includes a control region defined thereon and a driving circuit configured in the control region. The first substrate and the second substrate are spaced apart from each other. The light-emitting module is disposed on the first substrate and electrically connected to the load circuit. The driving module is disposed on the second substrate and electrically connected to the driving circuit. The driving module is electrically connected to the light-emitting module.

Abstract: A light source device includes: a power supply circuit, having a first voltage terminal and a second voltage terminal; a light source circuit, having a common terminal and multiple branch terminals, the common terminal being electrically connected to the first voltage terminal, the light source circuit including multiple light sources for emitting lights of different colors, first terminals of the light sources being electrically connected to the common terminal, and second terminals of the light sources being electrically connected to the branch terminals respectively; and a light adjusting circuit, including multiple electrical paths and being electrically connected to the second voltage terminal and the branch terminals via the electrical paths so that the light sources are connected in parallel between the first and second voltage terminals. A resistance of at least one of the electrical paths is adjustable to set branch currents respectively flowing through the light sources.

Abstract: A surface mounted type leadframe includes a conductive base and an insulating material layer. The conductive base includes at least three connecting pads spaced apart from each other. First surface of the connecting pads are configured to form die bonding regions, and second surfaces of the connecting pads opposite to the first surfaces are configured to form soldering regions. The insulating material layer at least partially covers the first surfaces, surrounds the die bonding regions, and is filled in a gap between each two adjacent connecting pads. A photoelectric device with multi-chips adopting the surface mounted type leadframe is also provided.

Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.

Abstract: The present application relates to a packaging leadframe and a packaging structure. The packaging leadframe includes a substrate layer and a sidewall structure. A surface of the substrate layer is provided with at least one metal bump structure, a circuit layer also is laid on the surface of the substrate layer and can be electrically coupled with a LED chip. The sidewall structure is disposed on the surface with the metal bump structure, and includes a halocarbon polymer matrix and a plurality of light reflective particles uniformly mixed together. The halocarbon polymer may be poly tetra fluoroethylene or polyvinylidene fluoride. In this regard, the packaging leadframe has high reflectivity to ultraviolet light and good resistance to ultraviolet radiation.

Abstract: The present application relates to a micro LED display device and, a method for manufacturing the same. The method includes the following steps. First, a plurality of LED chips are formed on a supplying substrate. Next, a first substrate defining a plurality of groups of printed circuits is provided. Then the supplying substrate is overlaid in an inverted manner on the first substrate in such a manner that the LED chips are aligned with and attached onto the groups of printed circuits correspondingly. After the LED chips are detached from the supplying substrate, the supplying substrate is removed. Then a sol-gel glass is filled into gaps among the LED chips. Finally a second substrate is bonded with the first substrate. The present disclosure is capable of improving the yield rate and the reliability.

Abstract: An LED package structure with phosphor encapsulant layer includes an LED chip, a first encapsulant layer, and a second encapsulant layer; the first encapsulant layer covers the LED chip mixed with a first type phosphor having an excitation emission peak wavelength in a first wavelength range; the second encapsulant layer covers a first encapsulant layer mixed with a second type phosphor having an excitation emission peak wavelength in a second wavelength range. At least one of the first type phosphor and the second type phosphor is distributed in the corresponding first encapsulant layer or the corresponding second encapsulant layer in a state where the bottom concentration is higher than the top concentration.

Abstract: A LED leadframe for securing a LED chip includes a metallic base and an insulating layer. The metallic base includes a die bonding region and a peripheral region surrounding the die bonding region, and the die bonding region is for securing the LED chip. The insulating layer is disposed on the metallic base and located in the peripheral region to define the die bonding region. The insulating layer includes a bar-shaped insulating section disposed in the metallic base and corresponding to the die bonding region. The metallic base includes a first groove(s) defined corresponding to the die bonding region. The first groove(s) is/are filled with a thermally conductive filler. The invention improves the LED leadframe to allow heat conducting efficiencies of various regions of the base to be controllable and adjustable so as to reduce temperature differences among various regions of the base and thereby unify the temperature.

Abstract: A micro device transferring method and a micro device transferring apparatus are provided. The micro device transferring method exemplarily includes: providing a carrier substrate including a transparent base, a light radiation activated adhesiveness-loss layer located on a first surface of the transparent base and multiple micro devices arranged in an array on the light radiation activated adhesiveness-loss layer; locally irradiating the light radiation activated adhesiveness-loss layer from a second surface of the transparent base to reduce adhesiveness of multiple target areas of the light radiation activated adhesiveness-loss layer to the micro devices respectively located in the multiple target areas, the multiple target areas being areas corresponding to the micro devices to be transferred; picking up the micro devices in the multiple target areas; and aligning the picked up micro devices with corresponding locations of a receiving substrate, and releasing them onto the receiving substrate.

Abstract: A packaging frame for a photoelectric device chip exemplarily includes a lead frame, an insulator and a reflector disposed on the lead frame and the insulator. The lead frame includes a positive electrode pad and a negative electrode pad. The insulator is disposed between the positive electrode pad and the negative electrode pad. The reflector is formed with a through hole to define regions where the lead frame and the insulator are located in the through hole as a die bonding region. The reflector is connected with the lead frame by a geological polymer. The geological polymer is employed as the material of the reflector owing to the excellent interfacial bonding performance with various materials, and a connector or a connective layer formed therefrom has good chemical and thermal stabilities, excellent airtightness, high mechanical strength and weathering resistance, which can significantly enhances adhesion and mounting stability of device.

Abstract: The present disclosure provides a LED metal substrate and a LED module. An insulator is provided to cover an electrode or a side surface of a metal layer in the LED metal substrate, or provided on an original creepage path between the electrode and the metal layer in the LED metal substrate to form a new creepage path with increased creepage distance, in order to increase the breakdown voltage between the electrode and the metal layer. It is possible to avoid a phenomenon that an electric arc is generated between the electrode and the metal layer when a relative high voltage applied by the electrode during a breakdown test. So that the breakdown voltage of the LED metal substrate with an insulator reaches higher than that of a LED metal substrate without the insulator in the same dimension, and a technical problem in the art may be solved.

Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.

Abstract: A vehicle headlight device is disposed with an optical lens group to concentrate light emitted from a light source as incident light, the image sensor detects a dynamic image in front of the vehicle and sends the image to an image process and control component for analyzing and processing to obtain corresponding control signal, the control signal controls an optical switch array device to process the incident light by spatial distribution modulation for obtaining an emission light with an optical distribution pattern corresponding to the dynamic image, therefore it is unnecessary to turn on/off the light source frequently but still can reinforce, weaken or prevent light projected on target areas in front of the vehicle, the driver can achieve the optimum view without affecting the vehicle ahead. Moreover, the invention further provides a vehicle such as a car adopting the vehicle headlight device.

Abstract: The present disclosure provides a LED package structure and a LED light-emitting device. The LED package structure comprises a LED chip and a wavelength converting layer covering the LED chip. The wavelength converting layer contains red phosphor, which has lower amount in edge portion than in center portion. It is possible to avoid direct or indirect excitation for generating red light in edge portion of the LED chip by adjusting the amount of red phosphor in edge portion to be lower, so that the color temperature in edge portion may be adjusted toward to high color temperature, and thus the phenomenon of yellow halo may be alleviated.

Abstract: A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in pairs, an insulating protective layer (e.g., low-temperature glass glaze layer) disposed on a same side of the ceramic base as the conductive wire layer and exposing the pads, and a metallic reflective layer (e.g., aluminum layer) disposed on a side of the insulating protective layer facing away from the ceramic base and exposing the pads. Moreover, a LED package structure adopting the LED flip-chip package substrate and other LED package structures with similar material layers such as a chip-level packaged LED package structure are provided. By comprehensively utilizing advantages of various materials, the LED flip-chip package substrate with high heat conductivity, high reflectivity, high stability and superior insulation and the LED package structure with high reliability and even high light extraction efficiency are obtained.

Abstract: A light source and a light emitting module thereof are provided. The light source drives and controls the light emitting module containing numerous light emitters by linear constant current drivers and a switch, and all the light emitters can be turned on or turned off simultaneously by utilizing a manner of full-balance series-parallel conversion, which result in the superior light uniformity and even the low flicker requirement can be met.

Abstract: A surface light source device is additionally disposed with a light guide bar between a light-emitting source and a light guide film to collect rays emitted from the light-emitting source and transmit the rays to a light incident surface of the light guide film. A thickness of the light guide bar is designed to be gradually tapered to achieve the objective of reduction in the thickness of a conventional light guide plate. Moreover, the surface light source device can be applied in an edge-lit type backlight module and a display device, as well as in the illumination field.