Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.

Abstract: A direct-lit type backlight source includes a backplate and a point light source array disposed on the backplate. A light output shape of a first optical lens employed by each of point light sources of corner regions of the point light source array and that of a second optical lens employed by each of a plurality of point light sources of the non-corner region are different. For instance, the light output shape of the first optical lens is symmetrical in a first direction and asymmetrical in a vertical second direction. Moreover, a liquid crystal television adopting the direct-lit type backlight source is provided. The light-output shape of the optical lens adopted by each of the point light sources of the respective corners is designed to illuminate the corners uncovered by light source in the prior art, which can improve optical uniformity of the corners.

Abstract: A fingerprint image acquisition device includes: a light source, a finger touching surface, a convex lens, an image sensor and a grating. The light source is a surface light source, and the grating is disposed on a light output surface of the light source. The light source is configured to emit a light beam, the grating is configured to change a propagation direction of the light beam to form a detection light beam, the finger touching surface is configured for a user to place a finger thereon to reflect the detection light beam and thereby obtain a reflected light beam, the convex lens is configured to focus the reflected light beam on the image sensor, and the image sensor is configured to generate a fingerprint image based on the focused reflected light beam. Accordingly, the invention can make the structure of the fingerprint image acquisition device be more compact.

Abstract: A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering pads are electrically connected to the first and the second electrodes respectively. Moreover, a first and a second grooves are defined on the first surface of the insulating substrate, the first and the second grooves are spaced from each other and disposed between the first and the second soldering pads. The invention further provides a LED flip chip package structure including the package substrate, a LED flip chip and fluorescent glue. The invention adds the grooves in the spacing between the soldering pads as a buffer space for melted solder flowing during reflow soldering process and therefore can relieve short-circuit phenomenon.

Abstract: The disclosure relates to an LED lamp and an optical lens thereof. The optical lens includes a dome structure and a protrusion structure, the dome structure has an external surface, the protrusion structure is disposed on the external surface of the dome structure; the protrusion structure has a first optical surface and a first optical side connected with the first optical surface, the first optical surface and the external surface are connected to form a first boundary, the first optical side and the first boundary are inclined. The disclosure further provides an LED lamp. The LED lamp and the optical lens thereof above can improve optical efficiency.

Abstract: The invention relates to a composite substrate for light emitting device and a LED module equipped with the composite substrate for light emitting device. The composite substrate for light emitting device includes a metal substrate, an insulating carrier and an electrode, the metal substrate and the insulating carrier respectively have a front side and a back side that are opposite, the insulating carrier is disposed on the periphery of the metal substrate and connected to the metal substrate, the electrode is disposed on the insulating carrier, the electrode penetrates the insulating carrier, the electrode has a front side and a back side that are opposite, the heights of the back sides of the insulating carrier and the electrode are less than that of the back side of the metal substrate. The present invention also provides a LED module. The composite substrate for light emitting device can reduce costs.

Abstract: A LED lamp and an optical lens thereof are provided. The LED lamp includes a LED light source and an optical lens covering the LED light source. The optical lens includes a dome structure and a protrusion structure. The dome structure has an external surface. The protrusion structure is disposed protruding from the external surface and includes oppositely-disposed first and second side surfaces. The first side surface includes first and second optical surfaces. The second side surface includes a third optical surface. The second optical surface is connected immediately to the external surface and further connected between the external surface and the first optical surface. A boundary line of the second and the first optical surfaces is not disposed at the external surface. The third optical surface and the external surface are immediately connected. Accordingly, local uniformity of light distribution of the optical lens is improved.

Abstract: This invention discloses an LED lamp with an external light source, including a tube, an LED light source plate. The LED light source plate includes a strip base and a plurality of LED illuminants. The lamp has a strip through hole along the length direction of the lamp. The strip base is fixed to the external circumference surface of the lamp, the plurality of LED illuminants are placed between the two side surfaces of the strip through hole. Preferably, the lamp is a circular glass lamp, the strip through hole is on the top of the lamp. Furthermore, the inner surface of the lamp is covered with a diffusion layer. The present invention is beneficial for automatic production and reducing the cost. At the same time, the LED light has a good diffusion and the waste heat is easy to dissipate.

Abstract: The present disclosure discloses a stereoscopic integrated LED light source module, which comprises a columnar insulated support, a plurality of conducting circuits located on outer surface of the columnar insulated support, a plurality of LED light sources connected the conducting circuits to form a plurality of illumination areas, and a plurality of LED drive elements connected the conducting circuits to form a plurality of drive areas. A plurality of cabling channels are located on outer surface of the columnar insulated support, and the conducting circuits are formed on the cabling channels. This disclosure also discloses a LED lamp which uses the LED light source module stated above and a method for manufacturing the same. The present disclosure increases production efficiency and light emitting angle, and reduces manufacturing cost.

Abstract: A LED filament and a LED filament bulb using the same are disclosed. The LED filament includes a carrier, a LED chip disposed on the carrier and a conductive lead connected to the carrier. The conductive lead is electrically connected to the LED chip and includes a lead head portion, a lead tail portion and a lead neck portion connecting the lead head portion with the lead tail portion. A solid body width of the lead neck portion is less than a maximum solid body width of the lead head portion. Because the lead neck portion with reduced solid body width can function as a vulnerable position of the conductive lead, when a stress is applied onto the conductive lead, the lead neck portion would first take action and therefore the bonding location between the lead head portion and the carrier or the carrier itself can be protected.

Abstract: This invention discloses an LED lamp with an external light source, including a tube, an LED light source plate. The LED light source plate includes a strip base and a plurality of LED illuminants. The lamp has a strip through hole along the length. direction of the lamp. The strip base is fixed to the external circumference surface of the lamp, the plurality of LED illuminants are placed between the two side surfaces of the strip through hole. Preferably, the lamp is a circular glass lamp, the strip through hole is on the top of the lamp. Furthermore, the inner surface of the lamp is covered with a diffusion layer. The present invention is beneficial for automatic production and reducing the cost. At the same time, the LED light has a good diffusion and the waste heat is easy to dissipate.

Abstract: The present disclosure discloses a stereoscopic integrated LED light source module, which comprises a columnar insulated support, a plurality of conducting circuits located on outer surface of the columnar insulated support, a plurality of LED light sources connected the conducting circuits to form a plurality of illumination areas, and a plurality of LED drive elements connected the conducting circuits to form a plurality of drive areas. A plurality of cabling channels are located on outer surface of the columnar insulated support, and the conducting circuits are formed on the cabling channels. This disclosure also discloses a LED lamp which uses the LED light source module stated above and a method for manufacturing the same. The present disclosure increases production efficiency and light emitting angle, and reduces manufacturing cost.