Patents Assigned to Kitagawa Industries Co., Ltd.
  • SURFACE MOUNT CONTACT
    Publication number: 20100068901
    Abstract: A surface mount contact interposes between a mounted conductor and a pressing conductive member to make the mounted conductor conductive to the pressing conductive member when the mounted conductor and the pressing conductive member are proximate to each other. The surface mount contact includes: a base portion solderable to the mounted conductor; a movable portion elastically deformable according to a distance between the mounted conductor and the pressing conductive member, at least a part of the movable portion being closer to the base portion when the movable portion elastically deforms; and an insulating coating film provided in a region where the movable portion is closer to the base portion and inhibiting electric contact between the movable portion and the base portion.
    Type: Application
    Filed: September 14, 2009
    Publication date: March 18, 2010
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Hideo YUMI
  • Wire holder
    Patent number: 7674983
    Abstract: A wire holder includes a synthetic resin component that includes a clamp portion for holding at least one wire and a metal component that includes at least one lead portion mounted on a circuit board. The synthetic resin component includes a groove-shaped fitting groove portion. The metal component includes at least one fitting portion that fits the fitting groove portion and is connected to the lead portion. The fitting groove portion includes at least one first opening portion which allows the at least one lead portion to project in a predetermined direction when the at least one fitting portion fits the fitting groove portion. At least one of end portions in an extension direction of a groove of the fitting groove portion is opened as a second opening portion which allows one of the at least one lead portion to project along the extension direction of the groove of the fitting groove portion.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: March 9, 2010
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Tatsuya Nakamura
  • SLIDING PARTS, PRECISION PARTS AND TIMEPIECES AND ELECTRONIC EQUIPMENT USING THE SAME
    Publication number: 20090286064
    Abstract: The present invention relates to sliding parts, precision parts and timepieces and electronic equipment using those parts. Sliding parts are composed by a resin in which the degree of orientation of a fibrous filler is higher at the portion serving as the sliding surface than inside the sliding part, and the fibrous filler is oriented along the sliding surface on the sliding surface. Alternatively, precision parts are composed by a resin to which has been added carbon fibers for which a carbon compound is thermally decomposed to carbon in the vapor phase and simultaneously grown directly into fibers simultaneous to this thermal decomposition. Moreover, timepieces and electronic equipment are composed by these sliding parts or these precision parts.
    Type: Application
    Filed: July 30, 2009
    Publication date: November 19, 2009
    Applicants: KITAGAWA INDUSTRIES CO., LTD., SEIKO INSTRUMENTS INC.
    Inventors: Morinobu ENDO, Tetsuo UCHIYAMA, Akio YAMAGUCHI, Teruaki YUOKA, Hiroshi AOYAMA, Kazutoshi TAKEDA, Yoshifumi MAEHARA, Masato Takenaka, Koichiro Jujo, Shigeo Suzuki, Takeshi Tokoro
  • Sliding parts, precision parts and timepieces and electronic equipment using the same
    Patent number: 7575800
    Abstract: The present invention relates to sliding parts, precision parts and timepieces and electronic equipment using those parts. Sliding parts are composed by a resin in which the degree of orientation of a fibrous filler is higher at the portion serving as the sliding surface than inside the sliding part, and the fibrous filler is oriented along the sliding surface on the sliding surface. Alternatively, precision parts are composed by a resin to which has been added carbon fibers for which a carbon compound is thermally decomposed to carbon in the vapor phase and simultaneously grown directly into fibers simultaneous to this thermal decomposition. Moreover, timepieces and electronic equipment are composed by these sliding parts or these precision parts.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: August 18, 2009
    Assignees: Kitagawa Industries Co., Ltd., Seiko Instruments Inc.
    Inventors: Morinobu Endo, Tetsuo Uchiyama, Akio Yamaguchi, Teruaki Yuoka, Hiroshi Aoyama, Kazutoshi Takeda, Yoshifumi Maehara, Masato Takenaka, Koichiro Jujo, Shigeo Suzuki, Takeshi Tokoro
  • CERAMIC SHEET AND PRODUCING METHOD THEREOF
    Publication number: 20090117328
    Abstract: A ceramic sheet has at least one ceramic layer. The at least one ceramic layer includes a plurality of ceramic pieces, at least a part of the plurality of ceramic pieces is formed by cracking a sintered ceramic plate, which at least partially has a flat part, at the flat part of the sintered ceramic plate.
    Type: Application
    Filed: November 6, 2008
    Publication date: May 7, 2009
    Applicant: KITAGAWA INDUSTRIES CO., LTD
    Inventors: Hideharu Kawai, Toru Matsuzaki
  • Surface mount contact member
    Patent number: 7503774
    Abstract: A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: March 17, 2009
    Assignee: Kitagawa Industries Co., Ltd
    Inventors: Hideo Yumi, Kenji Konda
  • WIRE HOLDER
    Publication number: 20090038824
    Abstract: A wire holder includes a synthetic resin component that includes a clamp portion for holding at least one wire and a metal component that includes at least one lead portion mounted on a circuit board. The synthetic resin component includes a groove-shaped fitting groove portion. The metal component includes at least one fitting portion that fits the fitting groove portion and is connected to the lead portion. The fitting groove portion includes at least one first opening portion which allows the at least one lead portion to project in a predetermined direction when the at least one fitting portion fits the fitting groove portion. At least one of end portions in an extension direction of a groove of the fitting groove portion is opened as a second opening portion which allows one of the at least one lead portion to project along the extension direction of the groove of the fitting groove portion.
    Type: Application
    Filed: August 5, 2008
    Publication date: February 12, 2009
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Tatsuya NAKAMURA
  • TRANSPARENT CONDUCTIVE FILM AND DISPERSION-TYPE ELECTROLUMINESCENCE DEVICE USING SAID FILM
    Publication number: 20090026926
    Abstract: To provide a low-resistance transparent conductive film with high light transmittance, which is a transparent conductive film including a transparent polymer film having on one surface thereof a transparent thin film layer with conductivity and a blocking layer containing at least one material selected from the group consisting of a thermoplastic resin, a thermosetting resin and a UV-curable resin on the thin film, which is characterized in: that a surface resistivity of the transparent thin film layer with conductivity is 0.1?/? or more and not more than 100?/?; and that a refractive index of the material constituting the blocking layer is 1.6 or more and less than 1.9, and a dispersion-type EL device with high luminance and long life using the same.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 29, 2009
    Applicants: FUJIFILM CORPORATION, KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Masashi Shirata, Katsuhide Manabe, Katsutoshi Inagaki
  • SURFACE MOUNT CONTACT MEMBER
    Publication number: 20090011662
    Abstract: A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.
    Type: Application
    Filed: July 3, 2008
    Publication date: January 8, 2009
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Hideo YUMI, Kenji KONDA
  • Clamp
    Patent number: 7387281
    Abstract: A clamp to be surface mounted on a printed circuit board with a clamp groove into which an optical fiber is inserted. A flexible synthetic resin member is deformed by applying a pressing force so as to narrow the width of the clamp groove. The deformation causes an opening of the clamp to be closed, and opposing shape preservation members with the clamp groove located therebetween to be deformed so as to shorten the distance between top ends of the shape preservation members. A metal plate member with no spring properties remains deformed even after the pressing force is released, and the flexible synthetic resin member also remains deformed. An optical fiber pinched by inner wall surfaces of the clamp groove is unlikely to be displaced either in an axial direction or in a radial direction.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: June 17, 2008
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Tatsuya Nakamura
  • Timepiece, having bearing portion formed of resin and wheel train
    Patent number: 7170827
    Abstract: The invention relates to a timepiece which has a resin bearing section. Moreover, the invention relates to a wheel train apparatus which has a resin bearing section. The invention is constituted by the timepiece provided with a gear wheel and supporting members which support the gear wheel, the supporting members being formed from a filler containing resin. Alternatively the invention is constituted by the wheel train apparatus provided with a gear wheel and supporting members which support the gear wheel, the supporting members being formed from a filler containing resin.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: January 30, 2007
    Assignees: Kitagawa Industries Co., Ltd, Seiko Instruments, Inc.
    Inventors: Morinobu Endo, Tetsuo Uchiyama, Akio Yamaguchi, Yasuo Kondo, Hiroshi Aoyama, Koichiro Jujo, Kazutoshi Takeda, Masato Takenaka, Shigeo Suzuki, Takeshi Tokoro
  • Timepiece including base plate formed of resin and wheel train
    Patent number: 7167420
    Abstract: The invention relates to a timepiece which has a resin substrate, rotors, and wheel trains, and relates to a wheel train apparatus which has a resin substrate, bearing members, gear wheel, and the like. The invention is constituted by a timepiece comprising; a gear wheel, and a substrate which supports a shaft of a rotor and/or a shaft of the gear wheel, the substrate being formed from a filled resin. Alternatively the invention is constituted by a wheel train apparatus comprising: a gear wheel; a substrate which supports one shaft section of the gear wheel, and a bridge which rotatably supports an other shaft section of the gear wheel, the substrate and the bridge being formed from a filled resin.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: January 23, 2007
    Assignees: Kitagawa Industries Co., Ltd, Seiko Instruments Inc.
    Inventors: Morinobu Endo, Tetsuo Uchiyama, Akio Yamaguchi, Yasuo Kondo, Hiroshi Aoyama, Koichiro Jujo, Kazutoshi Takeda, Masato Takenaka, Shigeo Suzuki, Takeshi Tokoro
  • Clamp
    Publication number: 20060243868
    Abstract: A clamp to be surface mounted on a printed circuit board with a clamp groove into which an optical fiber is inserted. A flexible synthetic resin member is deformed by applying a pressing force so as to narrow the width of the clamp groove. The deformation causes an opening of the clamp to be closed, and opposing shape preservation members with the clamp groove located therebetween to be deformed so as to shorten the distance between top ends of the shape preservation members. A metal plate member with no spring properties remains deformed even after the pressing force is released, and the flexible synthetic resin member also remains deformed. An optical fiber pinched by inner wall surfaces of the clamp groove is unlikely to be displaced either in an axial direction or in a radial direction.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 2, 2006
    Applicant: Kitagawa Industries Co., Ltd.
    Inventor: Tatsuya Nakamura
  • Electrically conductive contact member for a printed circuit board
    Patent number: 6986669
    Abstract: A contact member formed with a flat metal structure and an integrated elastomeric body. The contact member can be used to ground a printed circuit board (PCB) with a surrounding housing. The housing loads the contact member in a direction perpendicular to the face of the PCB. The elastomeric body supports the flat metal structure during repeated cycles of loading and unloading of the contact member. The elastic resiliency of the elastomeric body can help to reduce the effects of plastic deformation of the contact member, resulting in more reliable electrical connections a source outside of the PCB. And the elastomeric body does not require adhesive or separate fixing devices to hold it in place.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: January 17, 2006
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Tsutomu Kawai
  • Fixing member for fixing an object to be attached to a plate and clamp with the fixing member
    Patent number: 6923406
    Abstract: A clamp detachable by handling from the front side of a plate is provided. When the main body of the clamp is pressed against the plate with an abutting portion elastically deformed and a connecting portion thrust into an attachment hole, and is moved in the direction parallel to the front and reverse surfaces of the plate, a retaining portion is moved to overlap the reverse surface of the plate with a first and a second projections engaged in locating holes formed in the plate. As a result, the main body is pressed against the front surface of the plate, the retaining portion is pressed against the reverse surface of the plate, and the first and second projections engaged in locating holes prevent displacement in the direction parallel to the front and reverse surfaces of the plate, whereby the clamp is fixed to the plate.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: August 2, 2005
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Hideaki Akizuki
  • Thermal conductive material and method for producing the same
    Patent number: 6890970
    Abstract: A thermal conductive material is obtained by kneading an organic material, having the melting transition in the range of 30-70° C. and the viscosity at 100° C. equal to or above 70,000 cP, and a filler at the ratio of 100:40-900. It has a property of flexibly changing its form by being plasticized due to liquidation of the composing organic material upon receipt of heat from an electronic component. Accordingly, adhesion of the thermal conductive material toward the electronic component and a heat sink is increased and thermal conductivity is improved. Additionally, since the thermal conductive material changes its form according to the outer shape of the electronic component, load is evenly applied to the whole electronic component and does not concentrate on part of the electronic component.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: May 10, 2005
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Yasuhiro Kawaguchi
  • Radio wave absorber and production method thereof
    Patent number: 6870497
    Abstract: A radio wave absorber is provided which can be produced at a low cost compared to the case of using silicon carbide fiber and which is also superior in radio wave absorption property in 76 GHz band (75-77 GHz frequency band). The radio wave absorber is produced by arranging a radio wave absorbing layer onto the surface of a metal body. The radio wave absorbing layer is made of a radio wave absorbing material containing silicon carbide powder dispersed in matrix resin. Average particle diameter of the silicon carbide powder is 4-40 ?m. Silicon carbide powder content in the radio wave absorbing material is 15-45 volume %. Thickness of the radio wave absorbing layer is adjusted so that reflection attenuation of not less than 10 dB is provided in 76 GHz band.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: March 22, 2005
    Assignees: Kitagawa Industries Co., Ltd., Uchiyama Manufacturing Corp.
    Inventors: Yasuo Kondo, Toru Matsuzaki, Yutaka Suematsu, Masaru Okamoto, Tomohisa Yamamoto
  • Forming method of magnetic body and printed circuit board
    Patent number: 6758999
    Abstract: A method of forming a magnetic body, alternative to a ferrite core, on a printed circuit board is provided. A printed circuit board is set in a mold and injection molding is conducted. The mold comprises a fixed plate, an intermediate plate and a movable plate. A cavity in the intermediate plate is filled with a melted material (i.e., mixture of resin and magnetic filler) supplied via a sprue and a runner. A cavity in the movable plate is also filled with the material supplied to the cavity in the intermediate plate through a hole in the printed circuit board. When a magnetic body for noise control is directly injection molded onto the printed circuit board in such a way, no gap appears between the magnetic body and the printed circuit board. As a result, the magnetic body functions well as desired.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: July 6, 2004
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Hideharu Kawai, Toru Matsuzaki
  • Process for forming thermal conductive sheet
    Patent number: 6733614
    Abstract: A thermal conductive sheet with conductive foil is obtained by press bonding a magnetic foil to a thermal conductive layer via a primer layer. Since the primer layer contains a thermal conductive filler, it has high thermal conductivity and does not interrupt thermal conduction from the thermal conductive layer to the magnetic foil. It also spontaneously destroys a skin layer on the surface of the thermal conductive layer upon the press bonding. Accordingly, the thermal conductive sheet with conductive foil of the present invention improves thermal conduction from the thermal conductive layer to the conductive foil, eliminating the unfavorable effects of the skin layer and the primer layer, and thus improves heat radiation of the thermal conductive sheet with conductive foil.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: May 11, 2004
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Akio Yamaguchi, Hideharu Kawai, Yasuhiro Kawaguchi
  • Fixing member for fixing an object to be attached to a plate and clamp with fixing member
    Patent number: 6669149
    Abstract: A clamp detachable by handling from the front side of a plate is provided. When the main body of the clamp is pressed against the plate with an abutting portion elastically deformed and a connecting portion thrust into an attachment hole, and is moved in the direction parallel to the front and reverse surfaces of the plate, a retaining portion is moved to overlap the reverse surface of the plate with a first and a second projections engaged in locating holes formed in the plate. As a result, the main body is pressed against the front surface of the plate, the retaining portion is pressed against the reverse surface of the plate, and the first and second projections engaged in locating holes prevent displacement in the direction parallel to the front and reverse surfaces of the plate, whereby the clamp is fixed to the plate.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: December 30, 2003
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Hideaki Akizuki