Abstract: A measurement system may include two or more sets of optical sub-systems to simultaneously generate measurement data on two or more samples, a coarse translation stage providing motion along a plane, two or more fine translation stages disposed on the coarse translation stage arranged in a common pattern as the two or more sets of optical sub-systems, where each of the fine translation stages provides motion along the plane and is arranged to position one of the two or more samples under one of the two or more sets of optical sub-systems. The system may further include a controller to independently direct each of the fine translation stages and the associated one of the optical sub-systems to generate measurement data for the respective samples, and generate one or more measurements for the samples based on the associated measurement data.

Abstract: An electron-beam device includes a laser and a photocathode film. The photocathode film has a front side and a back side and emits a plurality of electron beamlets when illuminated from the back side using the laser. The electron-beam device also includes electrodes to extract the plurality of electron beamlets from the front side of the photocathode film and to control shapes of the plurality of electron beamlets.

Abstract: The disclosed subject matter relates to method for determining HF concentration in highly buffered hydrofluoric acid (BHF), with e.g., <1000 ppm HF and >15 wt. % NH4F, through measurement of etched Si concentration and NH4F, which demonstrates a substantial accuracy and reliability in detection.

Abstract: Methods and systems for image alignment are provided. One method includes selecting three or more salient feature points for use in test image to reference image alignment by applying a selected salient feature point detection method to at least a reference image generated for the specimen. The method also includes detecting the three or more salient feature points in the test image and the reference image and aligning the detected three or more salient feature points in the test image to the detected three or more salient feature points in the reference image. The method further includes aligning remaining portions of the test image to remaining portions of the reference image based on results of the previous aligning step.

Abstract: A measurement system may include an illumination source configured to generate one or more illumination beams and one or more objective lenses. One or more of the objective lenses may be configured as illumination objective lenses to direct illumination from the illumination source to one or more targets on a sample. One or more of the objective lenses may be configured as collection objective lenses, where each of the collection objective lenses is configured to collect a selected diffraction order of the illumination from the sample. The system may further include one or more detectors, each configured to image the sample based on at least one of the selected diffraction orders from at least one of the collection objective lenses and a controller to generate measurements of the one or more targets on the sample based on one or more images from the detectors.

Abstract: A non-transitory computer-readable storage medium stores one or more programs for execution by one or more processors of a computer system communicatively coupled with a manufacturing tool through one or more networks. The one or more programs include instructions for sending a series of frames showing data for the manufacturing tool to a client device for display. The client device is remote from a manufacturing facility in which the manufacturing tool is to be disposed. The one or more programs also include instructions for adjusting a bandwidth for one or more frames of the series of frames in response to receiving, from the client device, an indication of a user interaction with the client device. The instructions for sending the series of frames include instructions for transmitting, after receiving the indication, the one or more frames with the adjusted bandwidth to the client device for display.

Abstract: An overlay metrology target may include grating-over-grating structures formed from a lower grating structure with a first coarse pitch in a first sample layer and an upper grating structure with a second coarse pitch in a second sample layer, where the upper and lower grating structures overlap on the sample. At least one of the upper grating structure or the lower grating structure may include features with a fine pitch smaller than a wavelength of an illumination beam and arranged to rotate first-order diffraction of the illumination beam associated with at least one of the first or second coarse pitches with respect to at least one of specular reflection from a top surface of the sample or zero-order diffraction from the one or more grating structures. Overlay between the first and second layers of the sample is determinable from an image of the grating structures based on the first-order diffraction.

Abstract: An overlay metrology system may include illumination optics to split illumination from an illumination source into primary and secondary illumination and direct the primary illumination to a sample including an overlay target with gratings in two or more layers and an objective lens to collect positive and negative diffraction from the constituent gratings. The system may further include collection optics to overlap the auxiliary illumination with at least some of the collected diffraction lobes to generate time-varying interference signals. The system may further include a controller to generate overlay measurements based on the time-varying interference signals.

Abstract: A mini-environment apparatus is disclosed. The apparatus may include an enclosure including a frame with two or more openings. The frame may define an internal cavity within the enclosure. The apparatus may include a flapper blade coupled to a portion of the frame. The flapper blade may be configured to close at least one opening of the two or more openings of the frame to form a sealed enclosure when the flapper blade is in a closed position. The apparatus may include a floating plate coupled to a portion of the frame. The floating plate may include one or more slots. The apparatus may include one or more shutters coupled a portion of the floating plate to cover the one or more slots.

Abstract: Process window qualification (PWQ) layouts can be used to determine a presence of a pattern anomaly associated with the pattern, patterning process, or patterning apparatus. For example, a modulated die or field can be compared to a slightly lower offset modulated die or field. In another example, the high to low corners for a particular condition or combination of conditions are compared. In yet another example, process modulation parameters can be used to estimate criticality of particular weak points of interest.

Abstract: Methods and systems for determining information for a specimen are provided. One system includes a computer subsystem and one or more components executed by the computer subsystem. The one or more components include a semantic segmentation model configured for assigning labels to each of multiple pixels in an image responsive to what is represented in each of the multiple pixels. The image is an image of a specimen generated by an imaging subsystem. The computer subsystem is configured for determining information for the specimen from the assigned labels and without a reference image for the specimen.

Abstract: A system for use with a misregistration metrology tool (MMT), the system including a database including a plurality of process variation (PV) categories and a corresponding plurality of parameter sets and a process variation accommodation engine (PVAE) including a measurement site process variation category associator (MSPVCA) operative to associate a measurement site being measured by the MMT, at least partially based on an MMT output relating to the measurement site, with a measurement site process variation category (MSPVC), the MSPVC being one of the plurality of PV categories, a measurement site parameter set retriever (MSPSR) operative to retrieve a measurement site parameter set (MSPS) corresponding to the MSPVC and a measurement site parameter set communicator (MSPSC) operative to communicate the MSPS to the MMT.

Abstract: The system includes a robot interface disposed on a robot arm, and an end effector configured to selectively couple to the robot arm via the robot interface. The end effector includes an upper jaw, a lower jaw, and a pair of arms configured to carry a substrate. The upper jaw and the lower jaw are spaced apart in a first direction and biased together, and the pair of arms are spaced apart in a second direction orthogonal to the first direction. When the end effector is coupled to the robot arm, the robot interface is disposed between the upper jaw and the lower jaw. To exchange the end effector, the upper jaw and the lower jaw can be separated to release the robot interface.

Abstract: Methods and systems for measurement of wafer tilt and overlay are described herein. In some embodiments, the measurements are based on the value of an asymmetry response metric and known wafer statistics. Spectral measurements are performed at two different azimuth angles, preferably separated by one hundred eighty degrees. A sub-range of wavelengths is selected with significant signal sensitivity to wafer tilt or overlay. An asymmetry response metric is determined based on a difference between the spectral signals measured at the two different azimuth angles within the selected sub-range of wavelengths. The value of the asymmetry response metric is mapped to an estimated value of wafer tilt or overlay. In some other embodiments, the measurement of wafer tilt or overlay is based on a trained measurement model. Training data may be programmed or determined based on one or more asymmetry response metrics at two different azimuth angles.

Abstract: A method is disclosed. The method may include generating a first optical image of a sample with a first inspection sub-system. The first optical image may be generated when a first set of photoluminescent markers are emitting photoluminescent illumination at a first time interval. The method may include generating additional optical images with an additional inspection sub-system. The additional optical images may be generated when additional photoluminescent markers are emitting photoluminescent illumination at additional time intervals. The method may include generating an accumulated optical image based on the first optical image and the additional optical images. The method may include determining a location of the photoluminescent markers based on the accumulated optical image. The method may include determining a pattern of the sample based on the determined location of the photoluminescent markers.

Abstract: A multi-layered moir target, useful in the calculation of misregistration between at least first, second and third layers being formed on a semiconductor device wafer, including at least one group of periodic structure stacks, each including a first stack, including a first stack first periodic structure (S1P1) having an S1P1 pitch along a first axis, a second stack, including a second stack first periodic structure (S2P1) having an S2P1 pitch along a second axis and a third stack, including a third stack first periodic structure (S3P1) having an S3P1 pitch along a third axis, the first axis being parallel to an x-axis or a y-axis, and at least one of the stacks including a second periodic structure having a second periodic structure pitch along at least one fourth axis parallel to the first axis and co-axial with one of the axes.

Abstract: A LSP broadband light source is disclosed. The light source may include a gas containment structure for containing a gas. The light source may include a laser pump source configured to generate an optical pump to sustain a plasma within the gas containment structure for generation of broadband light. The light source may include a tapered window configured to transmit broadband light through an aperture within a wall of the gas containment structure, the tapered window including a tapered section including a tapered surface, wherein the tapered surface is configured to deflect light impinging on a peripheral portion of the tapered window away from a portion of the gas containment structure to protect the portion of the gas containment structure.

Abstract: A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform one or more stress-free shape measurements on a first wafer, a second wafer, and a post-bonding pair of the first and second wafers. The wafer shape metrology system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller is configured to receive stress-free shape measurements from the wafer shape sub-system; predict overlay between one or more features on the first wafer and the second wafer based on the stress-free shape measurements of the first wafer, the second wafer, and the post-bonding pair of the first wafer and the second wafer; and provide a feedback adjustment to one or more process tools based on the predicted overlay. Additionally, feedforward and feedback adjustments may be provided to one or more process tools.

Abstract: A permission-engine computer system receives a request for electronic access by an equipment supplier to a manufacturing facility of a manufacturer to perform a remote support activity for equipment in the manufacturing facility. The permission-engine computer system routes the request to a plurality of predefined approvers and receives approval of the request from the plurality of predefined approvers. In response to receiving approval of the request from the plurality of predefined approvers, the permission-engine computer system signals a gateway computer system of the manufacturer that the request is approved. The gateway computer system automatically creates a connection between an electronic device in the manufacturing facility and a computer system of the equipment supplier in response to approval of the request. The connection is used for the remote support activity.

Abstract: A metrology module includes an estimation model that is configured to provide an estimation of independent overlay with tool induced shift on received wafers based on only one azimuth angle spectra. The estimation model can use at least one machine learning algorithm. The estimation model can be derived by the machine learning algorithm applied to calculated training data based on a first training sample set from initial metrology measurements and an additional tool induced shift training sample.