Abstract: A microphone assembly comprises a housing having a top housing and a bottom housing fixed attached together, defining a volume. The microphone assembly further comprises a motor assembly and a circuit assembly disposed within the housing. The motor assembly includes a backplate and a diaphragm. The motor assembly further comprises a first end and a second end spaced apart by a central portion wherein a portion of the first and second ends fixedly attached to the inner surface of the top housing or the bottom housing. The circuit assembly includes a connecting lead for making contact with the diaphragm or a backplate. The circuit assembly is arranged in series with the motor assembly, but not stacked over or under the motor assembly.

Abstract: A transducer system may include multiple transducers. The transducers may be mounted together and may include either the same transducer type or different transducer types, depending on the desired applications. The transducers may be receivers which are aligned and joined. A coupling circuit may be provided and coupled to one or both of the transducers.

Abstract: A first circuit stage comprises at least one NMOS transistor and is coupled to a microphone transducer. A coupling circuit is coupled to the first circuit stage. A second circuit stage is adapted to receive signals from the first circuit stage via the coupling circuit and buffer the signals. The first circuit stage, the second circuit stage, and the coupling circuit reside completely within a microphone housing. A first contact member extends externally from the microphone housing and is electrically coupled to an output of the second circuit stage. The first contact member is adapted to selectively receive power from an external power supply to power the microphone circuit.

Abstract: A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

Abstract: A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

Abstract: A microphone (100) and method of manufacture thereof is disclosed. The microphone (100) includes a housing (108), a diaphragm assembly (120), a spacer (134), a backplate assembly (140), a body assembly (150), and a printed circuit board (164) disposed within the housing (100). The diaphragm assembly (120) and the backplate assembly (140) constitute a variable capacitor responsive to sound pressure level changes coupled through an acoustic port (118). The base capacitance is inversely proportional to the thickness of the spacer (134). The backplate assembly (140) is disk shaped with protrusions and coupled to the body assembly (150) such that an acoustic passage (172) is formed between an outer edge of the backplate assembly (140) and an inner periphery of the hollow body assembly (150). The body assembly (150) comprises conductive mount (158) for electrically coupling the backplate assembly (140) to a first surface (166) of a circuit board (164).

Abstract: A plurality of MEMS structures is formed on a wafer. The wafer is mounted on a dicing frame assembly having a dicing frame and a dicing tape attached to the dicing frame. A protective layer is applied to cover the entire surface of the wafer or may be limited to the portion of the surface of the wafer that includes the MEMS structures by any suitable means of coating techniques to protect the MEMS structures during dicing operation. The protective layer base material to be provided on the wafer may include linear carbon chain molecules containing 12-18 carbon atoms. The dicing operation is performed to divide the wafer into individual die. The protective layer is removed by any suitable process including decomposition, vaporized, sublimation or the like. For example, the protective layer may be evaporated through the application of heat after the die attachment process is completed. The heat application may be part of the cure cycle required for die bonding or may be a separate operation.

Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.

Abstract: A transducer comprising a pair of spaced magnets at least partially forming a tunnel having a central axis. A coil having a first and a second side wall and an upper and a lower wall at least partially forms the tunnel. A reed having a central portion extends through the tunnel. The reed has a stationary end, a deflection end, and a tip portion which lies at least partially between the magnets, wherein the reed is mounted for deflection towards or away from the respective magnets.

Abstract: A bone conduction transducer suitable for use in a listening device, such as hearing aids, in-ear monitors, headphones, electronic hearing protection devices, and very small scale acoustic speakers, has an end mass assembly disposed within the housing. The end mass assembly is mounted to the acoustic assembly and operatively coupled to the motor assembly via a coupling assembly.

Abstract: An input biasing circuit for a microphone is disclosed. The circuit includes an input and an output. An input transistor is connected between the input and the output and to a biasing circuit. The biasing circuit DC biases the gate terminal of the input transistor. A resistor operably connected to, and cooperating with the input transistor, provides a buffered version of a received microphone transducer signal to the output.

Abstract: A receiver includes a housing having an interior, a diaphragm assembly disposed within the housing, a motor assembly disposed within the housing and a linkage assembly coupling the diaphragm assembly and the motor assembly. A support structure joined to the diaphragm or the motor assembly or to both the diaphragm and the motor assembly. The support structure includes a cooperative surface portion engaging the housing to position and retain the joined diaphragm assembly or motor assembly within the interior. A corresponding method of manufacture employs a support structure for positioning components of the receiver in the housing. A receiver may also incorporate a microphone to through pass acoustic signals external to the receiver housing through the receiver. An earphone assembly may incorporate a receiver as described.

Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.

Abstract: A paddle (142) of a diaphragm (118) of a receiver (100) is manufactured using one or more layers of a material selected for their inertial mass and rigidity. The paddle may have a layered structure with stiff outer layers such as aluminum and a less dense inner layer, such as thermoplastic adhesive. The inner and outer layers are selected to give an inertial mass matching that of an armature (124) of the receiver (100) and to give a lowest frequency bending resonance above a desired range, for example, 14 KHz.

Abstract: A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of stock material (800) relative to the plane of the stock material (800) and a second linkage member (826) displaced from the strip (800) relative to the plane. The first and second linkage members (822, 826) are then joined while secured to the strip (800). At least one severable connecting member (870a-c) securing the linkage member to the strip (800) is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly (140).

Abstract: A condenser microphone having a housing, a diaphragm assembly and backplate located within the housing. A spacer isolates the diaphragm assembly from the housing and spaces the diaphragm assembly from the backplate. The spacer has a first portion disposed between the backplate and the diaphragm assembly, and a second portion disposed between the diaphragm assembly and the wall of the housing. A conductive member electrically connects the backplate to a ground.

Abstract: A shock resisting vibration damping mounting for an acoustic transducer includes a compliant first portion or boot coupled to a compliant second portion or tube. The first portion has an exterior surface and an interior surface with the interior surface defining a chamber for receiving the acoustic transducer. The second portion has an elongate portion having a first end and a second end and a passage extending within the elongate portion from the first end to the second end. The passage couples to the chamber such that with an acoustic transducer disposed within the chamber a port of the acoustic transducer is acoustically coupled to the passage.

Abstract: An electret condenser microphone includes a housing, a diaphragm disposed within the housing, first and second sound inlet ports and an acoustic resistive material disposed within the housing and in the acoustic path between the second inlet port and the diaphragm. The acoustic resistive may further electrically couple a backplate coupled to the diaphragm to an amplifier disposed within the housing.

Abstract: A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, a substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

Abstract: A paddle (142) of a diaphragm (118) of a receiver (100) is manufactured using one or more layers of a material selected for their inertial mass and rigidity. The paddle may have a layered structure with stiff outer layers such as aluminum and a less dense inner layer, such as thermoplastic adhesive. The inner and outer layers are selected to give an inertial mass matching that of an armature (124) of the receiver (100) and to give a lowest frequency bending resonance above a desired range, for example, 14 KHz.