Abstract: A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel.

Abstract: A microphone buffer circuit being adaptable for connection to a power source is disclosed. The microphone buffer circuit includes an input transistor operably connected between an input and an output for buffering an input signal. The microphone buffer circuit includes a means for reducing power supply noise capable of being coupled to the input transistor wherein the means being operably connected to the input transistor and the power source.

Abstract: A receiver module for a personal listening device to be fitted in the ear, on the ear, near the ear, or behind the ear, the receiver module having a movable armature, the receiver module comprises a motor assembly and a housing defining a chamber, the housing is made from a material that is corrosion resistant and is biocompatible to human skin contact. The receiver module further comprises at least one motor assembly directly disposed in the chamber. Optionally a communication link adapted to couple or decouple with the motor assembly. At least a portion of the communication link is disposed in the housing.

Abstract: A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

Abstract: A module (100, 200, 300, 400, 500, 600, 900) may be electrically connected to a PCB (18, 918) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16, 916) of the device (14). The module may include a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910) having a connecting surface (114, 214, 314, 414, 514, 614, 914), and at least one acoustic port (124, 224, 324, 424, 524, 624, 924) to couple a surface of the surface mountable acoustic transducer to the exterior of the device (14). The module (100, 200, 300, 400, 500, 600, 900) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614, 914) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910).

Abstract: A microphone includes a housing including a structure and a motor assembly. The housing includes an inner space and the motor assembly mounted in the housing divides the inner space into a front volume and a back volume. The structure formed as part of the housing includes a plurality of openings, e.g. notches in different dimensions. The openings may act as a time delay structure to modify the directivity characteristics of the microphone.

Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.

Abstract: A microphone for transducing between an acoustical signal and an electrical signal, comprises a housing and a motor assembly disposed within the housing. The motor assembly includes a backplate and a diaphragm attached to the backplate via a spacer. The diaphragm comprising a ring and a film, the diaphragm vibrates in response to an acoustical signal, wherein the film is formed from an amorphous or semi-crystallized polyphenylene sulfide (PPS) and a metal layer is attached to the film. The film is completely covered by the metal layer and a portion of the metal is removed using a direct energy source, leaving a portion of the film directly exposed resulting in reducing the parasitic capacitances between the backplate and the diaphragm and increasing the sensitivity. Alternatively, the film is partially covered by the metal layer.

Abstract: A module (100, 200, 300, 400, 500, 600) may be electrically connected to a PCB (18) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16) of the device (14). The module includes a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610) having a connecting surface (114, 214, 314, 414, 514, 614) disposed within the housing (102, 202, 302, 402, 502, 602), and at least one acoustic port (124, 224, 324, 424, 524, 624) formed on a surface of the housing (102, 202, 302, 402, 502, 602). The module (100, 200, 300, 400, 500, 600) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610). The acoustic port (124, 224, 324, 424, 524, 624) may include a layer of an environmental barrier (450, 550).

Abstract: An armature for a receiver comprising a first and a second leg portion each having a thickness and a width and connected to each other, and a connection portion in communication with the first and second leg portions. The connection portion has a width greater than the width of the first and second leg portions individually. The connection portion reduces the stiffness of the armature and minimizes magnetic reluctance of the connection between the first and second leg portions. According to one aspect of the invention, the first and second leg portions are integrally formed with the connection portion and the connection portion includes a least a portion having a thickness less than the thickness of the first and second leg portions individually to reduce the stiffness of the armature. According to another aspect of the invention, the first and second leg portions are separately formed and attached to the connection portion in a way that reduces the stiffness of the armature.

Abstract: An insert earphone comprises a housing and at least one transducer that is located in the housing. The transducer is adapted to receive electrical energy and to responsively convert the electrical energy into acoustic energy for presentation to an eardrum of a user. The transducer is positioned within the housing so as to be in close proximity to the eardrum of the user when the housing is inserted into the ear canal. At least one sealing member is coupled to the housing. The at least one sealing member is adapted to provide an acoustic seal within the ear canal of the user.

Abstract: A directional microphone system is disclosed, which comprises circuitry for low pass filtering a first order signal, and circuitry for high pass filtering a second order signal. The system further comprises circuitry for summing the low pass filtered first order signal and the high pass filtered second order signal. A method of determining whether a plurality of microphones have sufficiently matched frequency response characteristics to be used in a multi-order directional microphone array is also disclosed. For a microphone array having at least three microphones, wherein one of the microphones is disposed between the other of the microphones, a method of determining the arrangement of the microphones in the array is also disclosed.

Abstract: An armature for a receiver comprising a first and a second leg portion each having a thickness and a width and connected to each other, and a connection portion in communication with the first and second leg portions. The connection portion has a width greater than the width of the first and second leg portions individually. The connection portion reduces the stiffness of the armature and minimizes magnetic reluctance of the connection between the first and second leg portions. According to one aspect of the invention, the first and second leg portions are integrally formed with the connection portion and the connection portion includes at least a portion having a thickness less than the thickness of the first and second leg portions individually to reduce the stiffness of the armature. According to another aspect of the invention, the first and second leg portions are separately formed and attached to the connection portion in a way that reduces the stiffness of the armature.

Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.

Abstract: A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

Abstract: An apparatus for transducing between an acoustical signal and an electrical signal, comprises a backplate assembly comprising a charged layer and a conductive layer and a diaphragm assembly positioned at a predetermined distance from the backplate assembly. The diaphragm assembly comprising a support structure and a diaphragm, the diaphragm vibrates in response to an acoustical signal, is monolithically formed on the support structure, wherein the support structure and the diaphragm are composed of a common material having a thermomechanical property. The apparatus further comprises a spacer, a printed circuit board (PCB), and a housing. The spacer is formed between the backplate assembly and the diaphragm assembly, collectively constituting a motor portion. The motor portion and the PCB are disposed in the housing.

Abstract: A module (100, 200, 300, 400, 500, 600, 900) may be electrically connected to a PCB (18, 918) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16, 916) of the device (14). The module may include a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910) having a connecting surface (114, 214, 314, 414, 514, 614, 914), and at least one acoustic port (124, 224, 324, 424, 524, 624, 924) to couple a surface of the surface mountable acoustic transducer to the exterior of the device (14). The module (100, 200, 300, 400, 500, 600, 900) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614, 914) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910).

Abstract: A plurality of individual MEMS packages are formed as a contiguous unit and each of the plurality of individual MEMS packages include at least one acoustic port. One or more separation boundaries from where to separate adjacent ones of the plurality of individual MEMS packages are determined. Each of the plurality of individual MEMS packages are subsequently separated from the others according to the one or more separation boundaries to provide separate and distinct individual MEMS packages. Each acoustic port disposed within each separate and distinct individual MEMS package is exposed due to the separating so as to allow sound energy to enter each separate and distinct individual MEMS package.

Abstract: A listening device for presenting at least one audio signal to a user comprises a first ear piece and a second ear piece, each of the first ear piece and the second ear piece including at least one speaker and each being adapted to block substantially all external sounds from entering an ear of a user. The device further comprises a microphone for sensing a first audio signal and a differential amplifier coupled to the microphone for amplifying the first audio signal. The differential amplifier is coupled to a first electrical ground. A switching arrangement coupled to and receiving a second audio signal from an external audio source and the external audio source having a second electrical ground that is electrically distinct from the first electrical ground.

Abstract: A method of making an acoustic assembly for use in a transducer includes forming a multi-layer assembly. The multi-layer assembly includes a first layer member and a second layer member. Each member includes a center portion, an edge portion and an aperture separating the center portion and the edge portion. The assembly has an assembly stiffness that is greater than the stiffness of either the first or second layer members. A hinge joins the assembled first and second center portions and the first and second edge portions such that the assembled first and second center portions is free to at least partially rotate relative to the assembled first and second edge portions about an axis. A flexible layer member is coupled to the assembly and provides airtight sealing of the passageway.