Abstract: The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board. In some embodiments, the acoustic port is located in the substrate directly under the silicon condenser die which decreases the thickness of the inventive package.

Abstract: A miniature electret microphone includes an input buffer circuit. The input buffer circuit includes an integrated circuit including a floating ground substrate and a p-n junction. The p-n junction is coupled as a capacitor to a filter circuit of the input buffer circuit.

Abstract: A listening device for presenting at least one audio signal to a user comprises a first ear piece and a second ear piece, each of the first ear piece and the second ear piece including at least one speaker and each being adapted to block substantially all external sounds from entering an ear of a user. The device further comprises a microphone for sensing a first audio signal and a differential amplifier coupled to the microphone for amplifying the first audio signal. The differential amplifier is coupled to a first electrical ground. A switching arrangement coupled to and receiving a second audio signal from an external audio source and the external audio source having a second electrical ground that is electrically distinct from the first electrical ground.

Abstract: An armature for a receiver comprising a first and a second leg portion each having a thickness and a width and connected to each other, and a connection portion in communication with the first and second leg portions. The connection portion has a width greater than the width of the first and second leg portions individually. The connection portion reduces the stiffness of the armature and minimizes magnetic reluctance of the connection between the first and second leg portions. According to one aspect of the invention, the first and second leg portions are integrally formed with the connection portion and the connection portion includes a least a portion having a thickness less than the thickness of the first and second leg portions individually to reduce the stiffness of the armature. According to another aspect of the invention, the first and second leg portions are separately formed and attached to the connection portion in a way that reduces the stiffness of the armature.

Abstract: A silicon condenser microphone package and method for manufacture are disclosed. The silicon condenser microphone package includes a silicon condenser microphone die, a substrate comprising a conductive layer, and a cover having a conductive layer, where the conductive layers of the substrate and cover are electrically connected to form an electromagnetic interference shield for the silicon condenser microphone die. The method for manufacturing the silicon condenser microphone package involves placement of a plurality of silicon condenser microphone dies on a panel of printed circuit board material, placement of covers over each of the silicon condenser microphone dies, and then separating the panel into individual packages.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board. In some embodiments, the acoustic port is located in the substrate directly under the silicon condenser die which decreases the thickness of the inventive package.

Abstract: A transducer comprising a pair of spaced magnets at least partially forming a tunnel having a central axis. A coil having a first and a second side wall and an upper and a lower wall at least partially forms the tunnel. A reed having a central portion extends through the tunnel. The reed has a stationary end, a deflection end, and a tip portion which lies at least partially between the magnets, wherein the reed is mounted for deflection towards or away from the respective magnets.

Abstract: A valve for a personal auditory system is described. The auditory system is capable of converting between an acoustic signal and an electrical signal. The auditory system has an acoustic pathway through which an acoustic signal may travel between a first point exterior to the auditory system and a second point interior to the auditory system. The valve includes a free floating electrode and a second electrode adjacent to free floating electrode. An electric signal that is generated by the second electrode moves the free floating electrode to substantially open or close the acoustic pathway.

Abstract: A linkage assembly is used for mechanically coupling an armature and a diaphragm of a balanced receiver, the linkage assembly formed from a first linkage member displaced from a strip of stock material relative to the plane of the stock material and a second linkage member displaced from the strip relative to the plane. The first and second linkage members are then joined while secured to the strip. At least one severable connecting member securing the linkage member to the strip is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly.

Abstract: A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of stock material (800) relative to the plane of the stock material (800) and a second linkage member (826) displaced from the strip (800) relative to the plane. The first and second linkage members (822, 826) are then joined while secured to the strip (800). At least one severable connecting member (870a-c) securing the linkage member to the strip (800) is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly (140).

Abstract: A human interface device is provided, having a substrate. A strain sensitive die is coupled to the substrate wherein the die is capable of providing an electrical signal indicative of a force applied to the strain sensitive die. A force transfer element is positioned adjacent to the strain sensitive die and coupled to the strain sensitive die. A translation element is mechanically coupled to the force transfer element. An elastic element is at least partially surrounding the translation element and the force transfer element, wherein the elastic element provides the mechanical coupling between the translation element and the force transfer element. A force applied to the translation element causes stretching of the elastic element, wherein the stretching of the elastic element causes a force to be applied to the force transfer element; and wherein the force applied to the force transfer element by the elastic element is then applied to the strain sensitive die.

Abstract: A bone conduction transducer suitable for use in a listening device, such as hearing aids, in-ear monitors, headphones, electronic hearing protection devices, and very small scale acoustic speakers, has an end mass assembly disposed within the housing. The end mass assembly is mounted to the acoustic assembly and operatively coupled to the motor assembly via a coupling assembly.

Abstract: An acoustic assembly for use in a transducer includes a multi-layer structure. A first layer member includes a first center portion, a first edge portion and a first aperture separating the first center portion and the first edge portion. A second layer member includes a second center portion, a second edge portion and a second aperture separating the second center portion and the second edge portion such that the second center portion is free to move relative to the second edge portion. The first and second layers are formed into an assembly wherein the first center portion and the second center portion are coupled, the first edge portion and the second edge portion are coupled, and the first aperture and the second aperture are substantially aligned to define a passageway. The assembly has an assembly stiffness that is greater than the stiffness of either the first or second layer members.

Abstract: An armature for a receiver includes a first leg portion, a second leg portion, and a connection portion in communication with the first and second leg portions. The connection portion reduces the stiffness of the armature and minimizes magnetic reluctance of the connection between the first and second leg portions.

Abstract: A microphone and orientation sensor system includes a microphone and an orientation sensor. The microphone has a diaphragm. The orientation sensor includes an inertial load member having a first end and a second end opposite the first end. The sensor also includes at least one electrode positioned adjacent to the inertial load member. The sensor further includes a beam. The inertial load member pivots about the beam, and the pivoting of the load member causes a change in a distance between the first end and the electrode resulting in a change in capacitance between the first end and the electrode. The diaphragm and electrode are formed from a common layer of material.

Abstract: A transducer assembly may include a first transducer having a first front volume, a first back volume and a first port acoustically coupled to the first front volume; and a second transducer having a second front volume, a second back volume and second port acoustically coupled to the second front volume. The first front volume and the second front volume are acoustically coupled to increase the effective back volume of both the first transducer and the second transducer. An optional signal processing circuit may be used to control the output of the first transducer based upon a signal received from the second transducer.

Abstract: A valve for a personal auditory system is described. The auditory system is capable of converting between an acoustic signal and an electrical signal. The auditory system has an acoustic pathway through which an acoustic signal may travel between a first point exterior to the auditory system and a second point interior to the auditory system. The valve includes a free floating electrode and a second electrode adjacent to free floating electrode. An electric signal that is generated by the second electrode moves the free floating electrode to substantially open or close the acoustic pathway.

Abstract: A microphone assembly comprises a housing that includes a conductive material. A preamplifier circuit is disposed within the housing, the preamplifier circuit having a signal input and a ground terminal. A microphone portion is disposed within the housing, the microphone portion having an output coupled to the signal input of the preamplifier circuit. A ribbon wire is attached to the ground terminal of the preamplifier circuit and is attached to the housing.

Abstract: A microphone is provided. The microphone has a housing; a back plate positioned within the housing; a die positioned within the housing and coupled to a circuit board having conductive traces; and a conductive layer positioned between the die and the back plate, wherein the conductive layer mitigates coupling of an electrical signal between the conductive traces and the back plate.