Patents Assigned to Kulicke & Soffa Industries
  • Method of operating a clamping system of a wire bonding machine
    Patent number: 8360304
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: January 29, 2013
    Assignee: Kulicke and Soffa Industries Inc.
    Inventors: Sung Sig Kang, Hing Kuong Wong, Samuel Capistrano, III, Abdul Shukor Mohd Salleh, Wun Man Oranna Yauw
  • Gas delivery system for reducing oxidation in wire bonding operations
    Patent number: 8313015
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: November 20, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS
    Publication number: 20120286023
    Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
    Type: Application
    Filed: July 25, 2012
    Publication date: November 15, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Dominick A. DeAngelis, Gary W. Schulze
  • Wire payout measurement and calibration techniques for a wire bonding machine
    Patent number: 8302841
    Abstract: A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: November 6, 2012
    Assignee: Kulicke and Soffa Industries
    Inventor: Ivy Wei Qin
  • Closed loop wire bonding methods and bonding force calibration
    Patent number: 8302840
    Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: November 6, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Wei Qin, Ziauddin Ahmad, John David Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu
  • Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
    Patent number: 8251275
    Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: August 28, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dominick A. DeAngelis, Gary W. Schulze
  • WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME
    Publication number: 20120160902
    Abstract: A wire feed system for a wire bonding machine is provided. The wire feed system includes (1) a wire supply, and (2) an air guide for receiving a length of wire from the wire supply. The air guide has an air inlet for receiving a pressurized fluid. The wire feed system is configured to apply a variable tension to the length of wire received by the air guide.
    Type: Application
    Filed: March 7, 2012
    Publication date: June 28, 2012
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: WEI QIN, EDWARD T. LAURENT
  • Solar substrate ribbon bonding system
    Patent number: 8196798
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: June 12, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
  • IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM
    Publication number: 20120128229
    Abstract: A method of imaging a feature of a semiconductor device is provided. The method includes the steps of: (a) imaging a first portion of a semiconductor device to form a first imaged portion; (b) imaging a subsequent portion of the semiconductor device to form a subsequent imaged portion; (c) adding the subsequent imaged portion to the first imaged portion to form a combined imaged portion; and (d) comparing the combined imaged portion to a reference image of a feature to determine a level of correlation of the combined imaged portion to the reference image.
    Type: Application
    Filed: November 10, 2011
    Publication date: May 24, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Paul W. Sucro, Zhijie Wang, Deepak Sood, Peter M. Lister
  • ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS
    Publication number: 20120125977
    Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
    Type: Application
    Filed: August 10, 2010
    Publication date: May 24, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Dominick A. DeAngelis, Gary W. Schulze
  • METHOD OF OPERATING A CLAMPING SYSTEM OF A WIRE BONDING MACHINE
    Publication number: 20120104075
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.
    Type: Application
    Filed: July 19, 2010
    Publication date: May 3, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Sung SIK Kang, Hing Kuong Wong, Samuel Capistrano, III, Mohd Salleh Abdul Shukor, Oranna Yauw
  • Conductive bumps, wire loops, and methods of forming the same
    Patent number: 8152046
    Abstract: A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: April 10, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Gary S. Gillotti
  • METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS
    Publication number: 20120074206
    Abstract: A method of forming a wire bond using a wire bonding machine is provided.
    Type: Application
    Filed: September 19, 2011
    Publication date: March 29, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Wei Qin, Jon W. Brunner, Paul A. Reid
  • SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING TRAJECTORIES IN THE FORMATION OF WIRE LOOPS
    Publication number: 20120065761
    Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
    Type: Application
    Filed: May 17, 2010
    Publication date: March 15, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
  • GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
    Publication number: 20120031877
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Application
    Filed: October 13, 2011
    Publication date: February 9, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME
    Publication number: 20120024089
    Abstract: A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.
    Type: Application
    Filed: February 29, 2008
    Publication date: February 2, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Jeremiah Couey, Michael T. Deley, Shawn Sarbacker, Matthew Odhner
  • Method of teaching eyepoints for wire bonding and related semiconductor processing operations
    Patent number: 8100317
    Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: January 24, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Michael T. Deley, Peter M. Lister, Deepak Sood, Zhijie Wang
  • CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME
    Publication number: 20120006882
    Abstract: A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
    Type: Application
    Filed: March 26, 2010
    Publication date: January 12, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventor: Gary S. Gillotti
  • Gas delivery system for reducing oxidation in wire bonding operations
    Patent number: 8066170
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: November 29, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • Method of forming bends in a wire loop
    Patent number: 8063305
    Abstract: A method of forming a bend in a wire loop is provided. The method includes the steps of: (1) forming a first bend in the wire loop at a predetermined portion of the wire loop; (2) paying out a length of wire after step (1); and (3) forming a second bend in the wire loop at the predetermined portion after step (2).
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: November 22, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Ivy Wei Qin, Romeo Olida