Patents Assigned to Kulicke & Soffa Industries
  • Combination wedge bonding and ball bonding transducer
    Patent number: 8056794
    Abstract: A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least a portion of a bonding tool. The transducer also includes a first tightening mechanism for securing a ball bonding tool in the bonding tool aperture, and a second tightening mechanism for securing a wedge bonding tool in the bonding tool aperture. The first tightening mechanism is distinct from the second tightening mechanism.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: November 15, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Lea Avraham, Beni Nachon, Joseph M. Martin
  • Wire loop and method of forming the wire loop
    Patent number: 8048720
    Abstract: A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: November 1, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dodgie Reigh M. Calpito, O Dal Kwon
  • METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS
    Publication number: 20110174865
    Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
    Type: Application
    Filed: March 28, 2011
    Publication date: July 21, 2011
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Michael T. Deley, Zhijie Wang, Peter M. Lister, Deepak Sood
  • Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE
    Publication number: 20110121053
    Abstract: A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant.
    Type: Application
    Filed: January 27, 2011
    Publication date: May 26, 2011
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Michael P. Schmidt-Lange, Stephen M. Jaeschke
  • Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE
    Publication number: 20110114703
    Abstract: A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant.
    Type: Application
    Filed: January 27, 2011
    Publication date: May 19, 2011
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Michael P. Schmidt-Lange, Stephen M. Jaeschke
  • Method of teaching eyepoints for wire bonding and related semiconductor processing operations
    Patent number: 7931186
    Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: April 26, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Michael T. Deley, Peter M. Lister, Deepak Sood, Zhijie Wang
  • GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
    Publication number: 20110073635
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Application
    Filed: June 8, 2009
    Publication date: March 31, 2011
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • METHOD OF CALIBRATING A CONSTANT VOLTAGE SUPPLY FOR AN ULTRASONIC TRANSDUCER OF A WIRE BONDING MACHINE
    Publication number: 20110056267
    Abstract: A method of calibrating a voltage for use with an ultrasonic transducer of a wire bonding machine in a constant voltage mode is provided. The method includes: (1) determining an impedance value associated with operation of the ultrasonic transducer; and (2) establishing an adjusted voltage level for use with the ultrasonic transducer in the constant voltage mode based on the determined impedance value.
    Type: Application
    Filed: December 21, 2007
    Publication date: March 10, 2011
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Ivy Wei Qin, John D. Molnar, Thomas J. Colosimo
  • WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDING MACHINE
    Publication number: 20110000951
    Abstract: A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).
    Type: Application
    Filed: January 22, 2009
    Publication date: January 6, 2011
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventor: Ivy Wei Qin
  • Linear motor with reduced cogging
    Patent number: 7825549
    Abstract: A linear motor is provided including a magnet track including a plurality of permanent magnets, and a coil assembly including a plurality of laminations. The coil assembly defines a plurality of teeth having slots therebetween. The plurality of teeth include (1) two end teeth and (2) at least one non-end tooth arranged between the two end teeth. Each of the two end teeth defines an end profile including a first surface and a second surface. The first surface and the second surface are separated by a step which is substantially perpendicular to a plane defined by the plurality of magnets. The linear motor also includes a plurality of coils at least partially disposed in at least a portion of the slots defined by the plurality of teeth.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: November 2, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Xiaopeng Wang
  • Probes for a wafer test apparatus
    Patent number: 7808260
    Abstract: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: October 5, 2010
    Assignee: Kulicke And Soffa Industries, Inc.
    Inventors: Lich Thanh Tran, Edward Lambert Malantonio, Edward T. Laurent, Ilan Hanoon, Dan Mironescu
  • WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
    Publication number: 20100230809
    Abstract: A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
    Type: Application
    Filed: January 30, 2008
    Publication date: September 16, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Dodgie Reigh M. Calpito, O Dal Kwon
  • REDUCED OXIDATION SYSTEM FOR WIRE BONDING
    Publication number: 20100230476
    Abstract: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
    Type: Application
    Filed: May 27, 2010
    Publication date: September 16, 2010
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Steven Mak, E. Walter Frasch
  • Electronic flame-off electrode with ball-shaped tip
    Patent number: 7795557
    Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: September 14, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Jon Brunner, Horst Clauberg, John Shuhart
  • LINEAR MOTOR WITH REDUCED COGGING
    Publication number: 20100225179
    Abstract: A linear motor is provided including a magnet track including a plurality of permanent magnets, and a coil assembly including a plurality of laminations. The coil assembly defines a plurality of teeth having slots therebetween. The plurality of teeth include (1) two end teeth and (2) at least one non-end tooth arranged between the two end teeth. Each of the two end teeth defines an end profile including a first surface and a second surface. The first surface and the second surface are separated by a step which is substantially perpendicular to a plane defined by the plurality of magnets. The linear motor also includes a plurality of coils at least partially disposed in at least a portion of the slots defined by the plurality of teeth.
    Type: Application
    Filed: December 20, 2006
    Publication date: September 9, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventor: Xiaopeng Wang
  • CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
    Publication number: 20100186991
    Abstract: A method of forming a conductive bump using a wire-bonding machine is provided. The method includes (a) depositing a free air ball bump on a contact pad of a semiconductor element, (b) forming a first fold of wire on the deposited free air ball bump, and (c) forming a second fold of wire on the first fold of wire.
    Type: Application
    Filed: October 18, 2006
    Publication date: July 29, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Kazunori Tajima, Wei Qin, Stephen E. Babinetz
  • METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS
    Publication number: 20100181365
    Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
    Type: Application
    Filed: March 13, 2007
    Publication date: July 22, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Michael T. Deley, Peter M. Lister, Deepak Sood, Zhijie Wang
  • METHOD OF FORMING BENDS IN A WIRE LOOP
    Publication number: 20100147552
    Abstract: A method of forming a bend in a wire loop is provided. The method includes the steps of: (1) forming a first bend in the wire loop at a predetermined portion of the wire loop; (2) paying out a length of wire after step (1); and (3) forming a second bend in the wire loop at the predetermined portion after step (2).
    Type: Application
    Filed: April 2, 2007
    Publication date: June 17, 2010
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Ivy Wei Qin, Romeo Olida
  • Method of controlling the trajectory of a bonding tool during the formation of a wire loop
    Patent number: 7735716
    Abstract: A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: (1) defining a pivot point with respect to the first point and the second point; (2) determining a plurality of data points for generating the trajectory, each of the data points including a radius value and an angle value as a function of time, each of the angle values being between (a) a first angle defined by the pivot point and the first point, and (b) a second angle defined by the pivot point and the second point; and (3) converting the plurality of data points into trajectory data that may be used by a wire bonding machine.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: June 15, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Wei Qin, Ziauddin Ahmad, Itzhak Barkana, Igor Fokin
  • CLOSED LOOP WIRE BONDING METHODS AND BONDING FORCE CALIBRATION
    Publication number: 20100108744
    Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
    Type: Application
    Filed: October 5, 2007
    Publication date: May 6, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Wei Qin, Ziauddin Ahmad, John David Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu