Patents Assigned to Kulicke & Soffa Industries
  • Bond head link assembly for a wire bonding machine
    Patent number: 7681774
    Abstract: A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: March 23, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: E. Walter Frasch, Richard D. Sadler, Michael P. Schmidt-Lange
  • Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
    Patent number: 7651022
    Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: January 26, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Stephen Babinetz, Takashi Tsujimura, Hiroyuki Ohtsubo, Yasuhiro Morimoto
  • Moveable arm assembly for a wire bonder
    Patent number: 7641097
    Abstract: A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a wedge bonding position. When the moveable arm assembly is in the ball bonding position the at least one component for the ball bonding operation is in a predetermined position for use in the ball bonding operation.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: January 5, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Beni Nachon, Joseph M. Martin, John Randolph Simon
  • Wire bonding apparatus and process
    Patent number: 7637411
    Abstract: A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: December 29, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Richard D. Sadler
  • METHOD OF CONTROLLING THE TRAJECTORY OF A BONDING TOOL DURING THE FORMATION OF A WIRE LOOP
    Publication number: 20090314822
    Abstract: A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: (1) defining a pivot point with respect to the first point and the second point; (2) determining a plurality of data points for generating the trajectory, each of the data points including a radius value and an angle value as a function of time, each of the angle values being between (a) a first angle defined by the pivot point and the first point, and (b) a second angle defined by the pivot point and the second point; and (3) converting the plurality of data points into trajectory data that may be used by a wire bonding machine.
    Type: Application
    Filed: October 25, 2007
    Publication date: December 24, 2009
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Wei Qin, Ziauddin Ahmad, Itzhak Barkana, Igor Fokin
  • WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME
    Publication number: 20090308904
    Abstract: A wire feed system for a wire bonding machine is provided. The wire feed system includes (1) a wire supply, and (2) an air guide for receiving a length of wire from the wire supply. The air guide has an air inlet for receiving a pressurized fluid. The wire feed system is configured to apply a variable tension to the length of wire received by the air guide.
    Type: Application
    Filed: November 9, 2006
    Publication date: December 17, 2009
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Wei Qin, Edward T. Laurent
  • Calibration apparatus for bondhead of wire bonding machine
    Patent number: 7624904
    Abstract: A wire bonding machine including a bondhead assembly having a transducer and a bonding tool is provided. The bondhead assembly is configured for substantially vertical movement with respect to a bonding surface of the wire bonding machine during a wire bonding operation. The wire bonding machine further includes a camera configured to receive images of a portion of the bondhead assembly, the images being used to determine a position where a length of the transducer is substantially parallel to the bonding surface.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: December 1, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: John J. Smith
  • Device clamp for reducing oxidation in wire bonding
    Patent number: 7614538
    Abstract: A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: November 10, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, E. Walter Frasch, Krishnan Rama, Xin Ji Zhang
  • Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE
    Publication number: 20090250503
    Abstract: A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant.
    Type: Application
    Filed: August 30, 2006
    Publication date: October 8, 2009
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Michael P. Schmidt-Lange, Stephen M. Jaeschke
  • Low loop height ball bonding method and apparatus
    Patent number: 7584881
    Abstract: In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to from the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: September 8, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Ivy Wei Qin, Robert Wise
  • Method and apparatus for mapping a position of a capillary tool tip using a prism
    Patent number: 7527186
    Abstract: A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: May 5, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: David T. Beatson, Deepak Sood, Norman Lucas
  • Method and apparatus for measuring the size of free air balls on a wire bonder
    Patent number: 7523848
    Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: April 28, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: David T. Beatson, Deepak Sood, Norman Lucas, Zhijie Wang
  • Low-profile capillary for wire bonding
    Patent number: 7500591
    Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
    Type: Grant
    Filed: August 15, 2007
    Date of Patent: March 10, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: James E. Eder, Jon W. Brunner
  • Multi-part capillary
    Patent number: 7500590
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: March 10, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dan Mironescu, Ziv Atzmon, Gil Perlberg
  • BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME
    Publication number: 20090039141
    Abstract: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
    Type: Application
    Filed: October 13, 2008
    Publication date: February 12, 2009
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Horst Clauberg, Ronald J. Focia, David T. Beatson, Kenneth Kyle Dury
  • Bonding Tool With Improved Finish
    Publication number: 20080314963
    Abstract: A bonding tool includes a body portion terminating at a tip portion. The tip portion is formed from a material, wherein a grain structure of the material is exposed for at least a portion of the tip portion.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 25, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Harel Itzhaky, Giyora Gur, Benjamin Sonnenreich, Ziv Atzmon
  • WIRE BONDING APPARATUS AND PROCESS
    Publication number: 20080314964
    Abstract: A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.
    Type: Application
    Filed: August 26, 2008
    Publication date: December 25, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventor: Richard Deward Sadler
  • Method and apparatus for forming a low profile wire loop
    Patent number: 7464854
    Abstract: A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond. The method also includes forming a looped portion in the wire adjacent the first wire bond. The method also includes lowering the wire bonding tool in a direction towards the first wire bond after the forming step. The lowering step is interrupted prior to the wire bonding tool contacting the first wire bond. The method also includes bonding a second end of the wire to a second bonding location.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: December 16, 2008
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Stephen E Babinetz
  • ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP
    Publication number: 20080264907
    Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
    Type: Application
    Filed: May 2, 2008
    Publication date: October 30, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Jon Brunner, Horst Clauberg, John Shuhart
  • Integrated ball and via package and formation process
    Patent number: 7442641
    Abstract: A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: October 28, 2008
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: David T. Beatson, Jamin Ling