Abstract: A method of manufacturing a vertical structure light emitting diode device, the method including: sequentially forming a first conductivity type III-V group compound semiconductor layer, an active layer, and a second conductivity type III-V group compound semiconductor layer on a substrate for growth; bonding a conductive substrate to the second conductivity type III-V group compound semiconductor layer; removing the substrate for growth from the first conductivity type III-V group compound semiconductor layer; and forming an electrode on an exposed portion of the first conductive III-V group compound semiconductor layer due to the removing the substrate for growth, wherein the bonding a conductive substrate comprises partially heating a metal bonding layer by applying microwaves to a bonding interface while bringing the metal bonding layer into contact with the bonding interface.

Abstract: A light emitting device is provided having high luminous output while maintaining high wall plug efficiency, wherein the high thermal and electrical conductivity paths of the device are separated during the semiconductor wafer and die level manufacturing step. The device includes an electrical conducting mirror layer, which reflects at least 60% of generated light incident on it, and an isolation layer having electrical insulating properties and thermal conducting properties. A first electrode, which is not in contact with the main semiconductor layers of the device, is located on the mirror layer. A light emitting module, system and projection system incorporating the light emitting device are also described, as is a method of manufacture of the device.

Abstract: In one embodiment, a light emitting device comprises two linear arrays of light emitting diodes positioned on opposite sides of a linear heat conducting member. In one embodiment, a light emitting device comprises a heat conducting member linear in a first linear direction with a first surface and a second surface opposite the first surface; a first linear array of light emitting diodes thermally coupled to the first surface; a second linear array of light emitting diodes thermally coupled to the second surface; a first light transmitting cover positioned to receive and transmit light from the first linear array of light emitting diodes; and a second light transmitting cover positioned to receive and transmit light from the second linear array of light emitting diodes. In another embodiment, a method of manufacturing a light emitting device comprises snapping or sliding extensions of the light transmitting covers into the grooves.

Abstract: The invention relates to a light guide panel capable of distributing light beams incident from a light source to an entire surface thereof. The light guide panel has at least two through holes formed in a path of the incident light beams, apart in a predetermined interval from a light incident surface. The through holes are formed perpendicular to the path of the incident light beams, and lined along the light incident surface of the light guide panel. The light guide panel according to the present invention can improve uniformity of incident light without increasing the number or size of the light source, thereby distributing the incident light in a wider angle and decreasing a light mixing region. The light guide panel is produced in a simple manufacturing process, reducing the manufacturing costs.

Abstract: A system for holding an optical rod, contains an optical mount having a hole traversing throughout a body of the optical mount, wherein the optical mount is a c-shaped collar clamp. The system also contains an optical rod having a circumferential area and a split sleeve encompassing the optical rod circumferential area for at least a portion of the axial length of the optical rod. The split sleeve and optical rod are inserted within the optical mount hole, and the split sleeve contains an inner surface and an outer surface, where material of the split sleeve does not conform intimately with the optical rod so as to maintain total internal reflection conditions.

Abstract: Methods and apparatus associated with monitoring and controlling streetlights include monitoring light levels and voltage levels at corresponding streetlights and controlling the streetlights to set or maintain a particular light output at the respective streetlights or providing power consumption estimates for respective streetlights (streetlight specific metering) based on the voltage levels and light levels. A streetlight controller for a streetlight includes a microcontroller; a first sensor to sense a light level from a lamp within the streetlight; a second sensor operative to sense a voltage level on a power supply for the streetlight; and a switching network coupled with the microcontroller and operative to adjust the light level of the lamp. Methods includes monitoring a light level and voltage level and adjusting a light level, estimating power consumption, or facilitating maintenance in accordance with the light level and voltage level.

Abstract: A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.

Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

Abstract: An LED lamp for outdoor and large space lighting, particularly for streets, warehouses car parks and the like, is adapted for fitting into legacy light fittings designed for sodium bulbs and the like. The LED lamp comprises a plurality of light emitting diodes arranged over a surface of the lamp, is rotatably connected through a rotatable electrical connection to a screw-in adaptor for insertion into a legacy screw-in socket, such that the screw in adaptor is rotatable independently of the lamp, so that the legacy screw in socket can be used even though the light fitting is too small to allow rotation of the LED lamp. Additional embodiments provide for cooling airflow through the light fitting, for temperature control of the LEDs, and for failure protection, to ensure a longest possible lamp lifetime.

Abstract: The light fixture includes a ceiling mounted, hollow support body generally comprised of pre-existing fluorescent lighting troffer, a base plate hingedbly mounted to the support body preferably via a hook/slot assembly and comprised of a heat dissipating aluminum material, a power supply unit mounted along a top of the base plate, a plurality of lighting units, each being electrically connected to the power supply unit, and each being mounted to the base plate, the plurality of lighting units each including at least one light emitting element. The lighting units are comprised of a plurality of individual strips dispersed along the bottom of the base plate for optimal heat dispersion. The base plate may have flat or angled mounting surfaces for the lighting units depending on a direction of emitted light and heat dissipation. A diffuser panel may be spaced below the lighting units and hingedbly mounted to the support body.

Abstract: A solid-state LED lighting lamp (SSL-LED lamp), based on AC or DC-emitters, which runs under a high AC or DC voltage, with high light generation capability, high reliability and long lifespan, is disclosed. A plurality of AC or DC-emitter chips are integrated on a thermally conductive submount and the electrically conductive element pathways on the submount provide electrical interconnections between the mounted chips and also between the individual LEDs on each chip. The conducting elements also provide redundant current paths at the AC or DC-emitter chip level and individual LED level. Depending on the detail design, the LED SSL-lamp may be directly powered by an AC voltage (i.e. 110/120V or 220/240V power grid) or a high DC voltage. With this design, the LED SSL-lamp can provide sufficient illumination to replace the incandescent or florescent light bulbs for general lighting purpose. The distributed emitter array design ensures the heat dissipation.

Abstract: An alternating current (AC) driven light emitting device includes a substrate, K number of first light emitting diode (LED) cells arranged in a row on a top surface of the substrate, where K is an integer satisfying K?3, K number of second LED cells arranged in a row parallel to the row of the first LED cells on the top surface of the substrate, and (K?1) number of third LED cells arranged in a row between the respective rows of the first and second LED cells on the top surface of the substrate. The AC driven light emitting device has a connection structure between LED cells to be operable at an AC.

Abstract: The present invention is directed generally to lighting devices, and more particularly to white light LED-based lighting devices configured such that key subassemblies may be replaced, thereby enabling the modification and/or repair of said device.

Abstract: Provided is a laser display device. The laser display device may include at least one light source configured to emit at least one laser beam, at least one scanning unit configured to perform a scanning with the at least one laser beam, and an image forming unit configured to generate excitation light and scattering light by receiving the at least one laser beam from the scanning unit to form an image.

Abstract: A system for luminance characterization of a luminaire includes a ballast coil and a multi-tap capacitor connected in series with the ballast coil. The multi-tap capacitor has a plurality of tap capacitors integrated into a capacitor housing. A plurality of switches are each coupled to one of the plurality of tap capacitors for selectively coupling the tap capacitors together to produce a multi-tap capacitance corresponding to a configuration of the plurality of switches. A lamp is connected in series with the multi-tap capacitor and the ballast coil. A photometer is located to measure light intensity of the lamp and to produce a lumen output measurement. A memory is used to store a database having a plurality of lumen output measurements, each corresponding to a multi-tap capacitance corresponding to all configurations of the plurality of switches.

Abstract: A white light emitting device includes a structure for emitting white light having at least four wavelengths by using two or less LEDs, where the LEDs include a blue/green LED emitting blue and green wavelengths of light. The device also includes means for emitting red wavelength of light.

Abstract: A light emitting diode and a method for fabricating the same are provided. The light emitting diode includes: a transparent substrate; a semiconductor material layer formed on the top surface of a substrate with an active layer generating light; and a fluorescent layer formed on the back surface of the substrate with controlled varied thicknesses. The ratio of light whose wavelength is shifted while propagating through the fluorescent layer and the original light generated in the active layer can be controlled by adjusting the thickness of the fluorescent layer, to emit desirable homogeneous white light from the light emitting diode.

Abstract: The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.

Abstract: The invention relates to a high-output nitride light emitting device. The light emitting device includes a first conductivity type nitride semiconductor layer, an active layer and a second conductivity type nitride semiconductor layer deposited in their order on a substrate. The light emitting device also includes first and second insulation layers formed in different upper surface portions of the nitride semiconductor light emitting device, and first and second bonding pads formed respectively on the first and second insulation layers. The light emitting device further includes first and second extension electrodes extended from the first and second bonding pads and coupled respectively to the first and second conductivity semiconductor layers. The electrode arrangement according to the present invention prevents direct coupling between the bonding pads and the light emitting device, thus allowing a symmetrical structure that can achieve more uniform current spreading using only the extension electrodes.

Abstract: A full-voltage AC LED module includes a circuit substrate having a first bridge rectifier circuit comprising a set of first load nodes and a set of first power nodes and a second bridge rectifier circuit comprising a set of second load nodes and a set of second power nodes, and a LED module packaged in the circuit substrate and having a first light-emitting device formed of a series of light-emitting diodes and electrically connected to the set of first load nodes and a second light-emitting device formed of a series of light-emitting diodes and electrically connected to the set of second load nodes. By means of connecting the set of first power nodes and the set of second power nodes in series or in parallel, the required input voltage for starting up the LED module is relatively changed.