Abstract: An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed.

Abstract: A white light LED-based lighting device configured for direct form, fit, and function replacement of existing incandescent and fluorescent devices is provided. The white light LED-based lighting device comprises a group of solid state light emitting diodes, electronics to activate the light emitting diodes, and an encapsulating housing configured for direct form, fit, and function replacement of existing devices.

Abstract: The present invention is directed generally to lighting devices, and more particularly to white light LED-based lighting devices configured such that key subassemblies may be replaced, thereby enabling the modification, upgrade and/or repair of said device.

Abstract: The invention relates to a method for shaking sample containers, especially micro titer plates, and to a shaking apparatus, comprising an oscillating plate holding the sample containers and an exciter drive for generating the oscillating movement of the oscillating plate. The oscillating plate is made to oscillate in resonance oscillation, with the oscillating plate being connected in a flexurally rigid manner with an apparatus base preferably by at least four spring elements which consist of several individual springs and is held in an oscillating plane.

Abstract: A tunable colour LED module comprises at least two sub-modules, each comprising an LED, a wavelength converting element (WCE) and a reflector cup. The total light emitted by the module comprises light generated from each LED and WCE and the module is configured to emit a total light having a predefined colour chromaticity when activation properties of the LEDs are managed appropriately. The total light may have a broad white emission spectrum. The module combines the benefits of a low cost with uniform chromaticity properties in the far field, and offers long and controlled lifetime at the same time as flexibility and intelligence of tunable colour chromaticity, Colour Rendering Index (CRI) and intensity, either at manufacture or in an end user lighting application. A controlled LED module system comprises a control system for the managing activation properties of the LEDs in the sub-modules. Also described is a method of manufacture.

Abstract: An optical module for an lighting fixture for providing roadway illumination. The optical module comprising circuit board having a plurality of light emitting diodes (LEDs). A reflector cups surrounds each of the plurality of LEDs, the cup comprises a narrow end surrounding the LED and a larger opening at a second end opposite the LED. A refractor lens cover comprising a plurality of molded lens, each lens positioned at the second end of the reflector cups.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: A tunable colour LED module comprises at least two sub-modules, each comprising an LED, a wavelength converting element (WCE) and a reflector cup. The total light emitted by the module comprises light generated from each LED and WCE and the module is configured to emit a total light having a predefined colour chromaticity when activation properties of the LEDs are managed appropriately. The total light may have a broad white emission spectrum. The module combines the benefits of a low cost with uniform chromaticity properties in the far field, and offers long and controlled lifetime at the same time as flexibility and intelligence of tunable colour chromaticity, Colour Rendering Index (CRI) and intensity, either at manufacture or in an end user lighting application. A controlled LED module system comprises a control system for the managing activation properties of the LEDs in the sub-modules. Also described is a method of manufacture.

Abstract: An adjusting unit disposed between a housing including at least one or more semiconductor optical devices and a case accommodating an SMPS, so as to adjust the height of the casing. At least one or more light emitting modules are mounted on the bottom surface of the housing, and a position determining unit is disposed in the housing in correspondence to an edge of the light emitting module. A heat sink unit is provided in correspondence to the top surface of the housing. Therefore, transport costs can be significantly reduced by securing the loading space. The semiconductor optical devices serving as a light source can be appropriately arranged, and the semiconductor optical devices can be mounted at accurate positions. Furthermore, products can be rapidly mass-produced due to a simplified manufacturing process thereof.

Abstract: A lighting fixture and power supply are provided that allows a power factor correction (PFC) single ended primary inductance controller (SEPIC) that provides a controlled voltage output to provide a constant current to an LED load. The power supply provides an efficient and stable power supply for LEDs. Multiple power supplies can be provided on the same printed circuit board to control multiple LED channels.

Abstract: An LED light source assembly for signage illumination includes one or more planar LED arrays located with respect to a light spreading system for uniformly distributing light onto a viewing surface. The light spreading system includes a plurality of reflectors in combination with a transverse deflector disposed directly above and in the light emanating path of a planar LED array. The transverse deflector is oriented angularly and projects at least a portion of light onto a lateral reflector of the light spreading system. In one embodiment, a heat dissipation fixture is supported external to a housing assembly for improved heat management. The LED arrays and the plurality of reflectors and transverse deflectors are affixed directly to the heat dissipation fixture.

Abstract: A LED Chip-on-Board (COB) module comprises a plurality of LED die arranged on a substrate in one or more radially concentric rings about a center point such that each LED die is azimuthally offset from neighboring LED die. The module includes thermal conduction pads each having lateral dimensions at least as large as the combined lateral dimensions of the LED die attached to it and a total surface area at least five times larger than the total surface area of all the LED die attached to it. At the same time, the total light emission area of the module is no greater than four times larger than the combined total surface emission area of all the individual LED die disposed on the substrate. A variety of configurations are possible subject to these criteria, which permit good packing density for enhanced brightness while ensuring optimal heat transfer. A method of manufacturing the module is also provided.

Abstract: The present invention relates a centrifuge drive head for releasably connecting a driving system to a rotor of a centrifuge. The centrifuge drive head comprises a base body mounted for rotation about an axis of rotation (R) and at least a first and a second coupling element, mounted on the base body for swinging outwardly about a swivel axis. The first and second coupling elements differ from each other. The present invention further relates to a set for a centrifuge, which comprises, in addition to the centrifuge drive head, a hub of a rotor, into the recess of which the first and/or second coupling element can be swiveled depending on their configuration, and also to a centrifuge.

Abstract: An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed.

Abstract: A lighting device is disclosed herein. The lighting device includes an optic holder designed to hold optic elements over a light emitting diode (LED). The optic holders design ensures that the LEDs dome is not damaged during the assembly of the lighting device. Open covers and closed covers are provided in order to allow or block light from the LEDs to come out of the lighting device or to block empty LED locations within the lighting device in order to provide an esthetic looking facade to the lighting device.

Abstract: A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer molded wavelength conversion layer disposed on at least one surface of the light-transmitting member. The transfer molded wavelength conversion layer includes a resin and a phosphor.

Abstract: An optical semiconductor lighting apparatus includes: a light emitting module including one or more semiconductor optical devices; a switching mode power supply (SMPS) connected to the light emitting module; a housing disposed to be adjacent to the light emitting module, in which the housing has both ends opened and accommodates the SMPS; a first heat dissipation unit disposed at an inner side of the housing; and a second heat dissipation unit disposed radially at an outer side of the housing and formed from an outer side of one end portion of the housing to the edge of the light emitting module. The first heat dissipation unit includes a plurality of heat dissipation plates through which the heat pipe penetrates, and a plurality of vent portions formed on the heat dissipation plates.

Abstract: A light emitting device (LED) employs one or more conductive multilayer reflector (CMR) structures. Each CMR is located between the light emitting region and a metal electrical contact region, thereby acting as low-loss, high-reflectivity region that masks the lossy metal contact regions away from the trapped waveguide modes. Improved optical light extraction via an upper surface is thereby achieved and a vertical conduction path is provided for current spreading in the device. In an example vertical, flip-chip type device, a CMR is employed between the metal bottom contact and the p-GaN flip chip layer. A complete light emitting module comprises the LED and encapsulant layers with a phosphor. Also provided is a method of manufacture of the LED and the module.