Abstract: A low-dropout voltage regulator is provided. The low-dropout voltage regulator includes a differential amplifier pair, a secondary amplification circuit that is self-stabilized, an output circuit, and a frequency compensation circuit. The secondary amplification circuit includes a first amplification transistor and a second amplification transistor. The first amplification transistor includes a first terminal, a second terminal, and a third terminal. The second amplification transistor includes a first terminal, a second terminal, and a third terminal. The second terminal of the first amplification transistor is electrically connected to the second terminal of the second amplification transistor to form an input terminal of the secondary amplification circuit to be connected to an output terminal of the differential amplifier pair.

Abstract: A power supply apparatus includes a plurality of switches, a current sensing circuit and a controller. The current sensing circuit is configured to sense an output current of the power supply apparatus. The controller includes a differentiator circuit that is coupled to the current sensing circuit and is configured to detect a rate of change of the output current. The controller further includes a pulse frequency modulation circuit that is configured to generate a plurality of first switching signals. The controller is configured to regulate a switching frequency of the plurality of first switching signals according to the rate of change of the output current in response to determining that the rate of change of the output current is greater than a rate threshold value and the switching frequency of the plurality of first switching signals is greater than a frequency threshold value.

Abstract: A converter includes a transformer, a first switching circuit, a second switching circuit and a controller. The first switching circuit is coupled to a first side of the transformer, and is controlled by a first driving signal to transfer power to the transformer during a first enabling period. The second switching circuit is coupled to a secondary side of the transformer, and is controlled by a second driving signal to transfer power received from the transformer. The controller is configured to provide the first driving signal to the first switching circuit, to provide the second driving signal to the second switching circuit, generate the second driving signal according to the first driving signal of a same driving period, and enable a second enabling period of the second driving signal during the same driving period.

Abstract: A bidirectional voltage converter that includes a transformer, a first bridge circuit, a second bridge circuit and a controller is introduced. The first bridge circuit is coupled to a first side of the transformer and a first voltage source, and the first bridge circuit comprises a first switch, a second switch, a third switch and a fourth switch. The second bridge circuit is coupled to a second side of the transformer and a second voltage source. The controller is configured to set the first bridge circuit to a half-bridge configuration by turning off the third switch, turning on the fourth switch, and alternately turning on and off the first switch and the second switch in response to determining that a voltage of the second voltage source is less than a predetermined threshold. An operation method of the bidirectional voltage converter is also introduced.

Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.

Abstract: A liquid cooled enclosure for transfer heat from a printed circuit board assembly (PCBA) which is disposed inside the liquid cooled enclosure is introduced. The liquid cooled enclosure includes a first cover structure, a cooler structure and a second cover structure. The cooler structure, which is mounted on the first cover structure, includes a hollow tube with a predefined shape pattern. The second cover structure includes an elastic pad that is disposed on a surface of the second cover structure. The PCBA is floatingly mounted on the elastic pad of the second cover structure, and the elastic pad is configured to push the PCBA toward the cooler structure such that heat from the PCBA is dissipated via the cooler structure.

Abstract: A current driving circuit configured to drive a light-emitting device is provided. The current driving circuit includes a first current generating circuit, a second current generating circuit and a driver circuit. The first current generating circuit is configured to generate a reference current. The second current generating circuit includes at least one variable resistor, and may generate a compensation current according to the at least one variable resistor. The at least one variable resistor is selected from at least one of a positive TCR resistor and a negative TCR resistor. The driver circuit is coupled to the first current generating circuit and the second current generating circuit, and configured to receive the reference current and the compensation current to serve as a driving current. The driver circuit outputs the driving current to drive the light-emitting device.

Abstract: A power module includes a first shell, a second shell, a circuit board assembly, and a heat dissipation encapsulation. The second shell is closed relative to the first shell and forms an accommodating space together with the first shell. The circuit board assembly is disposed in the accommodating space, and includes a circuit board body, a plurality of power components disposed on the circuit board body, and a plurality of electrical connectors electrically connected to the circuit board body. The electrical connectors are exposed from the first shell. The heat dissipation encapsulation is filled in the accommodating space and covers the circuit board assembly.

Abstract: An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.

Abstract: A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.

Abstract: A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.

Abstract: A system and method for detecting a flicker frequency, and electronic device including the system are provided. The system includes an optical sensor, a sequence generator, a first and a second computing circuit. The optical sensor converts an incident light into a digital sequence according to a sampling frequency, which is greater than at least twice the flicker frequency. The sequence generator generates a first reference sequence and a second reference sequence that is delayed by a period from the first reference sequence, which are periodic according to the flicker frequency and the sampling frequency. The first computing circuit computes a first and a second correlation coefficient. The second computing circuit computes a detection score that indicates a probability of existence of the flicker frequency according to the first and the second correlation coefficient.

Abstract: A method for building a simulation program with integrated circuit emphasis (SPICE) circuit model of an optical coupler is provided. The method includes: providing a plurality of electrical parameters of the SPICE circuit model of the optical coupler circuit for a plurality of temperature values, and building the SPICE circuit model of the optical coupler at each of the temperature values according to the electrical parameters of the optical coupler for each of the temperature values, so as to form a plurality of temperature-independent SPICE circuit models of the optical coupler; forming a plurality of temperature-voltage conversion switch circuit elements by utilizing control of a voltage source and temperature characteristics of an impedance; and connecting the temperature-voltage conversion switch circuit elements to the temperature-independent SPICE circuit models of the optical coupler, respectively, so as to build a temperature characterized SPICE circuit model of the optical coupler.

Abstract: Disclosed are a heart rate detection system and a wearable device using the same. The heart rate detection system includes a light emitting unit, a light sensor and a processor. The light emitting unit emits a light to a human body. The light sensor senses a reflected light of the light and accordingly generates a first electric signal. The processor calculates the low-frequency noise signal and the high-frequency noise signal of the first electric signal, and removes them. After that, the processor executes a peak detection with respect to the first electric signal to calculate peak values of the first electric signal, and calculate a heart rate based on the time intervals among the peak values.

Abstract: A fault detector circuit is provided for detecting or controlling any signal related to a laser emitter in an electronic device. The fault detector circuit includes a first NMOS transistor and a comparator. A drain of the first NMOS transistor is coupled to a first supply voltage through the laser emitter. A gate of the first NMOS transistor is coupled to a control voltage. A source of the first NMOS transistor is grounded. The comparator is coupled to the drain of the first NMOS transistor and a reference voltage. The comparator compares a voltage of the drain of the first NMOS transistor with the reference voltage to generate a first detecting signal for determining whether or not the first supply voltage of the laser emitter needs to be cut off.

Abstract: A liquid distribution module is configured to be connected to a cold plate. The liquid distribution module includes a main body, an inlet manifold, a flow control valve, and an outlet manifold. The inlet manifold is disposed on the main body and connected to the cooling liquid source. The inlet manifold includes a plurality of liquid inlets, wherein the plurality of liquid inlets are configured to connect a plurality of cold plate inlets of the cold plate respectively. The flow control valve is connected to the inlet manifold. The outlet manifold is disposed on the main body and includes a plurality of liquid outlets, wherein the plurality of liquid outlets are configured to connect a plurality of cold plate outlets of the cold plate respectively.

Abstract: A proximity sensor module with two sensors, including a package housing, a circuit substrate, an light emitter and a sensing assembly. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure, and a second accommodation space defined by the second package structure and the partition structure. The light emitter is arranged in the first accommodating space and is disposed on the circuit substrate. The sensing assembly includes a first sensor and a second sensor. The first sensor and the second sensor are arranged in the second accommodating space, and the first sensor is farther from the light emitter than the second sensor.

Abstract: The invention provides a noise filtering method for a motor. The motor rotates according to an operating voltage. The noise filtering method includes: setting an inspection period and a minimum threshold. The noise filtering method further includes: generating a pulse signal according to the operating voltage, determining whether a time corresponding to each sub-pulse signal in the pulse signal meets the inspection period, and determining whether a pulse width corresponding to each sub-pulse signal is equal to or greater than the minimum threshold. A recording medium storing a program code corresponding to the method, and a motor control circuit for executing the program code are also provided.

Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Abstract: An encoding and decoding method for an optical isolation amplifier including an encoder, an optical driver, a light source, an optical detector, and a decoder, and employing sigma-delta modulation technology is provided. The method includes: generating a plurality of first pulses, each having a predetermined pulse width, through the encoder when an input digital signal experiences an input pulse rising or falling edge; outputting an encoded signal having the plurality of first pulses to the optical driver; driving the light source through the optical driver, according to the plurality of first pulses, so as to output an encoded optical signal; generating a detected signal through the optical detector detecting the encoded optical signal, and the detected signal has a plurality of second pulses; and duplicating the input digital signal of the encoder through the decoder, according to the detected signal having the plurality of second pulses.