Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a sensing assembly and a transmitter unit. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing and includes a first transmitter and a second transmitter both disposed on the circuit board. One of the first transmitter and the second transmitter is closer to the sensing assembly.

Abstract: A method for ambient light subtraction providing a sensor having an emitter, a receiver, and a processor; performing a first sampling process, during which the emitter does not emit signals, the receiver receives a first ambient light signal converted into a first data set by the processor; performing a second sampling process, during which the emitter emits a detecting signal, the receiver receives a second ambient light signal and the detecting signal converted into a second data set by the processor; performing a third sampling process, during which the emitter does not emit signals, the receiver receives a third ambient light signal converted into a third data set by the processor; deriving an average value by calculating the average of the first data set and the third data set; and deriving a difference value by calculating the difference between the second data set and the average value.

Abstract: A comparator circuit includes a first comparator, a second comparator and an inverter. The first comparator includes two N-channel metal-oxide-semiconductor (NMOS) transistors, two first P-channel metal-oxide-semiconductor (PMOS) transistors and two second PMOS transistors. A gate of the NMOS transistors respectively receives first and second voltages, and sources of the first PMOS transistors are connected to first and second resistors, respectively. The first comparator outputs differential output signals from drains of the NMOS transistors according to the voltage difference between the first and second voltages. An output of the second comparator is connected to gates of the first PMOS transistors of the first comparator. An input of the inverter is connected to the output of the second comparator, and an output of the inverter is connected to gates of the PMOS transistors.

Abstract: The present invention provides a leadframe component and a package structure. The leadframe component includes a first leadframe and a second leadframe. The first leadframe includes a first chip-mounting portion for carrying a first chip, a first coil portion, a plurality of first pins and a plurality of first floated pins. The second leadframe includes a second chip-mounting portion for carrying a second chip, a second coil portion, a plurality of second pins and a plurality of second floated pins. The first leadframe is disposed above or under the second leadframe for aligning the first coil portion with the second coil portion.

Abstract: The invention provides a noise filtering method for a motor. The motor rotates according to an operating voltage. The noise filtering method includes: setting an inspection period and a minimum threshold. The noise filtering method further includes: generating a pulse signal according to the operating voltage, determining whether a time corresponding to each sub-pulse signal in the pulse signal meets the inspection period, and determining whether a pulse width corresponding to each sub-pulse signal is equal to or greater than the minimum threshold. A recording medium storing a program code corresponding to the method, and a motor control circuit for executing the program code are also provided.

Abstract: The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.

Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a transmitter unit and a sensing assembly. The transmitter unit includes a first transmitter and a second transmitter. The first transmitter and the second transmitter are disposed on the circuit board. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing. One of the first transmitter and the second transmitter is nearer to the sensing assembly than the other one is.

Abstract: A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.

Abstract: The instant disclosure provides a method for manufacturing a package structure of a folding magnetic coupling isolator. The method includes providing a leadframe structure including a frame body and a first and a second leadframes connected to the frame body, the first and second leadframes including first and second chip-mounting portions, first and second coil portions, and a plurality of first and second pins and floated pins; disposing the first and second chips on the first and second chip-mounting portions and establishing electrical connections between the first and second chips and the first and second pins; and rotating the first leadframe relative to the frame body and moving the first leadframe to a position above or under the second leadframe, thereby electrically isolating the first leadframe from the second leadframe. The first coil portion and the second coil portion are aligned with and magnetically coupled to each other.

Abstract: The instant disclosure includes a magnetic coupling package structure with duo leadframes for a magnetically coupled isolator and a method for manufacturing the same. The method includes a leadframe providing step, a chip connecting step and a coil alignment step. The leadframe providing step includes providing a first and a second leadframe each including a chip carrying portion, a coil portion, a plurality of pins and floating pins. The chip connecting step includes disposing at least a first chip and at least a second chip onto the corresponding chip carrying portions for electrically connecting the chips to the pins. The coil alignment step includes arranging the first leadframe above or beneath the second leadframe and applying a first and a second magnetic field to the first and the second leadframes respectively for aligning the coil portions, thereby controlling the coupling effect between two coil portions.

Abstract: Disclosed is a differential transimpedance amplifier (TIA). In the differential TIA, an input end of the first source follower is coupled to the first output end of a first differential amplification circuit. The output end of the first source follower is coupled to the second input end of a second differential amplification circuit with feedback and a first feedback resistor. The input end of a second source follower is coupled to the second output end of the first differential amplification circuit. The output end of the second source follower is coupled to the first input end of the second differential amplification circuit with feedback and a second feedback resistor. A photo diode and a dummy diode are coupled respectively to two input ends of the first differential amplification circuit.

Abstract: The present disclosure provides a portable electronic device and an optical proximity sensor module thereof. The optical proximity sensor module includes a circuit substrate, a light-emitting element, an optical proximity sensor element, a light-transmitting package structure and a light-shielding structure. The light-emitting element and the optical proximity sensor element are disposed on the circuit substrate. The light-transmitting package structure includes a first package body disposed on the circuit substrate to enclose the light-emitting element and a second package body disposed on the circuit substrate to enclose the optical proximity sensor element. The light-shielding structure is disposed on the light-transmitting package structure to enclose one part of the first package body and one part of the second package body.

Abstract: A buffer circuit receives a working supply voltage which may vary within a voltage range. The buffer circuit has a high voltage constant current buffer circuit, and in this circuit, the source of the first NMOS transistor is grounded, and drains of the first NMOS transistor and the first PMOS transistor are connected. The source of the second PMOS transistor is connected to the supply voltage input of the buffer circuit, and the drain of the second PMOS transistor is connected to the source of the first PMOS transistor. The input end of the high voltage diode connected composite transistors is connected to the supply voltage input of the buffer circuit, and the output end of the diode connected transistors is connected to the gates of first and second PMOS transistors. The first PMOS and NMOS transistors are high-voltage transistors. The second PMOS transistor is a low-voltage transistor.

Abstract: A low-dropout shunt voltage regulator is provided, which includes a first current mirror module, a second current mirror module and an output module. A first terminal of the first current mirror module is electrically connected to the input voltage. The first current mirror module has high output resistance. A first terminal of the second current mirror module is electrically connected to a second terminal of the first current mirror module. A second terminal of the second current mirror module is electrically connected to a reference voltage. An output terminal of the output module is electrically connected to the third terminal of the first current mirror module. The output terminal and a first terminal of the output module are both connected to the second current mirror module. A second terminal of the output module is electrically connected to the reference voltage.

Abstract: A proximity sensor and a mobile device using the same are provided. The proximity sensor includes a circuit board, an emitter package, a receiver package, a plastic casing and a lens. The emitter package is disposed on the circuit board and includes an emitter and an emitter housing. The receiver package is disposed on the circuit board and includes a receiver and a receiver housing. The plastic casing covers the emitter package and the receiver package. The plastic casing includes a first opening corresponding to the emitter package and a second opening corresponding to the receiver package. The first opening has a first geometric centerline and the second opening has a second geometric centerline. The height of the emitter package is smaller than that of the receiver package, and the emitter is disposed between the first geometric centerline and the second geometric centerline.

Abstract: A light-emitting diode package structure, a light-emitting device and a method of making the same are provided. The light-emitting diode package structure includes an insulating base, a first conductive unit, a second conductive unit and at least one light-emitting diode chips. The first conductive unit is disposed on the insulating base. The second conductive unit is disposed on the insulating base and separated from the first conductive unit. The at least one light-emitting diode chips is electrically connected to the first conductive unit and the second conductive unit. Further, the first conductive unit has a first groove, and an outer surface thereof is divided by the first groove into two separated parts. In addition, the second conductive unit has a second groove, and the outer surface thereof is divided by the second groove into two separated parts.

Abstract: Disclosed is a transimpedance amplifier, comprising a first-stage trans-conductance amplifier TCA, a second-stage TCA, a third-stage amplifier and a feedback circuit. The first-stage TCA is electrically connected to an input current source to receive a first input signal, and outputs a first output signal. The second-stage TCA is electrically connected to the first-stage TCA to receive the first output signal, and outputs a second output signal. The third-stage amplifier is electrically connected to the second-stage TCA to receive the second output signal, and outputs a third output signal. One end of the feedback circuit is electrically connected to the input of the first-stage TCA, and the other end of the feedback circuit is electrically connected to the output of the third-stage amplifier to stabilize the third output signal. The third-stage amplifier is composed of a first output stage and a second output stage.

Abstract: A detection device and a method of manufacturing the same are disclosed. The detection device includes a detection module and a housing module disposed on the detection module. The detection module includes a substrate, an emission unit, and a detection unit. The substrate includes an emission end area on which the emission unit is disposed, and a receiver end area on which the detection unit is disposed. The housing module includes a plastic housing unit having a receiving space and an opening, and a metallic shielding unit disposed on the plastic housing unit. The receiving space is divided into a first receiving space and a second receiving space by the metallic shielding unit, and the opening is divided into an emission hole and a detection hole by the metallic shielding unit. By the above-mentioned means, the distance between the emission hole and the detection hole is reduced.

Abstract: An exemplary embodiment of the present disclosure illustrates a gesture sensing module disposed on a substrate. The gesture sensing module includes at least one light emitting unit, at least one light sensor, and a control circuit. The light emitting unit provides a light to illuminate a sensing area, wherein a central optical axis of the light forms an angle with a normal vector of the substrate, and the angle is not equal to 0. The light sensor senses a reflection light which a target in the sensing area reflects the light, and generate a sensing signal according to the reflection light. The control circuit coupled to the light sensor and the light emitting unit determines a traveling direction of the target according to the sensing signal.

Abstract: A SMD type Fresnel LED micro flash light structure, which is adapted to a camera of a mobile phone, includes a housing, an array-type light source and a micro-cylindrical Fresnel lens. The housing has a bottom wall and a plurality of side walls, and defines a longitudinal direction and a width direction. The array-type light source is disposed on the bottom wall along the longitudinal direction. The micro-cylindrical Fresnel lens covers the housing, and includes a cylindrical plano-convex lens, and two teeth-shaped lens sections respectively arranged at two sides of the cylindrical plano-convex lens. Each teeth-shaped lens section has a plurality of bar teeth-shaped lenses. The cylindrical plano-convex lens and the bar teeth-shaped lenses are parallel to each other along the width direction. A central axis of the cylindrical plano-convex lens is corresponding to a central position of the array-type light source.