Abstract: A stacked photodiode structure comprises a first-conductivity-type substrate, a second-conductivity-type well region and a first-conductivity-type well region. The first-conductivity-type substrate has a first surface for light incidence and a grounding terminal. The second-conductivity-type well region is formed in the first-conductivity-type substrate and adjacent to the first surface. The first-conductivity-type well region is formed in the second-conductivity-type well region and adjacent to the first surface. A PN junction between the first-conductivity-type well region and the second-conductivity-type well region generates free electrons responsive to visible light spectrum. A PN junction between the second-conductivity-type well region and the first-conductivity-type substrate generates free holes and free electrons responsive to mainly IR light.

Abstract: An ambient light sensing method is provided. The ambient light sensing method comprises: acquiring the sensitivity settings, an exposure time and obtaining a sensing signal of a light sensor according to the sensitivity settings and the exposure time; determining whether the magnitude of the sensing signal is within a predetermined range when the sensing signal is available, wherein the predetermined range has an upper value and a lower value; updating the sensitivity settings and the exposure time of the light sensor according to the determined result for the magnitude of the sensing signal; and acquiring the sensing signal of the light sensor with the updated sensitivity settings and the updated exposure time.

Abstract: An exemplary embodiment of the present disclosure illustrates a proximity sensing method used in a controller of a proximity sensing device. Firstly, a cross talk value is initialized. After the cross talk value is initialized, whether the cross talk value should be updated is judged at least according to a first sensing value currently received from a sensing unit of the proximity sensing device. When the cross talk value is judged to be updated, the cross talk value is updated at least according to a first sensing value. Then, a compensated sensing value is obtained by subtracting the cross talk value from the first sensing value.

Abstract: An exemplary embodiment of the present disclosure illustrates a proximity sensing method used in a controller of a proximity sensing device. Firstly, a cross talk value is initialized. After the cross talk value is initialized, whether the cross talk value should be updated is judged at least according to a first sensing value currently received from a sensing unit of the proximity sensing device. When the cross talk value is judged to be updated, the cross talk value is updated at least according to a first sensing value. Then, a compensated sensing value is obtained by subtracting the cross talk value from the first sensing value.

Abstract: A manufacturing method of light emitting units is shown below. First step is providing a substrate with multi circuit areas. A light emitting diode is mounted on the circuit area respectively. Next step is forming a package structure to cover the light emitting diode. Next step is dicing the package structure to form a biconic package structure. The package structure is diced twice in two directions, respectively. As above-mentioned, the light emitting unit has asymmetric light radiation pattern.

Abstract: A stacked photodiode structure comprises a first-conductivity-type substrate, a second-conductivity-type well region and a first-conductivity-type well region. The first-conductivity-type substrate has a first surface for light incidence and a grounding terminal. The second-conductivity-type well region is formed in the first-conductivity-type substrate and adjacent to the first surface. The first-conductivity-type well region is formed in the second-conductivity-type well region and adjacent to the first surface. A PN junction between the first-conductivity-type well region and the second-conductivity-type well region generates free electrons responsive to visible light spectrum. A PN junction between the second-conductivity-type well region and the first-conductivity-type substrate generates free holes and free electrons responsive to mainly IR light.

Abstract: An ambient light sensing method, comprising: acquiring the sensitivity settings, an exposure time and obtaining a sensing signal of a light sensor according to the sensitivity settings and the exposure time; determining whether the magnitude of the sensing signal is within a predetermined range when the sensing signal is available, wherein the predetermined range has an upper value and a lower value; updating the sensitivity settings and the exposure time of the light sensor according to the determined result for the magnitude of the sensing signal; and acquiring the sensing signal of the light sensor with the updated sensitivity settings and the updated exposure time.

Abstract: The instant disclosure relates to a method of manufacturing proximity sensor includes the steps of providing a substrate having emitters and detectors disposed thereon. A sensor area is defined by one emitter with the adjacent detector. Wire bonding the emitters and detectors to the substrate for electrical connection. Molding a plurality of housings corresponds to each of the sensor areas and encapsulates the emitters and detectors. A shield having a plurality of apertures is provided and disposed atop the housings. After injection molding, an isolation layer is formed between the shield and substrate. Singulation is followed by injection molding to separate each of the sensor areas.

Abstract: A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Abstract: An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.

Abstract: An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.

Abstract: The instant disclosure relates to an integrated optic module for adapting in a finger sensing apparatus. The integrated optic module comprises an illumination portion including a light guiding array arranged to direct incident light from the electronic module toward the window module at a predetermined angle of incidence and an imaging portion having an imaging lens array arranged thereon to direct reflected light from the window module toward the electronic module for photo imaging. The micro-lens array includes an elongated recognition unit having a row axis substantially normal toward the light guiding array and a navigation unit adjoining the recognition unit and offsetting the row axis thereof. The optic module mediates a window module and an electronic module to provide both finger navigation and fingerprint recognition capabilities.

Abstract: A manufacturing method of light emitting units is shown below. First step is providing a substrate with multi circuit areas. A light emitting diode is mounted on the circuit area respectively. Next step is forming a package structure to cover the light emitting diode. Next step is dicing the package structure to form a biconic package structure. The package structure is diced twice in two directions, respectively. As above-mentioned, the light emitting unit has asymmetric light radiation pattern.

Abstract: A tapping detection method of an optical navigation module is disclosed. The module includes an optical sensor and a processor. The method includes steps of calculating a displacement quantity of an object contacting with the optical navigation module according to a sense image sensed by the optical sensor, and comparing the displacement quantity with a displacement threshold value. When the displacement quantity is smaller than the displacement threshold value, the method further includes steps of calculating a brightness difference value of the sense image, and comparing the brightness difference value with a brightness threshold value. When the brightness difference value is smaller than the brightness threshold value, the optical navigation module may be determined to be tapped by the object.

Abstract: An image processing method includes the following steps. The first step is utilizing a linear image capturing apparatus with odd number of image capturing units to capture image portions of object. Next step is taking the image portions which are captured by the first-end and the right-end image capturing units as the reference and comparing the image portions which are captured by the central image capturing units with the reference so as to correct and eliminate the overlapped noise. Next step is interlacing and re-constructing the processed image portions which have no overlapped portions as the integrated image.

Abstract: A detection method of an optical navigation device is disclosed. The device is used for determining whether an object is lifted from the optical navigation device or not. The method includes steps of reading the detection image detected by the optical navigation device, calculating the image signal value thereof during non-lift status, and integrating a historical threshold value with the image signal value according to adaptive factors for generating an adjustment threshold value serving as the navigation threshold of the detection image. The historical threshold value is the navigation threshold of a former detection image of the detection image. A step of comparing the adjustment threshold with the image signal value for determining whether the image signal value passes the navigation threshold or not may also be included. If the image signal value does not pass the navigation threshold, the object is determined as in the lift status.

Abstract: A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Abstract: A surface mounted LED package includes an insulated body, a first conductive part, a second conductive part, a LED chip and a bonding wire. The insulated body has a receiving portion and a bond-pad island. The receiving portion is formed with an inner side wall and a flat bottom. The bond-pad island is formed with a bonding plane. The first conductive part has a LED chip and a first solder pin extended to an outer surface of the insulated body. The second conductive part has a second contacting portion and a second solder pin extended to an outer surface of the insulated body. The LED chip is disposed on the second contacting portion. The bonding wire connects the LED chip to the first contacting portion. The present application further provides a manufacturing method for surface mounted LED package.

Abstract: The instant disclosure relates to an integrated optic module for adapting in a finger sensing apparatus. The integrated optic module comprises an illumination portion including a light guiding array arranged to direct incident light from the electronic module toward the window module at a predetermined angle of incidence and an imaging portion having an imaging lens array arranged thereon to direct reflected light from the window module toward the electronic module for photo imaging. The micro-lens array includes an elongated recognition unit having a row axis substantially normal toward the light guiding array and a navigation unit adjoining the recognition unit and offsetting the row axis thereof. The optic module mediates a window module and an electronic module to provide both finger navigation and fingerprint recognition capabilities.

Abstract: A transceiver includes a lead-frame, a signal emitter, a signal receiver, and a coupling lens. The signal emitter and the signal receiver are attached on a same pad of the lead-frame. The coupling lens covers the signal emitter and the signal receiver. Since the positions of the signal emitter and the signal receiver are adjacent to each other, the coupling lens can be used to couple the signal emitter and the signal receiver for transmitting and receiving signals.