Abstract: In accordance with the present invention, there are provided free-radical polymerizable compositions comprising polycyclic olefins, wherein the polycyclic olefins contain little, if any, cyclopentenyl unsaturation. As a result, these olefins are sufficiently reactive with the propagating free-radicals during cure to provide a highly crosslinked thermoset resin. Moreover, invention compositions comprise high molecular weight polycyclic olefins having low volatility. Accordingly, the observed undesirable weight loss upon cure of prior art thermosetting compositions is considerably reduced. Further provided by the present invention are compositions comprising functionalized polycyclic olefin monomers. These functionalized olefin monomers provide additional benefits such as increased adhesion to a variety of surfaces and greater control over glass transition temperatures.

Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at least comparable cure speeds and physical properties for the reaction products formed therefrom.

Abstract: The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which fills the underfill space in a semiconductor device, and includes a semiconductor chip mounted on a carrier substrate, enabling the semiconductor device to be securely connected to a circuit board by short-time heat curing. The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.

Abstract: The present invention is directed to (meth)acrylate compositions useful for bonding substrates including metals, plastics, and glass to similar or different substrates, in particular, low energy surfaces. The invention also provides an initiator system for (meth)acrylate based adhesives; a kit for bonding substrates, at least one of which includes a low energy surface; a resultant bonded assembly; and a method of bonding low energy substrates. A (meth)acrylate composition within the present invention includes a (meth)acrylate component and an initiator system including an organometallic compound, a peroxy compound, an aziridine functionalized compound, and a compound having an acid functional group.

Abstract: This invention relates to thermosetting resin compositions useful as underfill sealants for mounting to a circuit board semiconductor device packages, which have a semiconductor chip on a carrier substrate. Reaction products of these compositions demonstrate improved adhesion after exposure to elevated temperature conditions, improved resistance to moisture absorption and improved resistance to stress cracking.

Abstract: This invention relates to a dual curing silicone composition with an enhanced depth of cure. This composition incorporates an acylphosphine oxide or diacylphosphine oxide, the compatibility of which with the silicone is promoted through the use of a polar carrier. The composition may also include a second photoinitiator that is different than the acylphosphine oxide.

Abstract: Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.

Abstract: A dispensing closure assembly provides for the dispensing of fluid from a fluid container. The dispensing closure assembly includes a cap and a dispensing cover which is movably supported with respect to the cap. The dispensing cover includes a distal tip through which the fluid is dispensed. The cover further includes an outer surface extending from the distal tip and continuous therewith defining a fluid drainage surface where residual fluid drains. A finger contacting surface is provided on the cover and space from the fluid draining surface. A fluid containment well is defined between the fluid drainage surface and the finger contacting surface for retaining fluid drained therealong preventing fluid contact along the finger contacting surface.

Abstract: In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.

Abstract: The present invention relates to a radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation, a metallocene component, a hydrogen abstraction photoinitiator, and hydrogen donor component to enhance the activity of the hydrogen abstraction photoinitiator.

Abstract: In accordance with the present invention, there are provided gem-diesters and epoxidized derivatives thereof. When cured, thermosets comprising invention gem-diesters and epoxidized derivatives thereof have thermally and/or chemically labile gem-diester groups interspersed throughout the crosslinked network. Thus, thermosets based on invention gem-diesters and epoxidized derivatives thereof can be easily reworked thermally or chemically by treatment with dilute acidic or basic solutions. Further provided by the present invention are adhesive compositions comprising invention gem-diesters and epoxidized derivatives thereof.

Abstract: Polymerizable compositions for use in or as adhesives, sealants and/or coatings are disclosed herein. The compositions include a (meth)acrylate component together with a dye substantially dissolved in the (meth)acrylate component which imparts a first color to the (meth)acrylate component. Upon curing, a resultant cured composition has a second color. The invention also relates to a method of detecting substantially full cure of the polymerization of the compositions.

Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.

Abstract: Anaerobic adhesive compositions, the reaction products of which demonstrate improved cure speed and bond strength are disclosed. A high percentage of ultimate bond strength is reached within the first hour of room temperature cure. Higher ultimate bond strengths as compared to conventional compositions are achieved. The anaerobic adhesive compositions incorporate an adhesion promoter which contributes to these properties.

Abstract: The present invention is directed to low intensity UV curable adhesives formulated using a blend of acrylate oligomers and monomers which are capable of bonding glass, provide improved low-yellowing properties and fast cure speed over current glass bonding adhesives, while maintaining good bond strength lo and durability comparable to, or better than, state-of-the-art glass bonding adhesives.

Abstract: The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor.

Abstract: The present invention relates to anaerobic adhesive compositions which have been optimized using experimental design techniques to produce desired physical properties. A simplified cure system is disclosed which permits enhanced fixture and cure times.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.