Abstract: In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

Abstract: An aerosol solvent and co-solvent system provides for a more miscible fluorinated oil composition so that typical oil additives such as anti-wear, extreme pressure, lubricity additives, corrosion inhibitors, and oxidation inhibitors may be combined with perfluorinated and highly fluorinated oils.

Abstract: Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.

Abstract: Multi-component compositions comprising as a first component a fluorinated compound, as a second component a fluorinated aromatic compound and a third component comprising an alkane are disclosed. These compositions can be formulated to provide single phase systems which serve as effective solvents for fluorinated oils as well as petroleum oils. The compositions can serve as solvent cleaners or can be combined directly with oils to provide a delivery system for the oil.

Abstract: This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, the combination of two accelerators to improve fixture speeds on certain substrates.

Abstract: Compositions and methods for inhibiting corrosion of metallic surfaces are disclosed. The corrosion-inhibiting compositions are cost efficient, easy to use and can be conveniently removed or replaced. The corrosion-inhibiting compositions include a putty-like base material that is pliable and has sufficient tackiness to be securely affixed to surfaces. Corrosion inhibiting compounds are combined with the base material. These compositions provide a vapor phase corrosion inhibitor for both direct and indirect contact with metallic objects.

Abstract: The present invention provides UV/anaerobic dual cure adhesives, particularly well-suited for sealing the ring around the primer cup in center fire ammunition by UV cure and the primer cup in the cartridge by anaerobic cure.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame retardant molding compositions include an epoxy resin; a first transition metal oxide containing a refractory metal, such as tungsten trioxide; and a second transition metal oxide containing an oxyanion of a Group VIA element and a cation of a Group IIA element, such as calcium molybdate.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: The present invention relates to dual curing silicone compositions which are capable of cross-linking when subjected to ultraviolet (“UV”) or visible (“VIS”) light and/or by a moisture condensation method. When cured, these compositions have excellent adhesion to a variety of substrates. These are particularly useful in potting and coating applications.

Abstract: The present invention is directed to radical-curable adhesive compositions which include a (meth)acrylate component; a thermal resistance-conferring component; and a radical cure-inducing composition. Reaction products of the compositions of this invention exhibit superior resistance of thermal degradation.

Abstract: The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a convenient pocket-sized applicator dispenser.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: The present invention provides silicone compositions, cured elastomers thereof demtonstrate improved resistance to oil. The compositions include a reactive silicone component, wherein the silicone component cures by way of an addition cure mechanism or a condensation cure mechanism; and a basic filler component to confer oil resistance to the cured elastomer. Where the reactive silicone component cures by way of an addition cure mechanism, an addition cure catalyst is also included. To that end, in one embodiment of the invention, the composition includes a vinyl-terminated silicone fluid, a hydrogen-functionalized silicone fluid; a basic filler to confer oil resistance to the cured elastomer and an addition cure catalyst. In another embodiment of the invention, the composition includes a hydroxy-terminated diorganopolysiloxane, a precipitated calcium carbonate, at least about 5% by weight of a composition comprising magnesium oxide particles having a mean particle size of about 0.5 &mgr;M to about 1.

Abstract: A single stroke fluid dispense system, including a dispense member having a dispense end defining a dispense end opening and a container well communicating with the dispense end opening for receiving a fluid to be dispensed. A closure cap is supported over the dispense end opening of the dispense member and further defines a fluid passageway therethrough in fluid communication with the container well. A compression assembly for forcing the fluid through the fluid passageway of the closure cap is also provided. A sealing piston assembly maintains the closure cap in sealing engagement with the dispense member. The closure cap may further defined a burst port at one end of the fluid passageway facing the container well which is especially useful for dispensing fluid from a flexible rupturable container. The compression assembly maintains fluid integrity between the container and the closure cap about the rupture port throughout dispensement so as to thwart fluid from leaking into the container well.

Abstract: The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a convenient pocket-sized applicator dispenser.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed are the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits.

Abstract: A methacrylate ester or acrylate ester two-part reactive adhesive composition including vinyl-terminated liquid rubber and polymeric elastomer. The vinyl-terminated liquid rubber is preferably methacrylate-terminated or acrylate-terminated polybutadiene; the polymeric elastomer is preferably polychloroprene, core shell polymer and/or block copolymer rubber.

Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; and a polymerizingly effective amount of a photoinitiator to accelerate the rate of cure is provided.

Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.