Abstract: Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

Abstract: Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

Abstract: Disclosed is a method for fabricating the light emitting device packages. The method includes: mounting and arranging light emitting device units on a substrate; attaching wavelength converting members to the respective light emitting device units mounted and arranged on the substrate; filling a reflective material between the light emitting device units attached with the wavelength converting members to form a reflective member; and vertically cutting the reflective material such that the reflective material surrounds the individual light emitting device units attached with the wavelength converting members. Also disclosed are light emitting device packages fabricated by the method.

Abstract: A head-mounted display apparatus is disclosed. The head-mounted display apparatus includes an optical member having a front surface, a rear surface, and a plurality of side surfaces, a display unit adapted to emit a display image toward one of the side surfaces of the optical member, and a reflective structure disposed inside the optical member to reflect the display image emitted from the display unit and to allow the reflected display image to pass and propagate through the rear surface. The image reflected by the reflective structure and delivered to user's eyes is the same irrespective of the coverage of the user's field of view.

Abstract: A side view LED module is disclosed. The side view LED module includes: a mount substrate; a side view LED package including an LED unit and a body including a first side to which the LED unit is bonded, a second side parallel to the first side, a third side orthogonal to the first and second sides and facing the mount substrate, and terminals formed on the first, second, and third sides; and solder joints through which the terminals are electrically connected to the mount substrate. Each of the terminals includes an opening formed at the second side and a concave electrode extending from the opening toward the first side and recessed relative to the third side. Each of the solders fills only a portion of an inner space of the corresponding concave electrode and includes a base portion formed on the third side and inner fillets extending upward along the inner wall surfaces of the concave electrode from the base portion.

Abstract: The present disclosure discloses a linear LED module including: at least one LED bar including multiple LEDs arrayed on a substrate in a lengthwise direction of the substrate; a mounting portion in which the at least one LED bar is mounted on its mounting surface in the lengthwise direction; and a composite reflective portion integrated with the mounting portion and adapted to reflect light emitted from the at least one LED bar. A cross-section of the composite reflective portion includes a curved reflective surface adjacent to the mounting portion and a straight reflective surface extending away from a boundary with the mounting portion. Also disclosed is a backlight unit including the linear LED module. The backlight unit includes a rear case arranged in rear of a display panel, a reflective sheet positioned in rear of the display panel in the rear case, and a linear LED module.

Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev

Abstract: A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.

Abstract: Provided is a light emission device. When the size of an input voltage exceeds a minimum light emission voltage, all light emission elements emit light always irrespective of the size of a voltage, and as the size of the voltage decreases, the light emission device has a configuration in which the light emission elements are connected in parallel with each other, and as the size of the voltage increases, the light emission device has a configuration in which the light emission elements are connected in series with each other.

Abstract: Disclosed is a method for fabricating the light emitting device packages. The method includes: mounting and arranging light emitting device units on a substrate; attaching wavelength converting members to the respective light emitting device units mounted and arranged on the substrate; filling a reflective material between the light emitting device units attached with the wavelength converting members to form a reflective member; and vertically cutting the reflective material such that the reflective material surrounds the individual light emitting device units attached with the wavelength converting members. Also disclosed are light emitting device packages fabricated by the method.

Abstract: A semiconductor light emitting diode is disclosed. The semiconductor light emitting diode includes a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, a transparent electrode formed on the second conductive semiconductor layer, a non-conductive reflection film covering the circumferential surface of the transparent electrode and having one or more via-holes formed therein, a reflective electrode formed on the non-conductive reflection film, interconnection electrodes filled in the via-holes and electrically connecting the reflective electrode to the transparent electrode, and ohmic contact layers formed between the transparent electrode and the interconnection electrodes and filled in recesses formed at positions of the transparent electrode corresponding to the via-holes by etching or extending through the via-holes from the recesses.

Abstract: A method for arraying micro-LED chips is disclosed. The method includes preparing a chip carrier formed with a plurality of chip pockets whose internal pressure is reduced through a plurality of suction holes, capturing the micro-LED chips in the corresponding chip pockets such that the micro-LED chips are in close contact with the bottoms of the chip pockets, and placing the micro-LED chips captured in the chip pockets on a base body. Each of the chip pockets includes a slope through which an inlet having a larger width than the bottom is connected to the bottom. The distances between the centers of the adjacent micro-LED chips placed on the base body are the same as those between the centers of the corresponding chip pockets.

Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.

Abstract: A micro-LED display panel is disclosed. The micro-LED display panel includes: a plurality of unit substrates, each of which is formed with a plurality of electrode pads; a plurality of pixels, each of which includes a first micro-LED chip, a second micro-LED chip, and a third micro-LED chip mounted corresponding to the electrode pads; and a mesh arranged over the plurality of unit substrates. The mesh has pixel spacing portions covering at least some exposed areas of the plurality of unit substrates between the pixels and a plurality of openings accommodating the corresponding pixels. The micro-LED display panel is constructed such that the reflection of external light by the exposed areas of the substrate between the pixels and the exposed areas of the electrode pads disposed on the unit substrates is reduced. This construction improves the contrast characteristics and black characteristics of a display and achieves seamlessness in the micro-LED display panel.

Abstract: Disclosed herein is a lighting apparatus capable of uniformly maintaining power consumed by light emitting units even in the case in which various voltages are applied, and increasing power efficiency while minimizing a heating problem by adjusting a reference voltage applied to a connection structure of the light emitting units and a distribution switch according to magnitude of the applied voltage.

Abstract: Disclosed is a color temperature variable light emitting diode module that is driven when alternating current power is applied thereto. The light emitting diode module includes: a substrate; and a plurality of light emitting diode groups arranged on a substrate and including a first light emitting diode group emitting light at an input voltage level equal to or above a first reference voltage and a second light emitting diode group emitting light at an input voltage level equal to or above a second reference voltage higher than the first reference voltage.

Abstract: Micro-LED 3D display modules are disclosed. Each of the micro-LED 3D display module includes a module substrate and a micro-LED array mounted on the module substrate. The micro-LED array includes first micro-LED pixels attached with a first polarization film having a first phase retardation property and second micro-LED pixels attached with a second polarization film having a second phase retardation property.

Abstract: An LED module is disclosed. The LED module includes: light sources elongated in a first direction; a mount supporting the light sources; and a composite reflector integrated with the mount to guide light received from the light sources. The composite reflector includes a first region arranged adjacent to the light sources to reflect light in a second direction substantially orthogonal to the first direction, a third region arranged away from the mount to reflect light in the second direction substantially orthogonal to the first direction, and a second region whose portions overlap the first region and the third region and formed with a plurality of diffraction lines through which light is diffused in the second direction. The diffraction lines formed on the composite reflector diffract incident light and direct the diffracted light toward the light receiving unit.