Abstract: A driver circuit may include a source, a first circuit path, and a second circuit path. The a first circuit path may be connected to the source and include a first anode pad, a first set of connecting elements to connect the first anode pad to an anode of an optical load, a second anode pad that is separate from the first anode pad, a second set of connecting elements to connect the anode of the optical load to the second anode pad, and a switch. The switch being in a closed state causes current to charge the first set of connecting elements and the second set of connecting elements through the first circuit path. The switch transitioning from the closed state to the open state causes the first set of connecting elements to discharge current through the second circuit path to provide an electrical pulse to the optical load.

Abstract: A linear comb drive may include a stator. The linear comb drive may include a rotor. At least one of the stator or the rotor may include a comb with one or more horizontally-extending fingers that have a tooth-shape formed by one or more prongs that extend vertically from the one or more fingers in a plane formed by the one or more fingers.

Abstract: An optical fiber device may include an optical waveguide to guide a laser output from a first end of the optical waveguide to a second end of the optical waveguide. The optical fiber device may include a fiber telescope optically coupled to the second end of the optical waveguide to modify the laser output. The fiber telescope may include a first graded-index optical element, a first facet of the first graded-index optical element being fused to the second end of the optical waveguide; and a second graded-index optical element, a first facet of the second graded-index optical element being fused to a second facet of the first graded-index optical element.

Abstract: In some implementations, a vertical-cavity surface-emitting laser (VCSEL) array may comprise a plurality of channels, a plurality of traces, and a plurality of emitters. A channel, of the plurality of channels, may include a set of emitters, of the plurality of emitters, arranged in a row of emitters. The channel may include a trace, of the plurality of traces, that has a trace width that is tapered along a length of the trace. Numerous other aspects are provided.

Abstract: A heatsink may include a base and a plurality of fins, configured to be disposed in an air flow, that extend orthogonally from the base. The plurality of fins may have at least one of a height, an inter-fin spacing, or a thickness that varies in a direction of the air flow.

Abstract: In some implementations, an optical device for mounting in a flip-chip configuration includes a plurality of flip-chip bumps that are arranged in a pattern on the optical device, wherein the pattern is not aligned with a crystal cleavage plane associated with a substrate of the optical device. In some implementations, the optical device further includes a gap that separates a primary region of the optical device and a secondary region of the optical device, wherein at least one portion of a side of the gap is oriented at a non-zero angle to the crystal cleavage plane.

Abstract: An emitter array, may comprise a first set of emitters that has a nominal optical output power at an operating voltage. The emitter array may comprise a second set of emitters that has substantially less than the nominal optical output power or no optical output power at the operating voltage. The first set of emitters and the second set of emitters may be interleaved with each other to form a two-dimensional regular pattern of emitters that emits a random pattern of light at the nominal optical output power at the operating voltage. The first set of emitters and the second set of emitters may be electrically connected in parallel.

Abstract: An optical device may include a lens system. The optical device may include a first scanning component to receive an optical beam and to scan the lens system with the optical beam. The optical device may include a second scanning component to receive the optical beam from the lens system and to scan a field of view with the optical beam, where the lens system is positioned between the first scanning component and the second scanning component. The lens system may include a beam expander.

Abstract: A transmitter may include a digital signal processor (DSP) to generate an electrical signal associated with a beacon and a data signal. The transmitter may include an electro-optical component to convert the electrical signal to an optical signal to be transmitted by the transmitter. The beacon and the data signal may be on a common wavelength in the optical signal. A power of the beacon within the optical signal may be based on a value of an amplitude modulation factor applied to the beacon by the DSP in association with generating the electrical signal.

Abstract: An optical device may include a dispersion element. The optical device may include a reflective optic to reflect an optical beam with a fixed offset perpendicular to a dispersion direction of the dispersion element and with a negative offset in the dispersion direction of the dispersion element. The reflective optic may be aligned to the dispersion element to offset an optical beam with respect to the dispersion element and to cause the optical beam to pass through the dispersion element on a plurality of passes, offsetting the optical beam on each of the plurality of passes.

Abstract: In some implementations, a liquid crystal on silicon panel includes a backplane with an electrical contact formed on the backplane, a first alignment layer disposed on the backplane and interfacing with the electrical contact, a conductive layer that is light transmissive, a second alignment layer disposed on the conductive layer, and a plurality of beads in an electrically-conductive adhesive between the first alignment layer and the second alignment layer. Electrically-conductive particles within the electrically-conductive adhesive may make the electrically-conductive adhesive electrically-conductive. A first set of the electrically-conductive particles may puncture the first alignment layer to contact the electrical contact, and a second set of the electrically-conductive particles may puncture the second alignment layer to contact the conductive layer. An electrical connection of the electrical contact and the conductive layer may be via a plurality of the electrically-conductive particles.

Abstract: An optical element may include a plurality of subsurface induced scattering centers formed in the optical element, where the plurality of subsurface induced scattering centers scatter light passing through the optical element. In some implementations, the plurality of subsurface induced scattering centers may form a scattering region in the optical element. Additionally, or alternatively, the plurality of subsurface induced scattering centers may spatially vary transmission of light through the optical element. The optical element may be an optical waveguide, a bulk optic, and/or the like.

Abstract: A micro-sized optical device may comprise a mirror suspended on a set of hinges that are mounted to the substrate and that are configured to tilt the mirror about an axis, wherein a hinge of the set of hinges is a two-layer structure with a pivot point that aligns with a mass center of the mirror; and a three-layer comb actuator structure associated with the hinge of the set of hinges, wherein the three-layer comb actuator structure includes a rotor comb actuator, a first stator comb actuator, and a second stator comb actuator.

Abstract: An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel and the second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder.

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

Abstract: In some implementations, an emitter array may include a substrate, an epitaxial structure on the substrate, a plurality of bottom-emitting emitters defined in the epitaxial structure, a first electrical contact positioned at a top side of the epitaxial structure, a second electrical contact positioned at the top side of the epitaxial structure, and a metal layer disposed on a bottom side of the substrate. The metal layer may be electrically connected to the second electrical contact. The metal layer may include one or more openings for light emission of the plurality of bottom-emitting emitters.

Abstract: In some implementations, a vertical cavity surface emitting laser (VCSEL) device includes a substrate layer and a first set of epitaxial layers for a bottom-emitting VCSEL disposed on the substrate layer. The first set of epitaxial layers may include a first set of mirrors and at least one first active layer. The VCSEL device may include a second set of epitaxial layers for a top-emitting VCSEL disposed on the first set of epitaxial layers for the bottom-emitting VCSEL. The second set of epitaxial layers may include a second set of mirrors and at least one second active layer. The top-emitting VCSEL and the bottom-emitting VCSEL may be configured to emit light in opposite light emission directions.

Abstract: A monitoring device may receive sensor information, associated with an optical device included in a high-power fiber laser, from a set of sensors associated with the optical device. The monitoring device may determine, based on the sensor information, a set of operational properties of the optical device. The set of operational properties may include: a health property that describes a health of one or more components of the optical device, a degradation property that describes degradation of one or more components of the optical device, an environmental property that describes an environment of the optical device, or a process property associated with a process in which the optical device is being used. The monitoring device may identify whether an operational property, of the set of operational properties, satisfies a condition, and may selectively perform a monitoring action based on whether the operational property satisfies the condition.

Abstract: An electrical drive circuit may charge one or more inductive elements, where the electrical drive circuit includes the one or more inductive elements and a capacitive element in series between the one or more inductive elements and the optical load, and where the electrical drive circuit is connected to one or more sources. The electrical drive circuit may generate, after the charging and for a first time interval, a main electrical pulse. The electrical drive circuit may discharge, after the charging and for a second time interval, the one or more inductive elements to provide a compensation electrical pulse, where at least a portion of the second time interval overlaps with the first time interval. The electrical drive circuit may combine the main electrical pulse and the compensation electrical pulse into a combined electrical pulse. The electrical drive circuit may provide the combined electrical pulse to the optical load.

Abstract: A VCSEL array may include a semiconductor substrate and a plurality of emitters on the substrate that conforms to an emitter pattern. The emitter pattern may be oriented at a non-zero angle to an edge of the substrate and may comprise two or more unit cells arranged to form the emitter pattern. Each unit cell, of the two or more unit cells, may include a same number of emitters, and the two or more unit cells may be arranged to cause a measurement of misalignment associated with two adjacent unit cells, of the two or more unit cells, to satisfy a misalignment threshold.