Abstract: In some implementations, an optical assembly includes an optical power monitor to receive a portion of an optical beam and to perform a measurement on the portion of the optical beam; an optical tap to tap the optical beam and provide the portion of the optical beam; and an optical element to allow the portion of the optical beam from the optical tap to propagate toward the optical power monitor, wherein the optical element includes an absorptive material to absorb light other than the portion of the optical beam that is propagated toward the optical power monitor.

Abstract: In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.

Abstract: A vertical cavity surface emitting laser (VCSEL) device may include a substrate layer and a first set of epitaxial layers, for a first VCSEL, disposed on the substrate layer. The first set of epitaxial layers may include a first set of mirrors and at least one first active layer. The VCSEL device may include a second set of epitaxial layers, for a second VCSEL, disposed on the first set of epitaxial layers for the first VCSEL. The second set of epitaxial layers may include a second set of mirrors and at least one second active layer. The first VCSEL and the second VCSEL may be configured to emit light in a light emission direction. The at least one first active layer of the first VCSEL may be offset in the light emission direction from the at least one second active layer of the second VCSEL.

Abstract: An optical device may include a planar lightwave circuit (PLC) waveguide to guide an optical signal. The optical device may include a thermo-optic phase shifter to receive a control signal for controlling a temperature of the thermo-optic phase shifter, the temperature of the thermo-optic phase shifter being used to apply a phase shift to the optical signal in the PLC waveguide, and adjust the temperature of the thermo-optic phase shifter based on the control signal. The optical device may include a feedback component to generate feedback associated with applying the phase shift. The optical device may include a controller to adjust the control signal based on the feedback, the control signal being adjusted to reduce a response time of the thermo-optic phase shifter in applying the phase shift.

Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

Abstract: An optical assembly includes an optical cavity; an output detector; a reference detector; and a plate beam splitter, wherein the plate beam splitter has a first face and a second face, and is configured to form, from an input beam: a first output beam, that passes through the optical cavity and impinges the output detector, a first reference beam that impinges on the reference detector, a second output beam parallel to the first output beam, and a second reference beam parallel to the first reference beam; one of the first output beam or the first reference beam is a reflection of the input beam in the first face of the plate beam splitter; the output detector is configured to exclude at least a portion of the second output beam; and the reference detector is configured to exclude at least a portion of the second reference beam.

Abstract: A semiconductor layer structure may include a substrate, a blocking layer disposed over the substrate, and one or more epitaxial layers disposed over the blocking layer. The blocking layer may have a thickness of between 50 nanometers (nm) and 4000 nm. The blocking layer may be configured to suppress defects from the substrate propagating to the one or more epitaxial layers. The one or more epitaxial layers may include a quantum-well layer that includes a quantum-well intermixing region formed using a high temperature treatment.

Abstract: In some implementations, an optical isolator core includes a Faraday rotator and a plurality of birefringent crystal plates. The plurality of birefringent crystal plates may include a first birefringent crystal plate to separate input light into light having a first polarization and light having a second polarization, and a second birefringent crystal plate to combine the light having the first polarization and the light having the second polarization in output light that is laterally displaced by the single stage optical isolator. The Faraday rotator may be provided between the first birefringent crystal plate and the second birefringent crystal plate. In some implementations, the plurality of birefringent crystal plates further include a third birefringent crystal plate provided between the Faraday rotator and the second birefringent crystal plate.

Abstract: An emitter may include a substrate, a conductive layer on at least a bottom surface of a trench, and a first metal layer to provide a first electrical contact of the emitter on an epitaxial side of the substrate. The first metal layer may be within the trench such that the first metal layer contacts the conductive layer within the trench. The emitter may further include a second metal layer to provide a second electrical contact of the emitter on the epitaxial side of the substrate, and an isolation implant to block lateral current flow between the first electrical contact and the second electrical contact.

Abstract: A method and system for an optical package assembly is disclosed. According to one example, the optical package assembly includes a photonic integrated circuit (PIC) chip, at least one fiber coupled to the PIC chip, a fiber lid plate disposed on at least a portion of the at least one fiber, and a cover plate having a surface coupled to the PIC chip and the fiber lid plate.

Abstract: An apparatus may include an upper transparent plate to hold a wafer of bottom-emitting or bottom-detecting optical devices, wherein the upper transparent plate comprises a set of holes in an area of the upper transparent plate for holding the wafer. The apparatus may include a lower transparent plate and a structure supporting the upper transparent plate and the lower transparent plate to form a cavity bounded by the upper transparent plate, the lower transparent plate, and the structure, wherein the structure comprises an opening in fluid communication with the cavity, wherein applying suction through the opening, via the cavity and the set of holes, holds the wafer flat on the upper transparent plate, and wherein an optical path, between a bottom-emitting or bottom-detecting optical device of the bottom-emitting or bottom-detecting optical devices of the wafer and a testing device, passes through the upper transparent plate, the cavity, and the lower transparent plate.

Abstract: A light detection and ranging (lidar) receiver may include a first photodiode, a first amplifier connected to the first photodiode, and a first analog-to-digital converter (ADC) connected to an output of the first amplifier. The lidar receiver may include a second photodiode, a second amplifier connected to the second photodiode, and a second ADC connected to the second amplifier. The lidar may include a processor connected to an output of the first ADC and an output of the second ADC and a direct-current-to-direct-current converter connected to an output of the processor and to the first photodiode and the second photodiode. The processor may determine, based on the output of the first ADC and the output of the second ADC, a first bias to apply to the first photodiode and a second bias to apply to the second photodiode.

Abstract: A micro-electro-mechanical system (MEMS) device may comprise a first layer that includes a stator comb actuator; a second layer that includes a rotor comb actuator; a mirror structure that includes a mirror; and a first set of hinges and a second set of hinges configured to tilt the mirror structure about a first axis of the MEMS device based on a driving torque caused by the stator comb actuator engaging with the rotor comb actuator. The first set of hinges may be configured to resist a lateral linear force on the mirror structure in a direction associated with the first axis caused by the stator comb actuator engaging with the rotor comb actuator. The second set of hinges may be configured to resist an in-plane torque on the mirror structure about a second axis of the MEMS device caused by the stator comb actuator engaging with the rotor comb actuator.

Abstract: An optical system may include an emitter array to emit a plurality of beams of light, and a lens array. The lens array may be arranged to collimate and direct each of the plurality of beams of light. A pitch between lenses of the lens array may be larger than a pitch between emitters of the emitter array in order to cause the plurality of beams of light to be directed such that they diverge after exiting the lens array. The optical system may include a diffractive optical element to distribute each of the plurality of beams of light into a plurality of beamlets in association with creating a light pattern. The divergence of each of the plurality of beams of light may cause a plurality of zero-order beamlets, each corresponding to one of the plurality of beams of light, to diverge after exiting the diffractive optical element.

Abstract: A vertical comb drive assembly may include a rotor assembly. The rotor assembly may include a comb anchor to attach the rotor assembly to a base, a comb rotor attached to the comb anchor, and a movable element attached to the comb rotor. The vertical comb drive assembly may include a stator assembly. The stator assembly may include a plate anchor to attach the stator assembly to the base, a plate, wherein the plate forms a comb stator, and a plate hinge to connect the plate to the plate anchor. The plate hinge and the plate may be configured for moving the plate from a first position where the comb rotor and the comb stator are both in a first plane to a second position where the comb rotor is in the first plane and the comb stator is in a second plane.

Abstract: A bidirectional optical device includes a first optical component, wherein a portion of a first interface of the first optical component has a reflector coating, wherein a second interface of the first optical component has an optical coating, and wherein the first optical component includes an internal splitting interface disposed between the first interface and the second interface, and a second optical component including a reflector aligned to the second interface of the first optical component, wherein the first optical component and the second optical component comprise an unbalanced Mach-Zehnder (MZ) interferometer.

Abstract: A method for fabricating an array of emitters may include providing a first metallization layer for a first set of emitters of a first channel, wherein the first metallization layer comprises a first interchannel portion positioned between the first set of emitters and a second set of emitters of a second channel. The method may include depositing a dielectric layer on the first interchannel portion of the first metallization layer. The method may include providing a second metallization layer for the second set of emitters, wherein the second metallization layer comprises a second interchannel portion positioned between the first set of emitters and the second set of emitters, and wherein the second interchannel portion of the second metallization layer at least partially overlaps the first interchannel portion of the first metallization layer.

Abstract: The Bi-Di coherent transmission system is configured with at least one pair of modules coupled to one another via a single fiber. The modules each are configured with a pair of laser outputting two reference signals at respective different wavelengths ?1o and ?2o, photonic transceiver and a wavelength division multiplexer (WDM) coupler. The photonic transceivers each have transmitter and receiver branches integrated in a photonic circuit and receiving the reference signals. The transmitter is configured to modulate the received reference signals ?1oT and ?2oT which are further coupled into the WDM coupler. The WDM couplers each sort out one of the modulated signals and transmit the other modulated signal such that the transmitted modulated signal at different wavelengths ?1oT and ?2oT are coupled into respective opposite ends of the fiber and propagate towards one another in opposite directions.

Abstract: In some implementations, a Mach-Zehnder interferometer (MZI) includes a delay line arm formed in a chip and a mirrored facet formed in the chip. The delay line arm may be configured to propagate light to the mirrored facet. The mirrored facet may be configured to reflect, to the delay line arm, a percentage of the light propagated to the mirrored facet by the delay line arm.

Abstract: An optical device may drive a compensation section of a multi-section optical load to emit a compensation optical pulse by providing, for a first time interval, a compensation electrical pulse to the compensation section. The optical device may drive a main section of the multi-section optical load to emit a main optical pulse by generating, for a second time interval, a main electrical pulse, wherein at least a portion of the first time interval overlaps with the second time interval. The optical device may emit a combined optical pulse, wherein the combined optical pulse includes the compensation optical pulse and the main optical pulse, and wherein the combined optical pulse has a shorter rise time than the main optical pulse.