Patents Assigned to Lumileds LLC
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Patent number: 10415762Abstract: An automotive LED lamp unit includes a plate-like mounting member, LED light sources arranged on two opposite sides of the plate-like mounting member, and a heat sink. The heat sink includes cooling fins and a tapered portion facing the LED light sources and being connected to one end of the plate-like mounting member.Type: GrantFiled: June 25, 2018Date of Patent: September 17, 2019Assignee: Lumileds LLCInventors: Lukas Kuepper, Mohammad Mirsadeghi, Gunnar Luettgens, Gordon Patrick Rudolf Elger, Nadin Roesler, Aldo Tralli
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Patent number: 10416356Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.Type: GrantFiled: January 4, 2015Date of Patent: September 17, 2019Assignee: Lumileds, LLCInventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Publication number: 20190280161Abstract: A light emitting device is described. The light emitting device includes a substrate and a semiconductor structure. The semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region and has a first surface adjacent the substrate and a second surface opposite the first surface. The first surface of the semiconductor structure multiple cavities formed therein, which extend into at least one of the n-type region and the p-type region. The cavities are spaced apart and lined by a dielectric layer. At least a portion of the second surface is roughened to form multiple features spaced apart at a distance smaller than a distance between each of the cavities formed in the first surface to enhance extraction of light emitted from the light emitting layer. At least one contact is disposed between the first surface of the semiconductor structure and the substrate.Type: ApplicationFiled: December 14, 2018Publication date: September 12, 2019Applicant: Lumileds LLCInventors: Jonathan J. WIERER, Aurelien Jean Francois DAVID, Henry Kwong-Hin CHOY
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Publication number: 20190277476Abstract: A lighting assembly includes at least two LED elements arranged at a distance from each other. A diffusor element extends over the LED lighting elements. The diffusor element comprises first diffusion portions arranged in front of the LED lighting elements and second diffusion portions arranged in between the first diffusion portions. The first diffusion portions are disposed to cause a stronger optical diffusion than the second diffusion portions, thereby providing a more homogeneous appearance of light emitted from the diffusor element.Type: ApplicationFiled: September 15, 2017Publication date: September 12, 2019Applicant: Lumileds LLCInventors: Floris Maria Hermansz CROMPVOETS, Christian KLEIJNEN, Ralph Hubert PETERS, Adam LIND, Rob Bastiaan Maria EINIG
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Publication number: 20190280171Abstract: A lighting assembly is disclosed which includes a leadframe and at least one light-emitting diode (LED) element arranged on the leadframe. At least a portion of the leadframe is covered with a polyurethane coating arranged to electrically insulate the portion of the leadframe, and at least a portion of the polyurethane covered portion of the leadframe is further covered with a thermally conductive material. A method for manufacturing the lighting assembly is also disclosed.Type: ApplicationFiled: May 16, 2017Publication date: September 12, 2019Applicant: Lumileds LLCInventors: Nan CHEN, Hiu Tung CHU, Dong PAN, Paul Scott MARTIN, Tomonari ISHIKAWA
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Patent number: 10411171Abstract: A Light Emitting Device (LED) that has increased reliability and efficiency. Specifically, the LED may be formed using Atomic Layer Deposition to improve the thermal conductivity between the ceramic plate and the LED, decrease the amount of organic contamination, and increase the efficiency of the optical output of the LED.Type: GrantFiled: October 11, 2018Date of Patent: September 10, 2019Assignee: LUMILEDS LLCInventors: Ken T. Shimizu, Hisashi Masui, Daniel B. Roitman
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Publication number: 20190271451Abstract: A lens comprises an elongated shape. The lens has a short axis and a long axis. The lens comprises an upper surface through which a substantial majority of light exits the lens when a light emitting element is situated at or below a base of the lens. The upper surface includes a trough that extends along at least one of the short and the long axis. The upper surface includes a surface of a curved wall that joins the upper surface to the base of the lens. A lower surface of the trough is curved along the short axis and along the long axis. The lower surface of the trough has a curvature along the short axis that differs from a curvature along the long axis.Type: ApplicationFiled: May 17, 2019Publication date: September 5, 2019Applicant: Lumileds LLCInventor: Michael David CAMRAS
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Patent number: 10400958Abstract: A light-emitting device package includes a metalized substrate, a light-emitting diode (LED) die, and a single primary optic. The metalized substrate includes a top surface, pads on the top surface, and traces extending from the pads. The LED die is mounted on the pads of the metalized substrate. The LED die includes individually addressable segments. Each segment includes one or more junctions. The primary optic is located over the LED die.Type: GrantFiled: December 29, 2017Date of Patent: September 3, 2019Assignee: LUMILEDS LLCInventor: Kenneth John Vampola
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Publication number: 20190265576Abstract: A flash system for an electronic device includes a ring-shaped light guide having a central opening. A camera lens is positioned in or behind the opening. A first light emittting diode (“LED”) is mounted on a printed circuit board (“PCB”), and the LED and PCB are encapsulated by a molded light guide of the flash system. An identical LED and PCB are encapsulated at an opposite end of the molded light guide (i.e., 180 degrees away). The back surfaces of each PCB diffusively reflects light from the LED on the other PCB. Light extraction features on the light guide surface uniformly leak out light from the LEDs. The light emission profile of the light guide has a peak axially aligned with the central opening of the light guide and rolls off to the edge of the camera's field of view.Type: ApplicationFiled: March 29, 2019Publication date: August 29, 2019Applicant: Lumileds LLCInventor: Xueqin Lin
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Publication number: 20190268984Abstract: Systems, devices and methods are described herein. An integrated light emitting diode (LED) lighting system includes an electronics board. An alternating current (AC) input is disposed on the electronics board. Multiple strings of LED devices are disposed on the electronics board, each having an individual voltage threshold. A buck converter is disposed on the electronics board and is electrically coupled to provide a direct current (DC) current based on an AC current at the AC input. A switching circuit is disposed on the electronics board and is electrically coupled to the strings of LED devices to apply the DC current to each of the strings in a sequence beginning at a time when an instantaneous voltage level at the AC input reaches the individual threshold voltage of a first one of the strings of LED devices in the sequence.Type: ApplicationFiled: February 26, 2019Publication date: August 29, 2019Applicant: Lumileds LLCInventors: Zhi Hua SONG, Wouter SOER
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Publication number: 20190268983Abstract: An apparatus is disclosed, comprising: a first light source having a first threshold voltage; a second light source having a second threshold voltage; a rectifier configured to receive an AC voltage as input and generate a DC voltage based on the AC voltage; a single-stage Buck converter section coupled to the rectifier, the first light source, and the second light source, the Buck converter section being configured to output a current generated based on the DC voltage towards the first light source and the second light source; and a switching circuit configured to reduce a load on the Buck converter section by periodically diverting the current away from the second light source when a magnitude of the AC voltage is less than or equal to a sum of the first threshold voltage and the second threshold voltage.Type: ApplicationFiled: February 27, 2018Publication date: August 29, 2019Applicant: Lumileds LLCInventors: Zhi Hua Song, Wouter Soer
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Publication number: 20190259914Abstract: Methods and apparatus are described. An apparatus includes a hexagonal oxide substrate and a III-nitride semiconductor structure adjacent the hexagonal oxide substrate. The III-nitride semiconductor structure includes a light emitting layer between an n-type region and a p-type region. The hexagonal oxide substrate has an in-plane coefficient of thermal expansion (CTE) within 30% of a CTE of the III-nitride semiconductor structure.Type: ApplicationFiled: February 25, 2019Publication date: August 22, 2019Applicant: Lumileds LLCInventors: Nathan Fredrick Gardner, Werner Karl Goetz, Michael Jason Grundmann, Melvin Barker Mclaurin, John Edward Epler, Michael David Camras, Aurelien Jean Francois David
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Publication number: 20190252590Abstract: A light-emitting device is disclosed that includes a substrate; a semiconductor structure on the substrate, a wavelength conversion element on the substrate, opposite the semiconductor structure; an insulating side coating around the semiconductor structure; and a reflective side coating around the wavelength conversion element and the substrate, the reflective layer being stacked over the insulating side coating, the reflective side coating having a first surface that is over a second surface of the insulating side coating.Type: ApplicationFiled: January 28, 2019Publication date: August 15, 2019Applicant: LUMILEDS LLCInventors: Ruen-Ching Law, Tze-Yang Hin
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Patent number: 10381534Abstract: Embodiments of the invention include a package for a light emitting diode (LED). The package includes a lead frame, an LED, and an optically reflective but electrically non-conductive molding. The lead frame has a first lead frame part and a second lead frame part electrically isolated from the first lead frame part, each lead frame part having at least one raised pillar. The molding is disposed over the lead frame except over the pillars of the lead frame. The LED is mounted on at least one pillar and is electrically coupled to at least one pillar. The molding serves the purpose of a highly reflective, electrically conductive material like silver without being subject to tarnishing.Type: GrantFiled: July 18, 2017Date of Patent: August 13, 2019Assignee: Lumileds LLCInventors: Shu Li, Thuy Vu
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Patent number: 10379263Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.Type: GrantFiled: January 4, 2015Date of Patent: August 13, 2019Assignee: Lumileds, LLCInventors: Walter Daeschner, Mikhail Fouksman, Mohiuddin Mala, Ashim Shatil Haque
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Publication number: 20190242544Abstract: The present invention provides a lamp for a horizontal operating position within a vehicle headlight assembly. The lamp, as seen with respect to the vehicle, comprises a LED light source for emitting light mainly to one side, and a reflective member for shielding front and lower parts of the light emitted by the LED light source and reflecting them to desired directions. The present invention also provides a vehicle headlight assembly comprising such a lamp, and, further, a reflector for shaping the light emitted by the LED light source into a beam, and a shuttle, adjustable between positions to shape the beam into a high beam or a low beam.Type: ApplicationFiled: June 14, 2017Publication date: August 8, 2019Applicant: Lumileds LLCInventors: Shengjin-Sj CHEN, Xin SHENG, Yuanyuan WANG
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Patent number: 10368497Abstract: A method and apparatus are described herein for capturing images of plants using a broad spectrum camera while illuminating the plants with specific light wavelengths from light sources such as light emitting diodes (LEDs). A first light source may be activated, wherein the first light source emits light having a first spectrum toward a bed of a plurality of plants. On a condition that the first light source is activated, a first image of the bed of the plurality of plants may be captured with a broad spectrum camera. A second light source may be activated, wherein the second light source emits light having a second spectrum toward the bed of the plurality of plants. On a condition that the second light source is activated, a second image of the bed of the plurality of plants may be captured with the broad spectrum camera.Type: GrantFiled: May 9, 2017Date of Patent: August 6, 2019Assignee: LUMILEDS LLCInventor: Alan McReynolds
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Publication number: 20190239310Abstract: A control circuit for a light emitting diode (LED) lighting system for achieving a dim-to-warm effect is provided. The control circuit includes an LED controller, a clamp circuit coupled to a set of warm correlated-color-temperature (“CCT”) LEDs, a switch coupled to a set of cool LEDs, and a feedback circuit coupled to the clamp and the switch. The LED controller is configured to control the clamp circuit to clamp current through the set of warm LEDs based on the input current, and control the switch to switch on the set of cool LEDs responsive to the input current being greater than a first threshold level and to switch off the set of cool LEDs responsive to the input current being lower than the first threshold level. The feedback circuit is configured to divert current from the set of warm LEDs to the set of cool LEDs.Type: ApplicationFiled: April 8, 2019Publication date: August 1, 2019Applicant: LUMILEDS LLCInventors: Yifeng QIU, Jeroen Den BREEJEN
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Publication number: 20190237629Abstract: A reflective layer for use in lighting devices and methods of forming the reflective layer are provided. The reflective layer may include a dielectric layer including one or more insulating materials. An intermediate layer may be formed on the dielectric layer. The intermediate layer may include one or more materials having a higher enthalpy of reaction than the one or more insulating materials. Because of the higher enthalpy of reaction, atoms of the one or more materials in the intermediate layer may form bonds with atoms of the one or more insulating materials. A metal layer may be formed on the intermediate layer to reflect light emitted from an active region of a light emitting diode (LED).Type: ApplicationFiled: January 26, 2018Publication date: August 1, 2019Applicant: Lumileds LLCInventor: Yue Chau Kwan
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Publication number: 20190237935Abstract: Method and apparatuses are described herein for providing laser safety in semiconductor laser modules. For example, a semiconductor laser module may comprise a semiconductor laser and an optical element. The optical element that is operatively coupled with the semiconductor laser may disperse the laser light emitted from the semiconductor laser. The optical element may be coated with a transparent conductive material that serves as an interlock on the semiconductor laser. The transparent conductive material may be placed in the shape of a trace on the optical element where the trace is electrically in series with the semiconductor laser. On a condition that the trace is damaged, the laser light emitted from the semiconductor laser may be interrupted.Type: ApplicationFiled: January 31, 2018Publication date: August 1, 2019Applicant: Lumileds LLCInventor: Charles André SCHRAMA
