Patents Assigned to Lumileds LLC
  • Patent number: 10367125
    Abstract: Crimping of an LED leadframe to a subassembly may stress the leadframe. Flat leadframes cannot accommodate these stresses. Strain relief sections are added to the leadframe to accommodate crimping or other stresses on the leadframe. Strain relief sections are created in the leadframe in the form of openings, notches or bulges. The strain relief sections may be symmetric or asymmetric.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: July 30, 2019
    Assignee: Lumileds, LLC
    Inventors: Chee Weng Soong, Tomonari Ishikawa, Su Ping Tan, Chiou Bee Goh
  • Publication number: 20190229552
    Abstract: A system may include a light source. A converter may be configured to convert an AC voltage to a DC operating voltage during normal operation. A power backup device may be coupled to the converter. A current source may have a first terminal configured to receive the DC operating voltage during regular operation and a second terminal configured to provide a pulse-width modulated (PWM) signal to an anode end of the light source. A switching device may have a first connecting terminal coupled to the anode end of the light source, a second connecting terminal coupled to the power backup device, and a control terminal coupled to the converter. The switching device may be configured to open a switch between the first connecting terminal and the second connecting terminal during normal operation and close the switch upon detecting an interruption of the DC operating voltage at the control terminal.
    Type: Application
    Filed: February 5, 2019
    Publication date: July 25, 2019
    Applicant: Lumileds LLC
    Inventor: Yifeng QIU
  • Publication number: 20190223267
    Abstract: An automotive headlight is disclosed including: an optical unit including a plurality of optical elements, each optical element having a different central direction; a segmented light-emitting diode (LED) chip including a plurality of LEDs that are separated by trenches formed on the segmented LED chip and arranged in a plurality of sections, each section being aligned with a different respective optical element, and each section including at least one first LED and at least one second LED; and a controller configured to: apply a forward bias to each of the first LEDs, apply a reverse bias to each of the second LEDs, and change a brightness of the first LEDs in any section based on a signal generated by the second LED in that section.
    Type: Application
    Filed: March 27, 2019
    Publication date: July 18, 2019
    Applicant: Lumileds LLC
    Inventors: Erik Charles Nelson, Isaac Wildeson, Parijat Deb, Kenneth Vampola
  • Publication number: 20190219248
    Abstract: A light conversion package for a semiconductor light source includes a light conversion block, a substrate, and an interconnector. The light conversion block is positioned to receive incident light from the semiconductor light source and acts to convert the incident light to light having a different spectral distribution. The interconnector attaches the light conversion block to the substrate and limits a thermal resistance between the light conversion block and the substrate so that the substrate can efficiently sink heat from the light conversion block. The interconnector and the substrate together may still provide high reflectivity.
    Type: Application
    Filed: June 14, 2017
    Publication date: July 18, 2019
    Applicant: Lumileds LLC
    Inventors: Genia PATENT, Christian KLEIJNEN, Alexander VDOVIN, Ralph MAESSEN
  • Patent number: 10355182
    Abstract: A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: July 16, 2019
    Assignee: LUMILEDS LLC
    Inventors: Walter Daeschner, Frederic Stephane Diana, Mohiuddin Mala, Ashim Shatil Haque, Mark Melvin Butterworth
  • Patent number: 10355168
    Abstract: A lighting device according to embodiments of the invention includes a substrate with a plurality of holes that extend from a surface of the substrate. A non-III-nitride material is disposed within the plurality of holes. The surface of the substrate is free of the non-III-nitride material. A semiconductor structure is grown on the surface of the substrate. The semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: July 16, 2019
    Assignee: LUMILEDS LLC
    Inventor: Toni Lopez
  • Patent number: 10344946
    Abstract: An elongated lens (300) is formed with a trough (310) along the long axis on the light emitting surface of the lens. The elongated lens (300) may include a curved wall (325) about its perimeter, and a smooth transition (317) between the curved wall (325) and the trough (310). The trough (310) may include a concave shape along both the long axis and the short axis, although the radius of curvature of the concave shape may differ between the long and short axes. The eccentricity of the illumination pattern may be controlled by the size of the trough (310) and these radii of curvature.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: July 9, 2019
    Assignee: LUMILEDS LLC
    Inventor: Michael David Camras
  • Patent number: 10347800
    Abstract: Embodiments of the invention include a light emitting device, a first wavelength converting material, and a second wavelength converting material. The first wavelength converting material includes a nanostructured wavelength converting material. The nanostructured wavelength converting material includes particles having at least one dimension that is no more than 100 nm in length. The first wavelength converting material is spaced apart from the light emitting device.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: July 9, 2019
    Assignee: LUMILEDS LLC
    Inventors: Debasis Bera, Mark Melvin Butterworth, Oleg Borisovich Shchekin
  • Patent number: 10345509
    Abstract: An apparatus is disclosed including a light guide and a plurality of light emitting diodes (LEDs). The light guide includes a rear portion including a first edge, a second edge, and a rear edge. The first edge meets the rear edge at a first obtuse angle, and the second edge meets the rear edge at a second obtuse angle. The plurality of light emitting diodes (LEDs) disposed on the first edge, the second edge, and the rear edge, and it is arranged to produce an asymmetric light distribution pattern including a rear light emission and a forward light emission having a greater peak intensity than the rear light emission.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: July 9, 2019
    Assignee: Lumileds LLC
    Inventors: Jeroen Den Breejen, Frederic Stephane Diana
  • Publication number: 20190206926
    Abstract: A light emitting diode (LED) may include a conductive via in a first portion of an epitaxial layer and a first contact on a second portion of the epitaxial layer. The first portion and the second portion may be separated by an isolation region. The LED may include a transparent conductive layer on the epitaxial layer.
    Type: Application
    Filed: December 21, 2018
    Publication date: July 4, 2019
    Applicant: Lumileds LLC
    Inventors: Frederic Stephane DIANA, Alan Andrew MCREYNOLDS
  • Patent number: 10340432
    Abstract: A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: July 2, 2019
    Assignee: Lumileds LLC
    Inventors: Axel Mehnert, Dusan Golubovic, Marcus Franciscus Donker, Hendrik Jan Eggink, Rene Van Honschooten, Theodoor Cornelis Treurniet
  • Patent number: 10340427
    Abstract: The invention provides a luminescent material (10) based on quantum dots (100), wherein the quantum dots (100) have inorganic capping agents (110), wherein the luminescent material (10) comprises particles (12) having an inorganic salt matrix (14) hosting the quantum dots (100) with inorganic capping agents (110), wherein the luminescent quantum dots (100) have an outer layer (105). The invention also provides a method for the production of such luminescent material (10). The new luminescent material can be used and processed as conventional particulate luminescent material.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: July 2, 2019
    Assignee: Lumileds LLC
    Inventors: Patrick John Baesjou, Stefan Willi Julius Gruhlke, Roelof Koole, Johannes Franciscus Maria Cillessen
  • Patent number: 10340310
    Abstract: Described herein is source sensitive optic that uses reconfigurable chip-on-board (CoB) light emitting diode (LED) arrays as light sources. In an implementation, the reconfigurable CoB LED array includes a predetermined number of LEDs that are configurable for a variety of illumination scenarios. In an implementation, the reconfigurable CoB LED array is multiple CoB LED arrays that are configured for use with the source sensitive optic as described herein. The source sensitive optic includes surface shapes that are responsive to the reconfigurable CoB LED array. The source sensitive optic is configured to provide beam profile and radiation pattern differentiation based on a CoB LED array configuration configured from the reconfigurable CoB LED. Each configurable CoB LED array configuration radiates a different beam pattern via the surface shapes due to proximity and surface shape geometries.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: July 2, 2019
    Assignee: Lumileds LLC
    Inventors: Charles Schrama, Varun Dev Kakkar, Erno Fancsali
  • Publication number: 20190198716
    Abstract: A light-emitting device is disclosed which includes a segmented active layer disposed between a segmented conductivity layer and a continuous conductivity layer, the active layer, the segmented conductivity layer, and the continuous conductivity layer being arranged to define a plurality of pixels, each pixel including a different segment of the segmented conductivity layer and the segmented active layer. A continuous wavelength converting layer disposed on the continuous conductivity layer is provided. A plurality of first contacts, each first contact being electrically connected to a different segment of the segmented conductivity layer is provided. One or more second contacts that are electrically connected to the continuous conductivity layer are also provided, the number of second contacts being less than the number of first contacts.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventors: Luke GORDON, Oleg SHCHEKIN, Ashish TANDON, Rajat SHARMA, Joseph FLEMISH, Andrei PAPOU, Wen YU, Erik YOUNG
  • Publication number: 20190198561
    Abstract: A light emitting diode (LED) array may include a first pixel and a second pixel on a substrate. The first pixel and the second pixel may include one or more tunnel junctions on one or more LEDs. The LED array may include a first trench between the first pixel and the second pixel. The trench may extend to the substrate.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventors: Isaac Harshman WILDESON, Parijat Pramil DEB, Robert ARMITAGE
  • Publication number: 20190195466
    Abstract: A device including a phosphor layer having a plurality of air gaps arranged within the phosphor layer to block lateral light transmission. The phosphor layer can be sized and positioned to be continuously extend over a plurality of LED emitter pixels.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventors: Kentaro SHIMIZU, Venkata Ananth TAMMA, Hisashi MASUI
  • Publication number: 20190198723
    Abstract: A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder filling the porous glass or silicon support structure.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventors: Grigoriy BASIN, Mooi Guan NG, Lex Alan KOSOWSKY, Phillip BARTON
  • Publication number: 20190198732
    Abstract: A first pixel with a first pixel sidewall is disclosed. A second pixel with a second pixel sidewall facing the first pixel sidewall is also disclosed. A first dynamic optical isolation material between the first pixel sidewall and the second pixel sidewall and configured to change an optical state based on a state trigger such that a light behavior at the first pixel sidewall for a light emitted by one of the first pixel and the second pixel is determined by the optical state, is also disclosed.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventors: Kentaro SHIMIZU, Marcel Rene BOHMER, Daniel ESTRADA, Jacobus Johannes Franciscus Gerardus HEUTS
  • Publication number: 20190195479
    Abstract: Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly including a thermally conductive plate and a COB light-emitting diode (LED) device thermally coupled to the thermally conductive plate. The COB LED device includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts exposed from at least the surface. The system further includes an electronics board that has second electrical power contacts. The electronics board is attached to the COB assembly such that the first and second electrical contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventor: Ronald BONNE
  • Publication number: 20190198564
    Abstract: A device may include a metal contact between a first isolation region and a second isolation region on a first surface of an epitaxial layer. The device may include a first sidewall and a second sidewall on a second surface of the epitaxial layer distal to the first isolation region and the second isolation region. The device may include a wavelength converting layer on the epitaxial layer between the first sidewall and the second sidewall.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventors: Ashish TANDON, Rajat SHARMA, Joseph Robert FLEMISH, Andrei PAPOU, Wen YU, Erik YOUNG, Yu-Chen SHEN, Luke GORDON