Abstract: Light-emitting devices, and related components, systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: The embodiments described herein are drawn generally towards illumination assemblies including light emitting devices. In some embodiments, the illumination assemblies including chip-scale packaged light-emitting devices and optical elements.

Abstract: Wavelength converting light-emitting devices and methods of making the same are provided. In some embodiments, the devices include a phosphor material region designed to convert the wavelength of emitted light.

Abstract: Light-emitting devices, and related assemblies, systems and methods are described. Specifically, at least some of the embodiments relate to light-emitting devices including proximate switching element(s). The switching element(s) control the current, or power, supplied to the light-emitting devices.

Abstract: Electronic devices involving contact structures, and related components, systems and methods associated therewith are described. Contact structures (also referred to as electrical contact structures or electrodes) are features on a device that are electrically connected to a power source. The power source can provide current to the device via the contact structures. The contact structures can be designed to improve current distribution in electronic devices. For example, the contact resistance of the contacts may be modified to improve current distribution (e.g., by controlling the shape and/or structure and/or composition of the contacts). The contact structures may include an intervening layer (e.g., a non-ohmic layer) positioned between a surface of the device and a conductive portion extending from a conductive pad. The intervening layer and/or conductive portions may be designed to have certain shapes (e.g.

Abstract: On-wafer test systems and methods for light-emitting devices, such as light-emitting diodes (LEDs), are provided. The test system may be designed, for example, to characterize the light output from the LED die (e.g., power in Lumens).

Abstract: Electronic device contact structures are disclosed.

Abstract: Light-emitting devices, and related components, systems and methods are disclosed.

Abstract: A method, and associated apparatus, for attaching a component (e.g., an electronic and/or optoelectronic component) is provided which can facilitate low-voiding of an attachment layer. The method includes disposing an attachment material layer over a surface, providing the component having a backside surface, disposing a portion of the backside surface of the component over a first portion of the attachment material layer such that a substantial portion of the backside surface of the component is not disposed over the attachment material layer, and moving the component such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer. The attachment material can include a solder.

Abstract: Light-emitting device methods are disclosed.

Abstract: Optical display systems and methods are disclosed.

Abstract: Optical display systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, systems and methods are disclosed.

Abstract: Light-emitting device methods are disclosed.