Patents Assigned to Machine Technology, Inc.
  • Patent number: 4845867
    Abstract: A triple-purpose attachment for articulated back-hoes and the like comprises an earth-working bucket having a clamping/scarifying arm mounted to pivot in an arc about the same axis as the bucket, or about another axis passing through the bucket normal to the longitudinal axis of the dipper stick. The arc is fixed relative to the bucket. The lower end of the arm includes forward and rear teeth, and the arm is pivotably moved by hydraulic motive means to be useful by itself or in combination with the bucket in excavation, ripping, lifting, moving and turning objects.
    Type: Grant
    Filed: March 14, 1988
    Date of Patent: July 11, 1989
    Assignee: Wausau Machine and Technology, Inc.
    Inventor: Allan J. Albrecht
  • Patent number: 4818561
    Abstract: Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.
    Type: Grant
    Filed: May 6, 1987
    Date of Patent: April 4, 1989
    Assignee: Machine Technology, Inc.
    Inventor: Thomas L. Strahl
  • Patent number: 4776923
    Abstract: In semiconductor treatment apparatus with a plasma generating zone, a treatment zone, and a bent path connecting the two so as to block direct transmission of ultraviolet light from the plasma generating zone to the workpiece in the treatment zone, a light trap is provided to suppress indirect transmission of light as by reflection or by transmission within transparent walls of a conduit defining the bent path.
    Type: Grant
    Filed: January 20, 1987
    Date of Patent: October 11, 1988
    Assignee: Machine Technology, Inc.
    Inventors: John E. Spencer, Scott S. Miller, Woodie J. Sutton, Andrew M. Hoff
  • Patent number: 4756810
    Abstract: A layer of a substance such as an aluminum alloy is deposited, preferably by sputtering, onto a surface of a substrate such as a semiconductor wafer. The deposited substance is redistributed by bombarding the layer with ions. The ion bombardment may be induced by applying low frequency RF excitation at about 5 KHz -1 MHz to the substrate.
    Type: Grant
    Filed: December 4, 1986
    Date of Patent: July 12, 1988
    Assignee: Machine Technology, Inc.
    Inventors: Lawrence T. Lamont, Jr., Roderick C. Mosely, Timothy M. McEntee
  • Patent number: 4722298
    Abstract: A self-contained modular processing apparatus is disclosed for processing workpieces, and in particular, silicon wafers. The apparatus is constructed of framed modules which plug into a service facility docking subassembly and interlock therewith to make up a complete modular processing system for wafer processing. Each module may be provided with its own wafer transporting mechanism and includes a built-in CPU such that each module is an independent, stand-alone processing unit. Each processing unit, by being capable of independent operation, functions as a building block to configure a modular processing system capable of handling wafer flow in multiple directions while performing a multitude of processing functions or operations. Individual modules are arranged along a line of single fold symmetry such that a single transport mechanism may be employed for transferring wafers among adjacent modules.
    Type: Grant
    Filed: May 19, 1986
    Date of Patent: February 2, 1988
    Assignee: Machine Technology, Inc.
    Inventors: Richard H. Rubin, Benjamin J. Petrone, Richard C. Heim, Scott M. Pawenski
  • Patent number: 4717461
    Abstract: A method of processing a plurality of semiconductor wafers from a wafer cassette including a wafer transfer housing and one or more processing chambers. A wafer is removed from its cassette and transported through the transfer housing into one or more processing chambers for etching, deposition or other such operations. The processed wafer is replaced into its cassette after being transported back through the wafer transfer housing.
    Type: Grant
    Filed: September 15, 1986
    Date of Patent: January 5, 1988
    Assignee: Machine Technology, Inc.
    Inventors: Thomas L. Strahl, Lawrence T. Lamont, Jr., Carl T. Peterson, Hobart A. Brown, Lonnie W. McCormick, Roderick C. Mosely
  • Patent number: 4711610
    Abstract: A balancing chuck is disclosed for semiconductor wafers having a flat region which typically causes wafer imbalance on spinning equipment. The wafer's flat region is determined by a proximity sensor mounted on a centering arm overlying the wafer. The chuck is constructed to include an annular race containing a spherical counterweight. As the chuck is rotated to determine the wafer's flat region, a magnet prevents movement of the spherical counterweight within the race and allows for its subsequent alignment with the mass imbalance. A plurality of circumferential pockets are provided within the race to retain the position of the counterweight which functions as a counterbalance maintained in proper angular alignment during spinning of the chuck.
    Type: Grant
    Filed: April 4, 1986
    Date of Patent: December 8, 1987
    Assignee: Machine Technology, Inc.
    Inventor: Roger W. Riehl
  • Patent number: 4685852
    Abstract: Methods and apparatus for transferring workpieces, such as silicon wafers, between a pair of cassettes involve simultaneously and conjointly indexing the cassettes such that the cassettes are incrementally lowered as the individual workpieces are removed from one cassette and delivered to the other cassette. Such indexing of the cassettes is achieved by a single elevator mechanism adapted to support both of the cassettes such that they are vertically and horizontally offset relative to each other.
    Type: Grant
    Filed: May 20, 1985
    Date of Patent: August 11, 1987
    Assignee: Machine Technology, Inc.
    Inventors: Richard H. Rubin, Gary Hillman, Lewis E. Zarr, William K. Hayes
  • Patent number: 4674521
    Abstract: Rinsing methods and apparatus employ a rotatable work support to spray rinsing liquid against a surrounding wall of a processing station. The rinsing liquid washes residual processing liquid from the surrounding wall of the processing station, whereby the work support performs a cleaning function in addition to its conventional processing function.
    Type: Grant
    Filed: May 20, 1985
    Date of Patent: June 23, 1987
    Assignee: Machine Technology, Inc.
    Inventor: Bernard Paulfus
  • Patent number: 4673456
    Abstract: A microwave apparatus for generating plasma afterglows for stripping and/or etching of photoresist and semiconductor material at a sufficiently high rate to allow single wafer processing in a fully automated reactor. The apparatus includes a stripping/etching chamber for plasma afterglow stripping of photoresist and selective isotropic etching of semiconductor material, such as polysilicon and silicon nitride, using a variety of etchant compositions which form reactive species in a plasma. In addition, the apparatus may be employed for anisotropic etching for semiconductive material by decoupling etchant generation from ion production and acceleration by using two plasma sources, i.e., microwave power and radio frequency (RF) power. Anisotropic etching is carried out in an etching chamber which subjects, in situ, a plasma afterglow to RF power and which is designed to operate in the reactive ion etch mode.
    Type: Grant
    Filed: September 17, 1985
    Date of Patent: June 16, 1987
    Assignee: Machine Technology, Inc.
    Inventors: John E. Spencer, Richard A. Borel, Kenneth E. Linxwiler, Andrew M. Hoff
  • Patent number: 4664935
    Abstract: Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.
    Type: Grant
    Filed: September 24, 1985
    Date of Patent: May 12, 1987
    Assignee: Machine Technology, Inc.
    Inventor: Thomas L. Strahl
  • Patent number: 4592926
    Abstract: A vacuum processing apparatus and method utilize a vacuum chamber formed from a pair of casing sections, one of which is movable in to and out of sealing engagement with the other casing section. The movable casing section is equipped to carry a workpiece such that the workpiece is carried by the movable casing section as it moves into and out of sealing engagement with the other casing section and such that the workpiece is delivered to a processing station associated with the other casing section when the two casing sections are in sealing engagement with each other.
    Type: Grant
    Filed: May 21, 1984
    Date of Patent: June 3, 1986
    Assignee: Machine Technology, Inc.
    Inventors: Richard H. Rubin, Gary Hillman
  • Patent number: 4519526
    Abstract: An anti-drip system for a dispenser in the form of a deformable conduit adapted to dispense a liquid, such as a photoresist, from a dispensing tip located at one end of the conduit includes a rigid housing which surrounds an intermediate portion of the conduit. The housing is closed except for a port which permits pressurized air to be supplied to and exhausted from the housing. At the commencement of a dispensing operation, the liquid is transported through the conduit as the housing is simultaneously pressurized, thereby crimping the intermediate portion of the conduit. At the conclusion of the dispensing operation, air pressure in the housing is simultaneously reduced, thereby allowing the conduit to expand and assume its natural substantially uncrimped shape. Expansion of the conduit creates a vacuum sufficient to suck back liquid which is being dispensed from the conduit.
    Type: Grant
    Filed: March 25, 1982
    Date of Patent: May 28, 1985
    Assignee: Machine Technology, Inc.
    Inventor: Gary Hillman
  • Patent number: 4517752
    Abstract: An apparatus and method for retarding splashback of liquids collected from a rotating workpiece is disclosed. In accordance with the apparatus, there is provided a work station upon which a workpiece, such as a semiconductor wafer, is positioned, a collecting means for collecting liquids discharged from the workpiece by rotation of the work station and a means for rotating the collecting means. Also in accordance with the present invention, the collecting means may be rotated separately from the work station but in the same direction as the work station. In accordance with the method, there is provided applying liquids to the workpiece, rotating work station with the workpiece positioned on it and rotating a collecting means in the same direction as the work station. Also in accordance with the invention, the apparatus may be combined with apparatus for a segregated drainage of first and second liquids such that splashback during collection of these liquids will be retarded.
    Type: Grant
    Filed: June 27, 1983
    Date of Patent: May 21, 1985
    Assignee: Machine Technology, Inc.
    Inventors: Michael J. Devico, Gary Hillman
  • Patent number: 4281031
    Abstract: An arrangement is provided for performing a plurality of processes on workpieces, such as silicon wafers, while they remain at a single processing station. The processing operations include scrubbing, coating, developing, and/or baking the wafer without removing it from a work support at the work station. The apparatus includes a transferring device for automatically transferring the wafer from a cassette to a work support. In addition, positioned about the centrally-located work support is a scrubbing device for scrubbing the wafer and a liquid dispensing device for dispensing liquid on the wafer. Each is movable into and out of position over the work support. In addition, the work support is surrounded by a microwave chamber for baking the wafer while it remains on the work support.
    Type: Grant
    Filed: July 25, 1979
    Date of Patent: July 28, 1981
    Assignee: Machine Technology, Inc.
    Inventors: Gary Hillman, Michael J. Devico
  • Patent number: 4190015
    Abstract: A liquid dispenser is disclosed which is arranged to dispense a fixed amount of liquid on a workpiece and is then moved away from the workpiece so that no further drops of the liquid fall on the workpiece.
    Type: Grant
    Filed: December 8, 1977
    Date of Patent: February 26, 1980
    Assignee: Machine Technology, Inc.
    Inventor: Gary Hillman
  • Patent number: 4109337
    Abstract: Apparatus is disclosed for automatically and simultaneously cleaning both sides of a plurality of workpieces. The workpieces are illustratively thin, fragile slices of brittle material, such as single-crystal silicon wafers. These workpieces are supplied to the cleaning apparatus within a cassette. The cleaning apparatus includes a cassette receiving station, a processing station and guide means extending from the cassette receiving station through the processing station. The guide means is adapted to receive edge portions of the workpieces. A transfer arm is extended from a retracted position through the cassette so that a first portion of the transfer arm pushes a workpiece along the guide means through the processing station. The transfer arm is then retracted and a second portion of the transfer arm pushes the workpiece along the guide means back through the processing station and into the cassette.
    Type: Grant
    Filed: December 8, 1977
    Date of Patent: August 29, 1978
    Assignee: Machine Technology, Inc.
    Inventors: Gary Hillman, Michael Devico
  • Patent number: 4062463
    Abstract: Apparatus is provided for transferring a selected one of a plurality of workpieces, such as silicon wafers or masks, from within a cassette containing the workpieces to a processing station for scrubbing, etching, etc. The apparatus includes a wafer-supporting arm which is movable between a retracted position within the cassette and a scrubbing station for moving the selected one of the silicon wafers from its position within the cassette to the scrubbing station and for returning the selected wafer from the scrubbing station to the cassette. A selection device then operates to move the cassette downwardly so that the next silicon wafer to be cleaned is in position to be picked up by the wafer-supporting arm when it is next moved between its retracted position and the scrubbing station.
    Type: Grant
    Filed: May 11, 1976
    Date of Patent: December 13, 1977
    Assignee: Machine Technology, Inc.
    Inventors: Gary Hillman, Michael J. Devico