Patents Assigned to Machine Technology, Inc.
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Patent number: 6261167Abstract: An abrasive tool includes a first perforated sheet having a front surface and a back surface, and a second perforated sheet having a front surface and a back surface. A first layer of abrasive grains is bonded to the front surface of the first perforated sheet and a second layer of abrasive grains is bonded to the front surface of the second perforated sheet. A core is made of a first material, the core having a first surface and a second surface, the back surface of the first perforated sheet disposed adjacent to the first surface of the core and the back surface of the second perforated sheet disposed adjacent to the second surface of the core, the core being bonded to the first perforated sheet and the second perforated sheet by forming the core between the first perforated sheet and the second perforated sheet.Type: GrantFiled: December 15, 1998Date of Patent: July 17, 2001Assignee: Diamond Machining Technology, Inc.Inventors: Stanley A. Watson, David G. Powell
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Patent number: 6237453Abstract: A rigid tool slide support is disposed to be mounted in a screw machine in either of two different operating positions in each of which a tool slide reciprocates on the upper surface of the support to convey a cutting tool to and from the work that is to be machined. Projecting centrally from the bottom surface of the slide is an elongate, dovetail shaped guide which is slidably mounted in a similarly shaped but slightly wider recess in the support. Secured in the recess of the support adjacent one side thereof, and slidably engaged with a confronting side of the dovetail guide of the slide, is an elongate expansion gib having therein an adjusting screw that is rotatably adjustable to expand or contract the length of the gib, thereby to adjust the running clearance between the support and the slide.Type: GrantFiled: October 18, 1999Date of Patent: May 29, 2001Assignee: C.J. Winter Machine Technologies, Inc.Inventors: Jeffrey C. Snow, Sandro G. Belpanno
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Patent number: 6202461Abstract: The attachment includes a generally U-shaped bracket having a pair of roll arms which are pivotally mounted intermediate their ends on the outer ends, respectively, the two arms of the U-shaped bracket. Each roll arm has a thread roll rotatably mounted on its outer end and a roller follower rotatably mounted on its inner end. The bracket is secured on the slide of a screw machine for reciprocation thereby in a direction selectively to engage the thread rolls tangentially with diametrally opposite sides of a rotating workpiece that is to be threaded.Type: GrantFiled: February 3, 1999Date of Patent: March 20, 2001Assignee: C. J. Winter Machine Technologies, Inc.Inventor: Robert J. Brinkman
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Patent number: 6135176Abstract: Chipping heads are mounted for lateral movement in one dimension in a gang saw module which is itself moveable translationally in the first dimension and angularly in a second dimension, for skewing relative to an in-feed direction of a curved cant. The chipping heads are mounted on an in-feed side of the gang saw assembly. Stationary drive motors are mounted directly above the chipping heads, supported by a tower that is independent of the gang saw module. Vertical drive lines with U-joints drivingly connect the drive motors to the chipping heads while permitting the chipping heads to be moved normal to the axes of rotation of the drive motors. The motors are centered above the chipping heads, with their vertical drive axes midway between lateral endpoints in each dimension of the range of travel of the chipping heads. Motor spacing above the chipping heads and the drive line lengths are sufficient to accommodate that range of lateral travel.Type: GrantFiled: June 8, 1999Date of Patent: October 24, 2000Assignee: Timber Machine Technologies, Inc.Inventor: Greg F. Smith
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Patent number: 5976001Abstract: An abrasive tool includes a base having an upper surface and a perforated sheet having a lower surface and an upper surface. A layer of abrasive grains is bonded to the upper surface of the perforated sheet. The upper surface of the base is bonded to the lower surface of the perforated sheet by a brazing material. A method of assembling an abrasive tool includes bonding the upper surface of the base and the lower surface of the perforated sheet by brazing the surfaces together and bonding a layer of abrasive grains to the upper surface of the perforated sheet.Type: GrantFiled: April 24, 1997Date of Patent: November 2, 1999Assignee: Diamond Machining Technology, Inc.Inventors: David G. Powell, Stanley A. Watson
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Patent number: 5919084Abstract: An abrasive tool and method for assembling same includes a first base having a front surface and a back surface and a second base having a front surface and a back surface. A first perforated sheet has a front surface and a back surface, the back surface of the first perforated sheet being bonded to the front surface of the first base. A second perforated sheet has a front surface and a back surface, the back surface of the second perforated sheet being bonded to the front surface of the second base. A first layer of abrasive grains is bonded to the front surface of the first perforated sheet, and a second layer of abrasive grains is bonded to the front surface of the second perforated sheet. The back surface of the first base is bonded to the back surface of the second base. The back surfaces of the bases may be bonded by sonic welding.Type: GrantFiled: June 25, 1997Date of Patent: July 6, 1999Assignee: Diamond Machining Technology, Inc.Inventors: David G. Powell, Stanley A. Watson
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Patent number: 5396716Abstract: A drying apparatus includes a plurality of dryer modules, each module creating a drying zone and having a plurality of tubes disposed above and below an upper surface of a conveyor that supports a product within the apparatus for transport therethrough. At least one circulation fan in each module causes heated air to circulate to the tubes, which direct the air flow to impinge upon and dry the product. Each module also includes a burner for heating the air within the module to a desired temperature. The circulation fan and burner of each module are independently controllable, so that the apparatus can produce an air-flow rate and an air temperature in at least one of the drying zones different than the air-flow rate and air temperature in at least one other of the drying zones.Type: GrantFiled: July 20, 1993Date of Patent: March 14, 1995Assignee: Smart Machine Technologies, Inc.Inventors: Irma H. Smart, Michael A. Edmonds
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Patent number: 5114556Abstract: A layer of a substance such as a metal, non-metal or metal alloy is deposited, preferably by sputtering, onto the surface of a substrate such as a semiconductor wafer. The adatoms of the deposited layer are mobilized by being bombarded with a flux of low energy neutral atoms or molecules at an oblique angle of incidence to enhance step coverage and/or planarization of the semiconductor wafer. The neutral atoms or molecules are formed within the plasma by applying a negative bias potential to a reflector electrode which will attract positive ions from the plasma. The neutral atoms or molecules elastically scatter from the surface of the electrode to bombard the adatoms being deposited during the operation of the sputter source.Type: GrantFiled: December 27, 1989Date of Patent: May 19, 1992Assignee: Machine Technology, Inc.Inventor: Lawrence T. Lamont, Jr.
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Patent number: 5094884Abstract: An apparatus and method is disclosed for applying a uniform layer of a fluid material such as photoresist onto the surface of a rotating workpiece such as a semiconductor wafer. A dispensing nozzle is provided with a rectangular or oblong shaped opening for painting a broad swath of the fluid material onto the surface of the workpiece while the nozzle moves along a radial path inwardly from the peripheral edge of the workpiece. The use of a rectangular or oblong shaped nozzle opening minimizes the amount of fluid material being consumed while providing a uniform thin film coating on the workpiece surface.Type: GrantFiled: April 24, 1990Date of Patent: March 10, 1992Assignee: Machine Technology, Inc.Inventors: Gary Hillman, Robert D. Mohondro
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Patent number: 4885075Abstract: A device for cooling a sputter target of a deposition apparatus utilizes an annular shaped member of high thermal conductivity disposed between the cathode and the target electrode. The member is constructed of a base disposed in a corresponding recess in the cathode, or integrally formed therewith, and a member projecting perpendicularly from the base disposed in a corresponding annular shaped recess in the target electrode. One or more members are disposed proximate a source of cooling water applied to the cathode, and at points of greatest power flux in the target electrode. Upon heating, the target electrode expands radially against the members, thereby effecting reduction in the temperature of the target electrode.Type: GrantFiled: December 22, 1988Date of Patent: December 5, 1989Assignee: Machine Technology, Inc.Inventor: Gary Hillman
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Patent number: 4856456Abstract: An apparatus and method achieves the submersiontype processing of silicon wafers in a manufacturing process for the fabrication of semiconductor devices therefrom. The silicon wafer is uniformly flooded with the process fluid in a manner which prevents impingement thereof during chemical processing, such as wet etching, cleaning, photoresist developing and the like. Upon flooding the silicon wafer, a gas pocket is formed between a portion of the lower surface of the wafer and an adjacent portion of vacuum chuck to which the wafer is mounted. The resulting gas pocket prevents accumulation of processed fluid therein to facilitate spin drying of the wafer.Type: GrantFiled: October 3, 1988Date of Patent: August 15, 1989Assignee: Machine Technology, Inc.Inventors: Gary Hillman, Richard H. Rubin, Bernard H. Paulfus
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Patent number: 4852516Abstract: A self-contained modular processing apparatus is disclosed for processing workpieces, and in particular, silicon wafers. The apparatus is constructed of framed modules which plug into a service facility docking subassembly and interlock therewith to make up a complete modular processing system for wafer processing. Each module may be provided with its own wafer transporting mechanism and includes a built-in CPU such that each module is an independent, stand-alone processing unit. Each processing unit, by being capable of independent operation, functions as a building block to configure a modular processing system capable of handling wafer flow in multiple directions while performing a multitude of processing functions or operations. Individual modules are arranged along a line of single fold symmetry such that a single transport mechanism may be employed for transferring wafers among adjacent modules.Type: GrantFiled: September 1, 1987Date of Patent: August 1, 1989Assignee: Machine Technology, Inc.Inventors: Richard H. Rubin, Benjamin J. Petrone, Richard C. Heim, Scott M. Pawenski
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Patent number: 4818561Abstract: Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.Type: GrantFiled: May 6, 1987Date of Patent: April 4, 1989Assignee: Machine Technology, Inc.Inventor: Thomas L. Strahl
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Patent number: 4776923Abstract: In semiconductor treatment apparatus with a plasma generating zone, a treatment zone, and a bent path connecting the two so as to block direct transmission of ultraviolet light from the plasma generating zone to the workpiece in the treatment zone, a light trap is provided to suppress indirect transmission of light as by reflection or by transmission within transparent walls of a conduit defining the bent path.Type: GrantFiled: January 20, 1987Date of Patent: October 11, 1988Assignee: Machine Technology, Inc.Inventors: John E. Spencer, Scott S. Miller, Woodie J. Sutton, Andrew M. Hoff
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Patent number: 4756810Abstract: A layer of a substance such as an aluminum alloy is deposited, preferably by sputtering, onto a surface of a substrate such as a semiconductor wafer. The deposited substance is redistributed by bombarding the layer with ions. The ion bombardment may be induced by applying low frequency RF excitation at about 5 KHz -1 MHz to the substrate.Type: GrantFiled: December 4, 1986Date of Patent: July 12, 1988Assignee: Machine Technology, Inc.Inventors: Lawrence T. Lamont, Jr., Roderick C. Mosely, Timothy M. McEntee
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Patent number: 4722298Abstract: A self-contained modular processing apparatus is disclosed for processing workpieces, and in particular, silicon wafers. The apparatus is constructed of framed modules which plug into a service facility docking subassembly and interlock therewith to make up a complete modular processing system for wafer processing. Each module may be provided with its own wafer transporting mechanism and includes a built-in CPU such that each module is an independent, stand-alone processing unit. Each processing unit, by being capable of independent operation, functions as a building block to configure a modular processing system capable of handling wafer flow in multiple directions while performing a multitude of processing functions or operations. Individual modules are arranged along a line of single fold symmetry such that a single transport mechanism may be employed for transferring wafers among adjacent modules.Type: GrantFiled: May 19, 1986Date of Patent: February 2, 1988Assignee: Machine Technology, Inc.Inventors: Richard H. Rubin, Benjamin J. Petrone, Richard C. Heim, Scott M. Pawenski
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Patent number: 4717461Abstract: A method of processing a plurality of semiconductor wafers from a wafer cassette including a wafer transfer housing and one or more processing chambers. A wafer is removed from its cassette and transported through the transfer housing into one or more processing chambers for etching, deposition or other such operations. The processed wafer is replaced into its cassette after being transported back through the wafer transfer housing.Type: GrantFiled: September 15, 1986Date of Patent: January 5, 1988Assignee: Machine Technology, Inc.Inventors: Thomas L. Strahl, Lawrence T. Lamont, Jr., Carl T. Peterson, Hobart A. Brown, Lonnie W. McCormick, Roderick C. Mosely
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Patent number: 4711610Abstract: A balancing chuck is disclosed for semiconductor wafers having a flat region which typically causes wafer imbalance on spinning equipment. The wafer's flat region is determined by a proximity sensor mounted on a centering arm overlying the wafer. The chuck is constructed to include an annular race containing a spherical counterweight. As the chuck is rotated to determine the wafer's flat region, a magnet prevents movement of the spherical counterweight within the race and allows for its subsequent alignment with the mass imbalance. A plurality of circumferential pockets are provided within the race to retain the position of the counterweight which functions as a counterbalance maintained in proper angular alignment during spinning of the chuck.Type: GrantFiled: April 4, 1986Date of Patent: December 8, 1987Assignee: Machine Technology, Inc.Inventor: Roger W. Riehl
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Patent number: 4685852Abstract: Methods and apparatus for transferring workpieces, such as silicon wafers, between a pair of cassettes involve simultaneously and conjointly indexing the cassettes such that the cassettes are incrementally lowered as the individual workpieces are removed from one cassette and delivered to the other cassette. Such indexing of the cassettes is achieved by a single elevator mechanism adapted to support both of the cassettes such that they are vertically and horizontally offset relative to each other.Type: GrantFiled: May 20, 1985Date of Patent: August 11, 1987Assignee: Machine Technology, Inc.Inventors: Richard H. Rubin, Gary Hillman, Lewis E. Zarr, William K. Hayes
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Patent number: 4674521Abstract: Rinsing methods and apparatus employ a rotatable work support to spray rinsing liquid against a surrounding wall of a processing station. The rinsing liquid washes residual processing liquid from the surrounding wall of the processing station, whereby the work support performs a cleaning function in addition to its conventional processing function.Type: GrantFiled: May 20, 1985Date of Patent: June 23, 1987Assignee: Machine Technology, Inc.Inventor: Bernard Paulfus