Abstract: A microwave apparatus for generating plasma afterglows for stripping and/or etching of photoresist and semiconductor material at a sufficiently high rate to allow single wafer processing in a fully automated reactor. The apparatus includes a stripping/etching chamber for plasma afterglow stripping of photoresist and selective isotropic etching of semiconductor material, such as polysilicon and silicon nitride, using a variety of etchant compositions which form reactive species in a plasma. In addition, the apparatus may be employed for anisotropic etching for semiconductive material by decoupling etchant generation from ion production and acceleration by using two plasma sources, i.e., microwave power and radio frequency (RF) power. Anisotropic etching is carried out in an etching chamber which subjects, in situ, a plasma afterglow to RF power and which is designed to operate in the reactive ion etch mode.

Abstract: Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.

Abstract: A vacuum processing apparatus and method utilize a vacuum chamber formed from a pair of casing sections, one of which is movable in to and out of sealing engagement with the other casing section. The movable casing section is equipped to carry a workpiece such that the workpiece is carried by the movable casing section as it moves into and out of sealing engagement with the other casing section and such that the workpiece is delivered to a processing station associated with the other casing section when the two casing sections are in sealing engagement with each other.

Abstract: An anti-drip system for a dispenser in the form of a deformable conduit adapted to dispense a liquid, such as a photoresist, from a dispensing tip located at one end of the conduit includes a rigid housing which surrounds an intermediate portion of the conduit. The housing is closed except for a port which permits pressurized air to be supplied to and exhausted from the housing. At the commencement of a dispensing operation, the liquid is transported through the conduit as the housing is simultaneously pressurized, thereby crimping the intermediate portion of the conduit. At the conclusion of the dispensing operation, air pressure in the housing is simultaneously reduced, thereby allowing the conduit to expand and assume its natural substantially uncrimped shape. Expansion of the conduit creates a vacuum sufficient to suck back liquid which is being dispensed from the conduit.

Abstract: An apparatus and method for retarding splashback of liquids collected from a rotating workpiece is disclosed. In accordance with the apparatus, there is provided a work station upon which a workpiece, such as a semiconductor wafer, is positioned, a collecting means for collecting liquids discharged from the workpiece by rotation of the work station and a means for rotating the collecting means. Also in accordance with the present invention, the collecting means may be rotated separately from the work station but in the same direction as the work station. In accordance with the method, there is provided applying liquids to the workpiece, rotating work station with the workpiece positioned on it and rotating a collecting means in the same direction as the work station. Also in accordance with the invention, the apparatus may be combined with apparatus for a segregated drainage of first and second liquids such that splashback during collection of these liquids will be retarded.

Abstract: An arrangement is provided for performing a plurality of processes on workpieces, such as silicon wafers, while they remain at a single processing station. The processing operations include scrubbing, coating, developing, and/or baking the wafer without removing it from a work support at the work station. The apparatus includes a transferring device for automatically transferring the wafer from a cassette to a work support. In addition, positioned about the centrally-located work support is a scrubbing device for scrubbing the wafer and a liquid dispensing device for dispensing liquid on the wafer. Each is movable into and out of position over the work support. In addition, the work support is surrounded by a microwave chamber for baking the wafer while it remains on the work support.

Abstract: A liquid dispenser is disclosed which is arranged to dispense a fixed amount of liquid on a workpiece and is then moved away from the workpiece so that no further drops of the liquid fall on the workpiece.

Abstract: Apparatus is disclosed for automatically and simultaneously cleaning both sides of a plurality of workpieces. The workpieces are illustratively thin, fragile slices of brittle material, such as single-crystal silicon wafers. These workpieces are supplied to the cleaning apparatus within a cassette. The cleaning apparatus includes a cassette receiving station, a processing station and guide means extending from the cassette receiving station through the processing station. The guide means is adapted to receive edge portions of the workpieces. A transfer arm is extended from a retracted position through the cassette so that a first portion of the transfer arm pushes a workpiece along the guide means through the processing station. The transfer arm is then retracted and a second portion of the transfer arm pushes the workpiece along the guide means back through the processing station and into the cassette.

Abstract: Apparatus is provided for transferring a selected one of a plurality of workpieces, such as silicon wafers or masks, from within a cassette containing the workpieces to a processing station for scrubbing, etching, etc. The apparatus includes a wafer-supporting arm which is movable between a retracted position within the cassette and a scrubbing station for moving the selected one of the silicon wafers from its position within the cassette to the scrubbing station and for returning the selected wafer from the scrubbing station to the cassette. A selection device then operates to move the cassette downwardly so that the next silicon wafer to be cleaned is in position to be picked up by the wafer-supporting arm when it is next moved between its retracted position and the scrubbing station.