Abstract: A memory system that is based on 3D NAND flash memory of a high capacity and/or capable of high performance is provided, which includes memory planes, each including a plane core and a specific set of resources. For each memory plane of the plurality of memory planes, the technology provides (i) a corresponding plane busy (PRDY) signal indicating a busy or a ready state of the specific set of recourses of the corresponding memory plane, and (ii) a corresponding plane in operation (PIO #) signal indicating an in operation or idle state of resources used by the plane core of the corresponding memory plane. Issuance of memory commands by a controller and execution of memory commands for a memory plane of the plurality of memory planes is selectively allowed or denied, based on status of one or more of the plurality of PRDY signals and the plurality of PIO # signals.

Abstract: A memory device includes, from bottom to top, a substrate, a laminated layer and a stacked structure. Vertical channel pillars penetrate through the stacked structure and the laminated layer. First isolation structures are disposed aside the vertical channel pillars and penetrate through a lower part of the stacked structure. Second isolation structures are disposed over the first isolation structures and penetrate through an upper part of the stacked structure. Common source lines are disposed aside the vertical channel pillars and penetrate through the stacked structure and part of the laminated layer. From a top view, the common source lines extend in a first direction. Each of the first and second isolation structures has, in the first direction, two wide end portions respectively adjacent to two common source lines. The memory device may be applied in the process of manufacturing a 3D NAND flash memory with high capacity and high performance.

Abstract: An overlay mark includes a previous layer mark and a current layer mark. The previous layer mark includes a plurality of first work zones. Each first working zone includes a first sub-region and a second sub-region, wherein the first sub-region is closer to a center point of the previous layer mark than the second sub-region. The previous layer mark includes a first mark and an auxiliary mark respectively in the first sub-region and the second sub-region of each first working zone. The current layer mark includes a plurality of second working zones. Each second working zone includes a first sub-region and a second sub-region. The current layer mark includes a second mark disposed in the second sub-region of each second working zone. The overlay mark may be applied in the process of manufacturing a 3D NAND flash memory with high capacity and high performance.

Abstract: Systems, devices, methods, and circuits for managing power supply in semiconductor devices are provided. The semiconductor devices can include 3D NAND flash memory devices with high capacity and/or high performance. In one aspect, a semiconductor device includes: a voltage pump, a pump switch circuit configured to be coupled to the voltage pump, and an interface including a voltage pin coupled to the pump switch circuit. The voltage pump has an input, an output, and a series of pump stages coupled between the input and the output. The pump switch circuit is configured to provide an input voltage received at the voltage pin to a corresponding node in the voltage pump to select a corresponding number of pump stages of the series of pump stages to output a target voltage at the output of the voltage pump.

Abstract: The present disclosure relates to a method for manufacturing a 3D memory device, and particularly, to a method for manufacturing high capacity and high performance 3D NAND flash memory device. The method includes: alternately stacking sacrificial layers and insulating layers; forming a channel through hole through the sacrificial layers and the insulating layers; lining the channel through hole with an initial blocking layer; and performing an oxidation treatment, for turning the initial blocking layer to a blocking oxide layer. A gas source for the oxidation treatment includes a reaction gas having hydrogen and oxygen, and includes an ionization enhancement gas formed by a first type ionization enhancement gas, a second type ionization enhancement gas or a combination thereof. The first type ionization enhancement gas includes at least one in a group consist of tritium, ozone and H2O. The second type ionization enhancement gas includes at least one inert gas.

Abstract: A memory device and a management method thereof are provided. The memory device includes a controller and at least one memory channel. The memory channel includes at least one memory chip. The at least one memory chip is commonly coupled to the controller through an interrupt signal wire. The at least one memory chip generates at least one local interrupt signal and performs a logic operation on the at least one local interrupt signal to generate a common interrupt signal. The interrupt signal wire is configured to transmit the common interrupt signal to the controller.

Abstract: The integrated circuit structure includes a substrate and a memory cell over the substrate. The memory cell includes a channel layer, a first doped region, a second doped region, a first ferroelectric layer, and a first gate layer. The first doped region is at a first side of the channel layer and doped with a first dopant being of a first conductivity type. The second doped region is at a second side of the channel layer opposing the first side and doped with a second dopant being of a second conductivity type different from the first conductivity type. The ferroelectric layer is over the channel layer and between the first and second doped regions. The gate layer is over the ferroelectric layer.

Abstract: A memory device, such as a three-dimensional AND or NOR flash memory, includes a first chip and a second chip. The first chip has multiple source line switches, multiple bit line switches, multiple page buffers, and multiple sensing amplifiers. The first chip has multiple first pads. The second chip has multiple memory cells to form multiple memory cell blocks. Multiple second pads are on a first surface of the second chip to be respectively coupled to multiple local bit lines and multiple local source lines of the memory cell blocks. Each of the first pads is coupled to the corresponding second pads.

Abstract: A memory device, such as a 3D AND type flash memory, and a compensation method of data retention thereof are provided. The compensation method includes the following. A reading operation is performed on each of a plurality of programmed memory cells of the memory device. Whether a charge loss phenomenon occurs in the programmed memory cells is determined through the reading operation to set the programmed memory cells to be charge loss memory cells. A refill program operation is performed on the charge loss memory cells.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate and a via structure. The via structure is through the substrate. The via structure includes a first conductive portion, a second conductive portion, a first barrier portion, a second barrier portion, and a third barrier portion. The first conductive portion has a ring-shaped cross section. The second conductive portion is disposed at an inner side of the first conductive portion. The second conductive portion has a ring-shaped cross section. The first barrier portion is disposed at an outer side of the first conductive portion. The second barrier portion is disposed between the first conductive portion and the second conductive portion. The third barrier portion is disposed at an inner side of the second conductive portion. At least one of the first barrier portion, the second barrier portion, or the third barrier portion includes an insulating 2D material.

Abstract: The present disclosure provides a 3D memory structure such as 3D Flash memory structure applying for 3D AND flash memory and a method of forming the same. An etching stop layer is formed on a substrate including active elements. A stacked layer is formed on the etching stop layer. The stacked layer includes insulation layers and sacrificed layers stacked alternatively on the etching stop layer. A patterning process is performed on the stacked layer to form a first stacked structure above the active elements, a second stacked structure surrounding the first stacked structure, and a trench pattern separating the first stacked structure and the second stacked structure and exposing the etching stop layer. The trench pattern includes asymmetric inner sidewalls and outer sidewalls. The inner sidewalls define sidewalls of the first stacked structure. The outer sidewalls define sidewalls of the second stacked structure that face the first stacked structure.

Abstract: A semiconductor device includes a circuit board, a bottom plate, landing pads, a stack, support pillars, and memory pillars. The circuit board includes circuit structures and wires and has a peripheral area, an array area and a staircase area disposed between the peripheral area and the array area. The bottom plate is disposed on the circuit board, and the bottom plate includes a bottom conductive layer. The landing pads are embedded in at least a top portion of the bottom conductive layer and contact the bottom conductive layer in the staircase area. The stack is disposed on the bottom plate, and includes conductive layers and insulating layers alternately stacked along a first direction. The support pillars pass through the stack along the first direction and extend to the landing pads in the staircase area. The memory pillars pass through the stack along the first direction in the array area.

Abstract: A memory device includes a memory array and at least one first vertical transistor over a dielectric substrate. The at least one first vertical transistor is disposed above the dielectric substrate in a staircase region, and includes: a first wraparound gate layer, a channel pillar, a gate dielectric layer, a first source and drain region, and a second source and drain region. The first wraparound gate layer is laterally adjacent to a gate stack structure of the memory array. The channel pillar extends through the first wraparound gate layer. The gate dielectric layer is disposed between the channel pillar and the first wraparound gate layer. The first source and drain region is disposed below and electrically connected to the bottom of the channel pillar. The second source and drain region is disposed above and electrically connected to the top of the channel pillar.

Abstract: Disclosed are a multi-circuit control system and a reading method for status information thereof. The multi-circuit control system includes a first circuit and N second circuits. The second circuit is, for example a three dimensional NAND flash memory circuit, and the multi-circuit control system provides a storage media with high-performance and high-capacity. The first circuit provides a read clock signal. The second circuits are coupled in series, and coupled to the first circuit. Each of the second circuits has at least one first data shifter. The at least one data shifter is used to load status information of each of the second circuits, and shift out each of the status information to a second circuit of a previous stage or the first circuit or the first chip obtains the status information of each of the second circuits through a parallel transmission scheme.

Abstract: A universal memory device includes an array of universal memory cells. Each universal memory cell includes a write transistor and a read transistor. The write transistor has a gate terminal configured to receive a gate voltage to turn on or off the write transistor, a first terminal configured to receive a write voltage, and a second terminal coupled to a gate terminal of the read transistor. The read transistor includes a charge trap layer at the gate terminal of the read transistor. The charge trap layer is configured to: be unalterable when the first write voltage is applied at the first terminal of the write transistor, and be alterable when the second write voltage is applied at the first terminal of the write transistor to change a threshold voltage of the read transistor. The second write voltage is greater than the first write voltage.

Abstract: A manufacturing method of a memory device may be applied to a three-dimensional NAND memory device with high capacity and high performance. In a manufacturing process of the three-dimensional NAND memory device, a material of a control gate (word line) is tungsten. The forming method of a tungsten layer includes nucleation and bulk formation performed. In at least one of the nucleation and the bulk formation, hydrogen flow is between 1000 and 20000 sccm. At least one time of soak with nitrogen may also be performed after the nucleation. A tungsten grain size in the tungsten layer is 70 nm or more.

Abstract: A non-volatile 3D memory search architecture provides for receiving searches for application to select lines and word lines of a non-volatile 3D memory array. The architecture uses two word lines per unit of information of the searches and two memory devices per unit of stored feature to search against. The architecture uses respective bit lines of the non-volatile 3D memory array as respective matching lines for searching. Respective memory strings (e.g., NAND memory strings) of the non-volatile 3D memory array are usable to store respective data values, e.g., corresponding to elements to search for. Respective pluralities of the memory strings are coupled in parallel to respective shared bit lines. The architecture has applicability to comparing and sorting, in addition to searching in application areas such as artificial intelligence (AI) and big data.

Abstract: A semiconductor bonded structure including a first semiconductor chip, at least one second semiconductor chip, a stress adjusting structure, and a circuit layer is provided. The at least one second semiconductor chip is disposed on the first semiconductor chip and electrically connected to the first semiconductor chip. The stress adjusting structure is disposed in at least one of the first semiconductor chip and the at least one second semiconductor chip. The circuit layer is disposed on the at least one second semiconductor chip and the circuit layer is electrically connected to the at least one second semiconductor chip. A fabricating method of the semiconductor bonded structure is also provided. The semiconductor bonded structure may be applied to the fabrication of 3D NAND flash memory with high performance and high capacity.

Abstract: A circuit is provided. The circuit can include sensing circuits configured to sense differences between first and second currents on selected bit lines of an array of memory cells and produce outputs for the bit lines as a function of the difference, and a global programmable non-regular counter configured to continuously provide a count value to each of the sensing circuits in dependence on a clock signal, wherein each sensing circuit, of the sensing circuits, includes (i) a local detector circuit configured to detect a voltage (Vc) generated according to the difference and (ii) a reference voltage selector configured to receive reference voltages from a source and to select a single reference voltage (Vref), and wherein each sensing circuit produces an output according to (i) a difference between Vc and Vref and (ii) a stored count value received from the counter.

Abstract: A circuit comprises a plurality of bit lines, a global counter configured to provide a count value, a global reference source, a plurality of capacitors, a comparator, a storage element, and capacitor selector circuitry.