Patents Assigned to Materious, LLC
  • Method of releasably attaching a semiconductor substrate to a carrier
    Patent number: 9644118
    Abstract: Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: May 9, 2017
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Mark S. Oliver, Zhifeng Bai, Michael K. Gallagher
  • LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
    Publication number: 20170101389
    Abstract: The present disclosure relates to a leveling composition for electrodepositing metals.
    Type: Application
    Filed: December 22, 2016
    Publication date: April 13, 2017
    Applicant: Shinhao Materials LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong
  • Imaging on substrates with alkaline strippable UV blocking compositions and aqueous soluble UV transparent films
    Patent number: 9622353
    Abstract: Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline strippable UV blocking composition is selectively applied to the surface of the UV transparent film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: April 11, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Krishna Balantrapu, Brian D. Amos, Stephen McCammon
  • Hot melt compositions with improved etch resistance
    Patent number: 9611402
    Abstract: Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronics Materials LLC
    Inventors: Krishna Balantrapu, Robert K. Barr
  • Formaldehyde free electroless copper plating compositions and methods
    Patent number: 9611550
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: February 17, 2013
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • Electroplating bath analysis
    Patent number: 9612217
    Abstract: Electrochemical impedance spectroscopy is used to determine the amount of organic additive in a metal electroplating bath.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronics Materials LLC
    Inventor: Matthew A. Thorseth
  • Stable catalysts for electroless metallization
    Patent number: 9611549
    Abstract: Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: April 4, 2017
    Assignee: Rphm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Rzeznik
  • Sulfonamide based polymers for copper electroplating
    Patent number: 9611560
    Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Ammonia borane purification method
    Patent number: 9604850
    Abstract: A method of purifying ammonia borane is provided in which crude ammonia borane is dissolved in an organic solvent, such as an ether, and mixed with a basic aqueous solution to form a two-phase system. The pH of the aqueous solution and the temperature are adjusted to increase the solubility of the impurities and decrease the solubility of the ammonia borane in the basic aqueous solution, without causing decomposition of the ammonia borane. The impurities are separated from the crude ammonia borane solution, the mixture is phase-separated and the dissolved ammonia borane is isolated from the organic solvent fraction. High purity ammonia borane is obtained.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: March 28, 2017
    Assignee: WeylChem Sustainable Materials, LLC
    Inventor: Kevin Joel Drost
  • Hot melt compositions with improved etch resistance
    Patent number: 9598590
    Abstract: Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: March 21, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Krishna Balantrapu, Robert K. Barr
  • Method of filling through-holes
    Patent number: 9598787
    Abstract: The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 21, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Nagarajan Jayaraju, Elie H. Najjar, Leon R. Barstad
  • Amino sulfonic acid based polymers for copper electroplating
    Patent number: 9598786
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: March 21, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I. Niazimbetova, Maria Anna Rzeznik
  • Stable catalysts for electroless metallization
    Patent number: 9597676
    Abstract: Aqueous catalysts of nanoparticles of precious metals and stabilizers of flavonoid derivatives are used to electrolessly plate metal on non-conductive substrates. Such substrates include printed circuit boards.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: March 21, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Aromatic resins for underlayers
    Patent number: 9601325
    Abstract: Aromatic resin polymers and compositions containing them are useful as underlayers in semiconductor manufacturing processes.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: March 21, 2017
    Assignees: Rohm and Haas Electronic Materials LLC, Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Emad Aqad, Mingqi Li, Shintaro Yamada, Sung Wook Cho
  • Manufacturing and applications of metal powders and alloys
    Patent number: 9586262
    Abstract: The present invention is directed to a method of manufacture of metal or alloy powders that uses liquid phase reduction of a metal halide, or a mixture of metal halides, to produce a metal particle coated in salts produced as a reaction byproduct. The reaction conditions can be chosen to select a range of metal particle sizes, and the salt coating prevents oxidation (or reaction with other atmospheric gases) and permits a range of applications hitherto difficult to achieve using metal powders.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: March 7, 2017
    Assignee: Boston Electronic Materials LLC
    Inventor: Andrew Matheson
  • Photoresist pattern trimming methods
    Patent number: 9583344
    Abstract: Provided are methods of trimming photoresist patterns. The methods involve coating a photoresist trimming composition over a photoresist pattern, wherein the trimming composition includes a matrix polymer, a thermal acid generator and a solvent, the trimming composition being free of cross-linking agents. The coated semiconductor substrate is heated to generate an acid in the trimming composition from the thermal acid generator, thereby causing a change in polarity of the matrix polymer in a surface region of the photoresist pattern. The photoresist pattern is contacted with a developing solution to remove the surface region of the photoresist pattern. The methods find particular applicability in the formation of very fine lithographic features in the manufacture of semiconductor devices.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: February 28, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Cheng-Bai Xu
  • Photoresist overcoat compositions
    Patent number: 9581904
    Abstract: Photoresist overcoat compositions are provided. The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition. The compositions have particular applicability in the semiconductor manufacturing industry for use in negative tone development processes.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: February 28, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Choong-Bong Lee, Stefan J. Caporale, Jason A. DeSisto, Jong Keun Park, Cong Liu, Cheng-Bai Xu, Cecily Andes
  • Method and system for laser sintering with pretreated material
    Patent number: 9580551
    Abstract: For laser sintering, a material includes at least one powder that has been treated by heat to modify at least one of: a melting temperature of the at least one powder; and a recrystallization temperature of the at least one powder and results in the narrowing of the melting curve of the treated material relative to the untreated material. The heating can include a series of heating steps. The treatment improves the efficacies of the SLS process and product quality.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: February 28, 2017
    Assignee: Advanced Laser Materials, LLC
    Inventors: Donald Lewis Vanelli, Richard Benton Booth, Bruce Thornton
  • ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS
    Publication number: 20170044671
    Abstract: Pyrimidine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.
    Type: Application
    Filed: September 4, 2014
    Publication date: February 16, 2017
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Kristen Milum, Maria Rzeznik, Donald Cleary, Julia Kozhukh, Zukhra Niazimbetova
  • ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRAZINE DERIVATIVE CONTAINING CATALYSTS
    Publication number: 20170042039
    Abstract: Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.
    Type: Application
    Filed: September 4, 2014
    Publication date: February 9, 2017
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Rzeznik