Abstract: Provided are gap-fill methods.

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract: A method for manufacturing a high performance thermoplastic matrix composite ballistic helmet includes forming/shaping a highly consolidated helmet preform free of wrinkles and with no cuts or seams from a flat stack of 0/90 uni-directional prepreg layers using a pressure forming process. The wrinkle free and no cuts pre-formed helmet shell is pre-heated and placed between match-metal dies in a compression molding press to be molded under constant pressure during heating at high temperature and cooling down below 200° F. in less than 45 minutes. Or molded under constant pressure at high temperature for less than 20 minutes and then the molded helmet is removed from the compression molding press and placed in a hydroforming machine to be cooled down in less than two minutes under a very high pressure while the thermoplastic matrix solidify during cooling down.

Abstract: Acid generators comprising a carbocyclic aryl or heteroaromatic group substituted with at least one acetate moiety are provided. These acid generators are particularly useful as a photoresist composition component.

Abstract: This invention provides a composition containing an organometallic compound having a chromophore moiety in the metal polymer backbone which allows a wider range of n/k values such that substrate reflectivity can be controlled under various conditions.

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract: Method of manufacturing patterned transparent conductor is provided, comprising: providing a silver ink core component containing silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component to form a core shell fiber, wherein the silver nanoparticles are in the core; depositing the core shell fiber on the substrate; selectively treating a portion of the deposited core shell fiber to provide a patterned transparent conductor, wherein the patterned transparent conductor has a treated region and a non-treated region; wherein the treated region comprises a plurality of electrically interconnected silver miniwires and wherein the treated region is an electrically conductive region; and, wherein the non-treated region is an electrically insulative region.

Abstract: A treatment method includes the steps of: Providing an initial supply of an ammonium octamolybdate precursor powder having a bi-modal particle size distribution; applying a quantity of solvent to the initial supply of ammonium octamolybdate precursor powder to form a moistened intermediate powder; and allowing the moistened intermediate powder to adsorb the applied solvent over a time period, the quantity of solvent applied and the time period being sufficient to form a treated ammonium octamolybdate powder composition having a substantially uni-modal particle size distribution.

Abstract: Topcoat layer compositions are provided that are applied above a photoresist composition. The compositions find particular applicability to immersion lithography processing.

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Abstract: The invention provides methods of preparing bacteria of interest with a stably integrated nucleic acid sequence of interest.

Abstract: Acid generator compounds are provided that comprise an oxo-1,3-dioxolane moiety and/or an oxo-1,3-dioxane moiety. The acid generators are particularly useful as a photoresist composition component.

Abstract: New methods are provided for synthesis of photoacid generator compounds (“PAGs”), new photoacid generator compounds and photoresist compositions that comprise such PAG compounds. In a particular aspect, sulfonium-containing (S+) photoacid generators and methods of synthesis of sulfonium photoacid generators are provided.

Abstract: New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials having a water contact angle that can be changed by treatment with base and/or one or more materials that comprise fluorinated photoacid-labile groups and/or one or more materials that comprise acidic groups spaced from a polymer backbone. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.

Abstract: Coating compositions for use with an overcoated photoresist are provided where the coating composition comprises a resin containing cyanurate groups and hydrophobic groups. The coating composition can enhance resolution of an overcoated photoresist relief image.

Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Abstract: A portable protection system including a selectively collapsible truss for supporting a protection member. The truss is movable between a collapsed position and an expanded position. The protection member includes at least one layer of ballistic armor material for disrupting a projectile. The truss includes suitable connectors for releasably connecting the protection member to the truss, and also suitable connectors for releasably connecting the truss to an adjoining truss so as to form a protection wall.

Abstract: A self-contained, hand-held spray dispensing device includes an internal source of pressurized fluid that exerts a motive force on a pair of liquid ejecting elements to cause each to eject a liquid into a discharge line. The liquids remain separated until each exits its discharge port. A pressurized fluid is directed over the outlet ends of the discharge line beginning before a flow interrupter in the discharge line is opened to permit flow therethrough and ceasing after liquid flow is terminated. The pressurized fluid flow over the outlet of the discharge line aerosolizes liquids emanating from the outlet ends. Each liquid ejecting element takes the form of a piston disposed within a cylinder. The pistons responds to pressurized fluid imposed directly thereon from the source to generate the motive force on the ejecting element.

Abstract: Provided are photoresist overcoat compositions, substrates coated with the overcoat compositions and methods of forming electronic devices by a negative tone development process. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.