Abstract: A system, method and computer program product are provided for conditionally eliminating a memory read request. In use, a memory read request is identified. Additionally, it is determined whether the memory read request is an unnecessary memory read request. Further, the memory read request is conditionally eliminated, based on the determination.

Abstract: Aspects of the invention relate to scan-based test architecture for interconnects in stacked designs. The disclosed scan-based test architecture comprises a scan chain. Scan cells on the scan chain are configured to receive data from, based on bits of a control signal, outputs of neighboring scan cells or outputs of mixing devices that combine data from through-silicon vias with data from the outputs of the neighboring scan cells. The scan-based test architecture can be used to identify single or multiple defective through-silicon vias.

Abstract: Aspects of the invention relate to a test-per-clock scheme based on dynamically-partitioned reconfigurable scan chains. Every clock cycle, scan chains configured by a control signal to operate in a shifting-launching mode shift in test stimuli one bit and immediately applies the newly formed test pattern to the circuit-under-test; and scan chains configured by the control signal to operate in a capturing-compacting-shifting mode shift out one bit of previously compacted test response data while compacting remaining bits of the previously compacted test response data with a currently-captured test response to form currently compacted test response data. A large number of scan chains may be configured by the control signal to work in a mission mode. After a predetermined number of clock cycles, a different control signal may be applied to reconfigure and partition the scan chains for applying different test stimuli.

Abstract: Technologies for debugging hardware errors discovered during hardware assisted software verification processes are provided. For example, in one embodiment, a concurrent emulation debug environment including a concurrent emulation system, an emulation trace module and a model state module is provided. The concurrent emulation system includes an emulator and an emulation control station configured to allow simultaneous emulation of multiple electronic designs. The model state module is configured to record the state of the electronic designs during emulation and the emulation trace module is configured to capture trace data associated with the emulation. A backup and capture module is also disclosed that is configured to store the recorded state and the captured trace data for use during a hardware debug process.

Abstract: Various aspects of the disclosed techniques relate to techniques for identifying high-impedance nodes in a circuit design. Noise sources are added to nodes of interest in the circuit design. Voltage values at the nodes of interest are then computed in parallel. Based on the voltage values, high impedance nodes in the nodes of interest are identified.

Abstract: This application discloses a computing system implementing tools and mechanisms that can incorporate a validation system into a circuit design. The validation system can be configured to monitor at least a portion of an electronic device described in the circuit design. The tools and mechanisms can identify one or more trace signals associated with the electronic device to route to the validation system, and identify one or more trigger signals associated with the electronic device to route to the validation system. The tools and mechanisms can configure the validation system to detect a conditional event corresponding a state of the one or more trigger signals, and to transmit the trace signals associated with the electronic device for debugging in response to the detected conditional event.

Abstract: A method of performing a resolution enhancement technique such as OPC on an initial layout description involves fragmenting a polygon that represents a feature to be created into a number of edge fragments. One or more of the edge fragments is assigned an initial simulation site at which the image intensity is calculated. Upon calculation of the image intensity, the position and/or number of initial simulation sites is varied. New calculations are made of the image intensity with the revised placement or number of simulation sites in order to calculate an OPC correction for the edge fragment. In other embodiments, fragmentation of a polygon is adjusted based on the image intensities calculated at the simulation sites. In one embodiment, the image intensity gradient vector calculated at the initial simulation sites is used to adjust the simulation sites and/or fragmentation of the polygon.

Abstract: Disclosed herein are representative embodiments of methods, systems, and apparatus that can used to control real-time events (e.g., the real-time clock) during the design, simulation, or verification of an embedded system. In one exemplary embodiment disclosed herein, for example, a real-time clock signal is generated and tasks defined by an embedded software application are triggered with the real-time clock signal. In this embodiment, the embedded software application is executed by an embedded processor with a real-time operating system (“RTOS”), and the real-time clock signal is controllable independent of a processor clock signal driving the embedded processor in a manner that allows the real-time clock to have a different time base than the processor clock.

Abstract: Aspects of the invention relate to test access architecture for stacked memory and logic dies. A test access interface for a logic die that is stacked under a memory die is disclosed. The disclosed test access interface can control testing logic core, interconnections with the memory die and with another logic die. The controlling of testing interconnections with the memory die is through a memory boundary scan register controller in the test access interface.

Abstract: The amount of analysis performed in determining the validity of a property of a digital circuit is measured concurrent with performance of the analysis, and provided as an output when a true/false answer cannot be provided e.g. when stopped due to resource constraints. In some embodiments, a measure of value N indicates that a given property that is being checked will not be violated within a distance N from an initial state from which the analysis started. Therefore, in such embodiments, a measure of value N indicates that the analysis has implicitly or explicitly covered every possible excursion of length N from the initial state, and formally proved that no counter-example is possible within this length N.

Abstract: Aspects of the disclosed techniques relate to techniques of layout decomposition for multiple patterning lithography. Data of a coloring graph are derived from layout data for a layout design. The coloring graph is simplified by repeatedly applying a plurality of graph simplification units. Each of the graph simplification units is configured to use a unique approach to simplify a graph. Based on the simplified coloring graph, the layout design is decomposed to generate decomposition information. The decomposition process may comprise applying a heuristic method for coloring if needed. The decomposition information may comprise information of one or more layout regions that cannot be decomposed.

Abstract: This application discloses a computing system to identify an interconnection between portions of a circuit design corresponding to different power domains. The computing system can select a subset of power state tables in the circuit design based, at least in part, on power supplies associated with the interconnection, and generate a composite power state table from the selected subset of power state tables. The computing system can analyze the interconnection to identify electrical characteristics based, at least in part, on power states in the composite power state table, and determine whether a power intent specification in the circuit design can prompt synthesis of interface circuitry capable of implementing the electrical characteristics for the interconnection.

Abstract: This application discloses a computing system to provide test stimulus to an electronic device modeled in a verification environment by the computing system. The computing system can identify transactions performed by the electronic device in the verification environment based, at least in part, on messages exchanged over an interconnect in the electronic device in response to the test stimulus. The computing system can output the transactions from the verification environment and bundle a plurality of the transactions based, at least in part, on messaging relationships defined by a communication protocol for the interconnect. The computing system can utilize the bundles of transactions to determine whether the electronic device functions in accordance with the communication protocol.

Abstract: Aspects of the disclosed techniques relate to techniques for resist simulation in lithography. Local minimal light intensity values are determined for a plurality of sample points in boundary regions of an aerial image of a feature to be printed on a resist coating, wherein each of the local minimal light intensity values represents a minimum light intensity value for an area surrounding one of the plurality of sample points. Based on the local minimal light intensity values, horizontal development bias values for the plurality of sample points are then determined. Finally, resist contour data of the feature are determined based at least on the horizontal development bias values.

Abstract: This application discloses a system to detect meta-stable glitches in a signal, such as an output of latch or other storage element. The system can include a sampling circuit configured to sample an output of a storage element. The system can include a mono-shot circuit configured to monitor the output of the storage element and generate a pulse when the monitored output of the storage element differs from the sampled output. The system can include a drive circuit configured to generate a glitch signal based, at least in part, on the sampled output, and to output the glitch signal in response to the pulse from the mono-shot circuit. The system can include an error detection circuit configured to receive the sampled output from the sampling circuit and the glitch signal from the drive circuit, and to generate an error signal when the sampled output differs from the glitch signal.

Abstract: A method for applying test patterns to scan chains in a circuit-under-test. The method includes providing a compressed test pattern of bits; decompressing the compressed test pattern into a decompressed test pattern of bits as the compressed test pattern is being provided; and applying the decompressed test pattern to scan chains of the circuit-under-test. The actions of providing the compressed test pattern, decompressing the compressed test pattern, and applying the decompressed pattern are performed synchronously at the same or different clock rates, depending on the way in which the decompressed bits are to be generated. A circuit that performs the decompression includes a decompressor such as a linear finite state machine adapted to receive a compressed test pattern of bits. The decompressor decompresses the test pattern into a decompressed test pattern of bits as the compressed test pattern is being received.

Abstract: Techniques are disclosed for optimizing the pattern density in the circuit layout design of a circuit layer. A layer in circuit design is analyzed to define empty regions that can be filled with fill polygons (referred to hereafter as “fill” regions). Next, a pattern of fill polygons is generated. After the fill polygons have been defined, the layout design for the layer is divided into separate areas or “windows,” and a target density for each window is determined. Once this target density for the window has been determined, the fill polygons required to most closely approach this target density are generated and added to the circuit layout design. This process may be repeated with progressively different (e.g., smaller) fill polygons, until each window meets or exceeds both the specified minimum density and complies with the specified maximum density gradient.

Abstract: Various aspects of the disclosed technology relate to techniques of creating test templates for test pattern generation. Residual test cubes for a plurality of faults are first generated based on a signal probability analysis of a circuit design. Test templates are then generated based on merging the residual test cubes. Finally, a plurality of test patterns and/or compressed test cubes are generated based on one of the test templates.

Abstract: Techniques are disclosed for optimizing the pattern density in the circuit layout design of a circuit layer. A layer in circuit design is analyzed to define empty regions that can be filled with fill polygons (referred to hereafter as “fill” regions). Next, a pattern of fill polygons is generated. After the fill polygons have been defined, the layout design for the layer is divided into separate areas or “windows,” and a target density for each window is determined. Once this target density for the window has been determined, the fill polygons required to most closely approach this target density are generated and added to the circuit layout design. This process may be repeated with progressively different (e.g., smaller) fill polygons, until each window meets or exceeds both the specified minimum density and complies with the specified maximum density gradient.

Abstract: Aspects of the disclosed technology relate to techniques of combining directed self-assembly lithography and multiple patterning lithography. A coloring/grouping graph is first generated from layout data of a layout design. In the coloring/grouping graph, each coloring edge connects two nodes representing layout features that must be assigned to different masks, and each grouping/coloring edge connects two nodes representing layout features that should either be grouped together for DSA (directed-self-assembly) lithography or be assigned to different masks for multiple patterning lithography. The node groups formed by nodes connected with the coloring edges are colored. Colors of the nodes in one or more of node groups connected by the grouping/coloring edges are adjusted to convert one or more of the grouping/coloring edges into the coloring edges.