Abstract: A system-on-chip may include an inductor-capacitor oscillator monolithically integrated into the system-on-chip The inductor-capacitor oscillator may be configured to improve frequency stability and reduce noise when compared to a resistor-capacitor oscillator. Methods of making integrated oscillators may involve forming an inductor at least partially while forming a BEOL structure on a substrate. A capacitor supported on and/or embedded within the semiconductor material of the substrate may be formed before or while forming the BEOL structure. The inductor may be connected to the capacitor in parallel at least partially utilizing the BEOL structure to form an integrated inductor-capacitor oscillator.

Abstract: Ferroelectric random access memory (FRAM) capacitors and methods of forming FRAM capacitors are provided. An FRAM capacitor may be formed between adjacent metal interconnect layers or between a silicided active layer (e.g., including MOSFET devices) and a first metal interconnect layer. The FRAM capacitor may be formed by a damascene process including forming a tub opening in a dielectric region, forming a cup-shaped bottom electrode, forming a cup-shaped ferroelectric element in an interior opening defined by the cup-shaped bottom electrode, and forming a top electrode in an interior opening defined by the cup-shaped ferroelectric element. The FRAM capacitor may form a component of an FRAM memory cell. For example, an FRAM memory cell may include one FRAM capacitor and one transistor (1T1C configuration) or two FRAM capacitors and two transistor (2T2C configuration).

Abstract: An article of manufacture includes a non-transitory machine-readable medium. The medium includes instructions. The instructions, when read and executed by a processor, cause the processor to identify a first input instruction in a code stream to be executed, determine that the first input instruction includes an atomic operation designation, and selectively block interrupts for a duration of execution of the first input instruction and a second input instruction. The second input instruction is to immediately follow the first input instruction in the code stream.

Abstract: Examples disclosed herein include a speaker. The speaker may include a group of microphones and a processor. The processor may determine a first speaker-channel identifier for a multi-speaker system at least partially responsive to a first tone captured at the group of microphones. The processor may also determine a position of a source of the captured first tone relative to the speaker at least partially responsive to position information derived from the captured first tone. The processor may also determine a second speaker-channel identifier at least partially responsive to the first speaker-channel identifier and the position of the source of the captured first tone. The processor may also determine speaker settings at least partially responsive to the second speaker-channel identifier. Related devices, systems and methods are also disclosed.

Abstract: Foreign object detection for wireless power transmitters and related apparatuses and methods are disclosed. An apparatus includes an analog-to-digital converter to sample at least one of a coil voltage potential and a coil current representation of a transmit coil inductively coupled to a receive coil of a wireless power receiver with a distance between the transmit coil and the receive coil. The apparatus also includes a processing core to determine an expected reference Q-factor value responsive to the at least one of the sampled coil voltage potential and the sampled coil current representation. The expected reference Q-factor value indicates a Q-factor value expected at a predetermined reference wireless power transmitter inductively coupled to the wireless power receiver with a reference distance from a reference transmit coil of the predetermined reference wireless power transmitter to the receive coil of the wireless power receiver.

Abstract: A system-level design generator tool enables users to configure system-level designs made up of electrical components that satisfy design parameters and have corresponding dependencies, e.g., power, communication, control, security, clock and memory. A block diagram representing each of the functions within the system may utilize a guided parametric search or a design tool to create the solution for each individual block. The inputs into that search and/or design tool may come from the system-level choices, constraints, and cross dependencies tracked by the system generator tool.

Abstract: An apparatus includes a test circuit to receive signals from a piezoelectric horn and a control circuit to determine whether to operate the apparatus in a silent test mode or a normal mode. The apparatus includes a control circuit to, based on a determination to operate in the normal mode, enable a driver circuit to drive the piezoelectric horn so as to output sound when activated by the driver circuit. The test circuit is to, based on a determination to operate in the silent test mode, cause the piezoelectric horn to generate a piezoelectric response, wherein the piezoelectric horn is silent while generating the piezoelectric response during the silent test mode, and cause evaluation of whether or not the piezoelectric horn is working correctly based upon the received signals from the piezoelectric horn.

Abstract: A disclosed method includes: setting a connector of an acquisition circuit and an associated capacitor to a predetermined potential; providing an energy pulse of a predetermined first time duration to the connector; at a time occurring substantially at a predetermined second time duration after an end of the predetermined first time duration of the energy pulse, coupling the associated capacitor and the connector of the acquisition circuit; and sampling a voltage being exhibited across the associated capacitor.

Abstract: Described is an architecture for a physical layer device useable with single pair Ethernet in a multidrop bus topology that may operate in a sleep mode and control other devices in network segment to operate in a sleep mode. Some embodiments of the physical layer device may support partial networking in a multidrop network, and mixed networks including the same.

Abstract: An apparatus includes an adjustment circuit configured to receive a pulsed-width modulation (PWM) input, generate an adjusted PWM signal based upon the PWM input, and determine that a first pulse of the PWM input is shorter than a runt signal limit. The adjustment circuit is further configured to, in the adjusted PWM signal, extend the first pulse of the PWM input based on the determination that the PWM input is shorter than the runt signal limit, and output the adjusted PWM signal to an electronic device.

Abstract: An apparatus includes an apparatus input to receive a voltage input, an apparatus output to drive an output metal oxide semiconductor field effect transistor (MOSFET) at least partially based upon the voltage input, a current source circuit to provide a current source to the apparatus output when the voltage input rises above a first threshold and before the voltage input rises above a second threshold, a voltage clamp circuit to provide a clamped output voltage to the apparatus output when the voltage input rises above the second threshold, and a current sink circuit to provide a current sink to the apparatus output when the voltage input falls below the second threshold and before the voltage input reaches the first threshold.

Abstract: A system having a theft event sensor; a primary alarm actuator; a display alarm actuator; and a vehicle security device to: receive a theft event signal from the theft event sensor, transmit a primary alarm signal to the primary alarm actuator, and transmit a display alarm signal to the display alarm actuator.

Abstract: A low dropout (LDO) regulator circuit is provided. The LDO regulator circuit may include a pre-regulator circuit to receive a high voltage input voltage and provide a low voltage supply voltage, and an LDO regulator to receive the low voltage supply voltage and provide a low voltage output voltage. The pre-regulator circuit may include an input stage, an output stage coupled to the input stage, and a first MOSFET coupled to the output stage to provide the low voltage supply voltage. The input stage and first MOSFET may receive the high voltage input voltage. The LDO regulator may include a second MOSFET coupled to the first MOSFET, and may receive the low voltage supply voltage and provide the low voltage output voltage.

Abstract: A system for managing a virtual meeting (e.g., video conference) includes memory storing a video conference application and at least one processor to execute the video conference application to generate a virtual meeting view for a first attendee including multiple attendee video streams arranged according to a virtual attendee arrangement specifying positions of the attendee video streams relative to each other in the virtual meeting view, receive second attendee audio data associated with a second attendee video stream, identify a particular video stream position specified by the virtual attendee arrangement, determine differential stereo effect data corresponding with the particular video stream position, and apply the differential stereo effect data to the second attendee audio data to provide differential audio signals on different audio channels output to the first attendee to create a stereo sound effect corresponding with the particular video stream position.

Abstract: Methods, systems and devices of the present disclosure involve techniques for cancelling base resistance error otherwise present in remote temperature sensors such as remote diode temperature sensors. In one or more embodiments, measurement logic configured to determine a temperature of or near a remote temperature sensor may be configured to determine an error cancelling coefficient and to calculate a temperature value, at least in part, responsive to the error cancelling coefficient. In some cases, error cancelling coefficients may be determined using one or more calibration techniques.

Abstract: A metal-insulator-metal (MIM) capacitor module is provided. The MIM capacitor module includes a bottom electrode base formed in a lower metal layer, a bottom electrode conductively coupled to the bottom electrode base, a planar insulator formed over the bottom electrode, and a top electrode formed in an upper metal layer over the insulator. The bottom electrode includes a cup-shaped bottom electrode component and a bottom electrode fill component formed in an interior opening defined by the cup-shaped bottom electrode component.

Abstract: Lead frames for semiconductor device packages may include lead fingers proximate to a die-attach pad. A convex corner of the lead frame proximate to a geometric center of the lead frame may be rounded to include a radius of curvature of at least two times a greatest thickness of the die-attach pad. The thickness of the die-attach pad may be measured in a direction perpendicular to a major surface of the die-attach pad. A shortest distance between the die-attach pad and each one of the lead fingers having a surface area larger than an average surface area of the lead fingers may be at least two times the greatest thickness of the die-attach pad.

Abstract: A method of forming a metal-insulator-metal (MIM) capacitor with copper top and bottom plates may begin with a copper interconnect layer (e.g., Cu MTOP) including a copper structure defining the capacitor bottom plate. A passivation region is formed over the bottom plate, and a wide top plate opening is etched in the passivation region, to expose the bottom plate. A dielectric layer is deposited into the top plate opening and onto the exposed bottom plate. Narrow via opening(s) are then etched in the passivation region. The wide top plate opening and narrow via opening(s) are concurrently filled with copper to define a copper top plate and copper via(s) in contact with the bottom plate. A first aluminum bond pad is formed on the copper top plate, and a second aluminum bond pad is formed in contact with the copper via(s) to provide a conductive coupling to the bottom plate.

Abstract: A gate-drive controller for a power semiconductor device includes a master control unit (MCU) and one or more comparators that compare the output signal of the power semiconductor device to a reference value generated by the MCU. The MCU, in response to a turn-off trigger signal, generates a first intermediate drive signal for the power semiconductor device and generates a second intermediate drive signal, different from the first drive signal, when a DSAT signal indicates that the power semiconductor device is experiencing de-saturation. The MCU generates a final drive signal for the power semiconductor when the output signal of the one or more comparators indicates that the output signal of the power semiconductor device has changed relative to the reference value. The controller may also include a timer that causes the drive signals to change in predetermined intervals when the one or more comparators do not indicate a change.

Abstract: Vapor cells may include a body including a cavity within the body. A first substrate bonded to a second substrate at an interface within the body, at least one of the first substrate, the second substrate, or an interfacial material between the first and second substrates may define at least one recess or pore in a surface. A smallest dimension of the at least one recess or pore may be about 500 microns or less, as measured in a direction parallel to at least one surface of the first substrate partially defining the cavity.