Abstract: A start up circuit constituted of: a first alternating current lead; a second alternating current lead, said second alternating current lead exhibiting an opposing phase of said first alternating current lead; a first capacitor, a first end of said first capacitor coupled to said first alternating current lead; a second capacitor, a first end of said second capacitor coupled to said second alternating current lead; a breakdown diode coupled between a second end of said first capacitor and a second end of said second capacitor; and a third capacitor coupled in parallel with said breakdown diode. A direct current power is developed across the breakdown diode without requiring dissipative elements.

Abstract: A millimeter wave energy sensing wand includes a housing adapted to be grasped by a hand of an operator. A number of sensors may be coupled with the housing and include comprising at least one millimeter or terahertz wave energy sensor. A controller coupled with the housing and electrically coupled with the sensors receives signals from the sensors in two or more sensing modes, including an active sending mode and a passive sensing mode, and generates feedback when an anomaly is detected in the received signals. The sensors may also operate in a metal detection sensing mode, and the controller may further generate feedback based on the metal detection sensing mode. The sensors may further be configured to operate in a proximity sensing mode. One or more LEDs may illuminate a portion of a scanning area.

Abstract: A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. The heatsink and the lead frame preferably comprise the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square.

Abstract: An apparatus and method for igniting a lamp during a strike mode of an inverter comprising: sequentially controlling a duty cycle sweep and a frequency sweep of driving signals in the inverter to provide an increasing output voltage to the lamp. One embodiment advantageously includes a closed feedback loop to implement the duty cycle sweep and the frequency sweep such that an open lamp voltage is reliably regulated during the strike mode. For example, the closed feedback loop stops the duty cycle sweep or the frequency sweep when the output voltage to the lamp reaches a predetermined threshold and makes adjustments to the duty cycle or frequency the driving signals as needed to keep the output voltage at approximately the predetermined threshold if the lamp has not ignited.

Abstract: A system and method for overlaying computer-generated highlights in a display of millimeter wave imagery is disclosed. In a particular embodiment, visible spectrum and algorithmically created images are displayed adjacent to corresponding millimeter wave imagery on a graphical user interface (GUI). The millimeter wave imagery is used to detect a threat such as a concealed object. A computer generated highlight coinciding with a location of the detected concealed object is used to automatically overlay at least one or more of the visible spectrum images, algorithmically created images, and millimeter wave imagery. The computer generated highlight is encoded with information valuable for aiding the user when viewing and assessing the image date.

Abstract: A lighting arrangement constituted of: a power factor correction circuit; a lighting controller operative at an electrical potential consonant with the electric potential of the output of the power factor correction circuit; a switching network, coupled to the output of the power factor correction circuit and to respective outputs of the lighting controller; a transformer, a primary winding of the transformer coupled to the output of the switching network; and at least one luminaire coupled to at least one secondary winding of the transformer and arranged to be driven by the at least one secondary winding, the lighting controller operative to control the switching network via the respective outputs to switchably pass current from the power factor correction circuit through the primary winding, thereby powering the at least one luminaire.

Abstract: Methods, systems, and devices are described for providing a communication system for handling pulse information. Embodiments of the invention provide a pulse shaping unit operable to avoid saturation of the pulse transformer, while being easily incorporated into IC processes. Some embodiments of the pulse shaping unit provide a two-to-three level driver unit for converting a two-level input voltage signal to a three-level driver signal for driving a pulse transformer. Other embodiments of the pulse shaping unit provide components configured to differentially drive a pulse transformer, effectively converting a two-level input voltage signal to a three-level driver signal.

Abstract: A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 60 PSIG or more, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts or more. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures.

Abstract: An amplifier arrangement constituted of: a first input lead; a second input lead; a difference amplifier; a first buffer, the input of the first buffer coupled to the first input lead, the output of the first buffer coupled to a first input of the difference amplifier; a second buffer, the input of the second buffer coupled to the second input lead, the output of the second buffer coupled to a second input of the difference amplifier; and a transconductance amplifier, the non-inverting input and the non-inverted output of the transconductance amplifier coupled to the first input of the difference amplifier, the inverting input and the inverted output of the transconductance amplifier coupled to the second input of the difference amplifier. The input signals are thus buffered and the offset of the buffers are compensated for.

Abstract: A current balancer arrangement constituted of a plurality of current mirror circuits, each of the current mirror circuits comprising a master leg and at least one slave leg is enabled. A constant current source is provided, arranged to provide power for a plurality of LED strings in parallel. Each of the plurality of LED strings is further arranged in series with a master leg of a particular one of the plurality of current mirror circuits, and with the slave leg of each of the balance of the current mirror circuits.

Abstract: A safety mechanism for a solar cell group, the safety mechanism constituted of: a signal receiver arranged to assert a permissive signal indicative of reception by the signal receiver of a predetermined signal; an electronically controlled switch arranged to provide in a closed state an effective short circuit across the output of the solar cell group responsive to the absence of the asserted permissive signal of the signal receiver; and a power harvester in communication with the solar cell group and arranged to provide electric power to the signal receiver when the electronically controlled switch is the closed state.

Abstract: An arrangement wherein a plurality of LED strings are driven with a balanced drive signal, i.e. a drive signal wherein the positive side and negative side are of equal energy over time, is provided. In a preferred embodiment, the drive signal is balanced responsive to a capacitor provided between a switching network and a driving transformer. Balance of current between various LED strings is provided by a balancing transformer.

Abstract: A system and method for dynamically altering the analysis methodology of millimeter wave imagery in response to the range and direction of motion of a subject is disclosed. In a particular embodiment, an imaging zone of a scene is scanned using at least one millimeter wave camera during a current time frame and a CPU is used to dynamically process millimeter wave imagery of the imaging zone in response to detecting a range and direction of motion of the subject during a previous time frame. In addition, values of a grid of discrete cells are calculated representing the millimeter wave energy associated with the current time frame, which are then compared to values from a grid of corresponding discrete cells associated with the previous time frame in determining a current range and direction of the subject.

Abstract: A driving arrangement for light emitting diode (LED) based illumination constituted of: a comparison circuitry arranged to compare an integral of a target current over a target illumination time for at least one LED based luminaire with an integral of an illumination current over an illumination time for the at least one LED based luminaire, the comparison circuitry arranged to output a comparison signal; and a control circuitry in communication with the comparison circuitry and arranged to alternately: allow the flow of electrical current through the at least one LED based luminaire responsive to a first condition of the comparison signal; and prevent the flow of electrical current through the at least one LED based luminaire responsive to a second condition of the comparison signal, the second condition different from the first condition.

Abstract: A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. In one preferred embodiment, the heatsink and the lead frame are comprised of the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square.

Abstract: The present invention comprises a process of mixing a luminous substance in powder form to a transferable grade molding compound in a pelletized or powder form, such as a clear epoxy, to derive a homogeneous mixture that can be pressed and sintered into solid pellets. The solid pellets are further processed so as to permit their deposition on and around a light emitting semiconductor driver so as to obtain a white light emitting semiconductor device. This white light emitting device can be used in a variety of lighting applications.

Abstract: An integrated circuit transimpedance amplifier arrangement constituted of: a plurality of internal matched resistors; a current multiplier arranged to output a signal whose value is a function of an input current signal, an external resistor and a first set of the plurality of internal matched resistors; and an output transimpedance amplifier coupled to the output of the current multiplier, the output transimpedance amplifier exhibiting a gain whose value is a function of a second set of the plurality of internal matched resistors, wherein the output of the output transimpedance amplifier is a function of the input current signal, the external resistor, the first set of the plurality of internal matched resistors and the second set of the plurality of internal matched resistors, wherein the variations with temperature of the first set of the plurality of internal matched resistors and the second set of the plurality of internal matched resistors cancel.

Abstract: Methods, systems, and devices are described for providing output (e.g., current) sensing and feedback in high-voltage switching power converter topologies. Certain aspects of high voltage switching converter topologies may make output (e.g., current) sensing difficult. In some embodiments, a sampling module implements sample-and-hold techniques in a low-side switch converter topology to provide reliable current sensing. Embodiments of the sampling module provide certain functionality, including integration, blanking, buffering, and adjustable sampling frequency. Further, some embodiments include feedback functionality for generating a converter driver signal (for driving the switching converter) and/or a sample driver signal (for driving the sampling module) as a function of sensed output feedback from the sampling module.

Abstract: Methods, systems, and devices are provided for optimizing a bus voltage supplied to a switching power converter to keep the duty cycle of the switching power converter to within a desirable operating range. In some embodiments, the duty cycle of the switching signal used to drive the switching power converter is monitored (e.g., indirectly) to determine whether the duty cycle is approaching an undesirable level. For example, as the duty cycle decreases (e.g., approaches or crosses a certain threshold), embodiments decrease the bus voltage. This may, in turn, allow the switching power converter to output substantially the same output to the load, while using a more efficient (e.g., larger) duty cycle. Certain embodiments use similar techniques, along with certain bus voltage optimization techniques, to control a bus voltage as a function of feedback from multiple switching power converters.

Abstract: A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 50 PSIG, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures.