Abstract: A scanning assembly (400) for use in a scanning display includes a reflective scanning surface, such as a scanning mirror (412). The reflected scanning surface can be mounted on a scan plate (409). The scanning assembly (400) is configured to pivot about a first axis (403) and a second axis (404) to form an image. To correct parallelogram distortion, the first axis (403) and second axis (404) are non-orthogonal relative to each other. Torsion arms (407,408) facilitating rotation of the scanning mirror (412) along one axis (403) can be oriented non-orthogonally relative to other torsion arms (413,414) by an amount sufficient to correct parallelogram distortion.

Abstract: A scanning projector includes a mirror that scans in two dimensions, at least one of which is sinusoidal. A position sensor provides a position signal that represents an angular displacement of the mirror. The position signal is amplified by an amplifier with time variant characteristics. A beam position determination component compensates for the time variant characteristics of the amplifier.

Abstract: A portable video projector includes facility to direct a projected image field along an axis in an alignment corresponding to the state of an optical element.

Abstract: A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A grounding pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the grounding pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.

Abstract: A method for forming a memory cell transistor is disclosed which includes providing a substrate, forming a trench structure in the substrate, depositing a conductive substance on the surface of the substrate to form a conductive member inside the trench structure, forming one or more dielectric layers on the surface of the substrate, forming one or more first conductive layers on top of the dielectric layers, and etching the first conductive layers and the dielectric layers to form a hole structure extending through the first conductive and the dielectric layers, reaching to the substrate surface. The formed memory cell transistor thus comprises a hole structure which is formed from the surface of the top first conductive layer, extending downwards through the first conductive layers and the dielectric layers, and reaching the substrate surface. One or more second conductive layers may be formed on top of the first conductive layers, with the second conductive layer material filling the hole structure.

Abstract: A substrate inspection method is disclosed. The disclosed method includes 1) providing one or more images of one or more sample substrates; 2) identifying, from the images, two or more occurrences of a target pattern in the images; and 3) comparing the identified target-pattern occurrences against each other to determine, from the images, a presence of abnormalities in the compared target-pattern occurrences, hence determining one or more defects physically present in the target-pattern occurrences. The disclosed method may be implemented via execution of a computer program encoded in a computer readable medium, where the computer program instructs an imaging apparatus to form images of the of-interest sample substrates and instructs an image analyzing apparatus to identify and compare, from the images, the target-pattern occurrences on the sample substrates.

Abstract: An arrangement for improving performance of a sensor operative for collecting light from a target to generate a data signal in a presence of ambient light, includes a sample and hold circuit for operating the sensor during a sampling time period in which the sensor only collects the ambient light to generate an ambient signal, and during a holding time period in which the sensor collects both the ambient light and the light from the target to generate a composite signal comprised of the ambient signal and the data signal; and a subtracting circuit operative for subtracting the ambient signal from the composite signal to produce the data signal as an output.

Abstract: An electron gun comprises an electron emitter, an electrode surrounding the electron emitter, an extraction electrode, and a double condenser lens assembly, the double condenser lens assembly comprising a magnetic immersion pre-condenser lens and a condenser lens. In combination with a probe forming objective lens, the electron gun apparatus can provide an electron beam of independently adjustable probe size and probe current, as is desirable in electron beam applications. The electron emitter is immersed in the magnetic field generated by a magnetic type pre-condenser lens. When activated, the pre-condenser lens collimates the beam effectively to increase its angular intensity while at the same time enlarging the virtual source as compared with non-immersion case, due to geometric magnification and aberrations of its lens action. The pre-condenser lens is followed by a condenser lens.

Abstract: An imaging method and apparatus for forming images of substantially the same area on a sample for defect inspection within the area are disclosed. The disclosed method includes line-scanning the charged particle beam over the area to form a plurality of n*Y scan lines by repeatedly forming a group of n scan lines for Y times. During the formation of each group of n scan lines, an optical beam is, from one line scan to another, selectively illuminated on the area prior to or simultaneously with scanning of the charged particle beam. In addition, during the formation of each group of n scan lines, a condition of illumination of the optical beam selectively changes from one line scan to another. The conditions at which individual n scan lines are formed are repeated for the formation of all Y groups.

Abstract: The method includes scanning a sample in at least one first scan line using a first charged particle beam probe; scanning the sample in at least one second scan line using a second charged particle beam probe, and scanning the sample in at least one third scan line using the first charged particle beam probe. The first or second charged particle beam probe is defocused by a control module of the imaging system through adjusting a condenser lens module, an objective lens module, a sample stage of the imaging system, or their combination. An image of the sample is selectively formed from the first, second and third scan lines. The first and the second charged particle beams induce a first charging condition and a second charging condition on the sample surface respectively. The second charging condition can enhance, mitigate, eliminate, reverse or have no effect on the first charging condition.

Abstract: A lightweight, compact image projection module has a laser package having a common exit port, and a plurality of lasers mounted in the package and operative for emitting a plurality of laser beams of different wavelengths through the common exit port. An optical assembly focuses the laser beams exiting the common exit port, and includes a common focusing lens through which the laser beams pass along respective paths that are in angular misalignment. An optical corrector element in at least one of the paths corrects the misalignment to produce aligned beams. A scanner sweeps the aligned beams in a pattern of scan lines, each scan line having a number of pixels. A controller causes selected pixels to be illuminated, and rendered visible, by the aligned beams to produce the image.

Abstract: Briefly, in accordance with one or more embodiments, a scanner for a scanned beam display may comprise a scanning platform having a mirror disposed thereon to reflect a beam of light impinging on the mirror, a drive coil disposed on the scanning platform to scan the reflected beam of light in response to a drive current applied to the drive coil. The drive coil has coil winding segments having a narrower width in one or more regions of the drive coil, and has coil winding segments having a greater width in one or more other regions of the drive coil to provide a the drive coil with a reduced electrical resistance.

Abstract: An integrated photonics module includes at least one light source and a MEMS scanner coupled to and held in alignment by an optical frame configured for mounting to a host system. According to some embodiments, the integrated photonics module may include a plurality of light sources and a beam combiner coupled to the optical frame. According to some embodiments, the integrated photonics module includes a selective fold mirror configured to direct at least a portion of emitted light toward the MEMS scanner in a normal direction and pass scanned light through to a field of view. The selective fold mirror may use beam polarization to select beam passing and reflection. The integrated photonics module may include a beam rotator such as a quarter-wave plate to convert the polarization of the emitted light to a different polarization adapted for passage through the fold mirror. The integrated photonics module may include one or more light detectors.

Abstract: An integrated photonics module includes at least one light source and a MEMS scanner coupled to and held in alignment by an optical frame configured for mounting to a host system. According to some embodiments, the integrated photonics module may include a plurality of light sources and a beam combiner coupled to the optical frame. According to some embodiments, the integrated photonics module includes a selective fold mirror configured to direct at least a portion of emitted light toward the MEMS scanner in a normal direction and pass scanned light through to a field of view. The selective fold mirror may use beam polarization to select beam passing and reflection. The integrated photonics module may include a beam rotator such as a quarter-wave plate to convert the polarization of the emitted light to a different polarization adapted for passage through the fold mirror. The integrated photonics module may include one or more light detectors.

Abstract: Briefly, in accordance with one or more embodiments, a prism capable of being utilized in a scanned beam projector comprises a first window disposed on a first surface through which the beam is capable of passing to impinge upon a scan engine at an angle of incidence off axis from an axis normal to a plane of the scan engine, and a second window disposed on a second surface through which the beam is capable of passing. The first surface of the prism is disposed at a non-parallel angle with respect to the second surface to reduce distortion of the scan pattern or image from the scan engine. The prism may further comprise one or more internal surfaces capable of reflecting the beam onto the scan engine off axis, where such reflecting may impart a desired polarization state to the beam reflected onto the scan engine.

Abstract: An integrated photonics module includes at least one light source and a MEMS scanner coupled to and held in alignment by an optical frame configured for mounting to a host system. According to some embodiments, the integrated photonics module may include a plurality of light sources and a beam combiner coupled to the optical frame. According to some embodiments, the integrated photonics module includes a selective fold mirror configured to direct at least a portion of emitted light toward the MEMS scanner in a normal direction and pass scanned light through to a field of view. The selective fold mirror may use beam polarization to select beam passing and reflection. The integrated photonics module may include a beam rotator such as a quarter-wave plate to convert the polarization of the emitted light to a different polarization adapted for passage through the fold mirror. The integrated photonics module may include one or more light detectors.

Abstract: An electron gun comprises an electron emitter, an electrode surrounding the electron emitter, an extraction electrode, and a double condenser lens assembly, the double condenser lens assembly comprising a magnetic immersion pre-condenser lens and a condenser lens. In combination with a probe forming objective lens, the electron gun apparatus can provide an electron beam of independently adjustable probe size and probe current, as is desirable in electron beam applications. The electron emitter is immersed in the magnetic field generated by a magnetic type pre-condenser lens. When activated, the pre-condenser lens collimates the beam effectively to increase its angular intensity while at the same time enlarging the virtual source as compared with non-immersion case, due to geometric magnification and aberrations of its lens action. The pre-condenser lens is followed by a condenser lens.

Abstract: Briefly, in accordance with one or more embodiments, scanned beam projector may comprise a light source, a scan drive and a scanning platform to project an image onto a projection surface. The scan drive circuit is capable of at least partially correcting distortion in the projected image by varying an amplitude of the scan drive signal to at least partially compensate for the distortion in the projected image.

Abstract: A charged particle detector consists of four independent light guide modules assembled together to form a segmented on-axis annular detector, with a center opening for allowing the primary charged particle beam to pass through. One side of the assembly facing the specimen is coated with or bonded to scintillator material as the charged particle detection surface. Each light guide module is coupled to a photomultiplier tube to allow light signals transmitted through each light guide module to be amplified and processed separately. A charged particle detector is made from a single block of light guide material processed to have a cone shaped circular cutout from one face, terminating on the opposite face to an opening to allow the primary charged particle beam to pass through. The opposite face is coated with or bonded to scintillator material as the charged particle detection surface.

Abstract: A patterning device handling apparatus for use in charged particle beam imaging is disclosed. The disclosed patterning device handling apparatus comprises a first gripping member and a second gripping member. The first gripping member is equipped with a plurality of first positioning projections, and the second gripping member is equipped with a plurality of second positioning projections. When the patterning device is held at one angle, the first positioning projections abut against one edge of the patterning device and the second positioning projections abut against the opposite edge of the patterning device. When the patterning device is held at another angle, the first positioning projections abut against two neighboring edges of the patterning device, and the second positioning projections abut against the other two neighboring edges of the patterning device. Therefore, the disclosed patterning device handling apparatus can hold the pattering device at different angles.