Abstract: A device with a light-emitting diode includes a substrate, a first conductive pad and a second conductive pad, a light-emitting diode, a metal protrusion, a polymer layer, and a top electrode. The substrate has a top surface. The first conductive pad and the second conductive pad are on the substrate. The light-emitting diode is on the first conductive pad. The metal protrusion is on the second conductive pad. The polymer layer covers the top surface of the substrate, the first conductive pad, the second conductive pad, the metal protrusion, and the light-emitting diode, in which a distance from a top of the metal protrusion to the top surface of the substrate is greater than a thickness of the polymer layer. The top electrode covers the light-emitting diode, the polymer layer, and the metal protrusion such that the light-emitting diode is electrically connected with the second conductive pad.

Abstract: A method for replacing an element of a display device includes: forming a structure with a first liquid layer between a first micro device and a conductive pad of a substrate in which the first micro device is gripped by a sticking force produced by the first liquid layer; evaporating the first liquid layer such that the first micro device is bound to the substrate; determining if the first micro device is malfunctioned or misplaced; removing the first micro device when the first micro device is malfunctioned or misplaced; forming another structure with a second liquid layer between a second micro device and the conductive pad of the substrate in which the second micro device is gripped by a sticking force produced by the second liquid layer; and evaporating the second liquid layer such that the second micro device is bound to the substrate.

Abstract: A micro light emitting diode display includes a substrate, an electrode layer and a micro light emitting diode device. The substrate has a first surface, a second surface opposite to the first surface, and at least one air passage extending from the first surface to the second surface. The electrode layer is disposed on and in contact with the first surface of the substrate. The air passage has an opening on the first surface of the substrate, and the electrode layer is spaced apart from the opening. The micro light emitting diode device is disposed on the electrode layer and has a light emitting area that is less than or equal to 2500 ?m2.

Abstract: A method of handling a micro device is provided. The method includes: holding the micro device by a transfer head; forming a liquid layer between the micro device and a substrate; maintaining a first temperature of the transfer head to be lower than an environmental temperature; maintaining a second temperature of the substrate to be lower than the environmental temperature; and binding the micro device to the substrate by the liquid layer.

Abstract: A micro light-emitting diode transparent display including a transparent substrate is provided. N pixels are defined on the transparent substrate. N sets of micro light-emitting diodes are on the transparent substrate and respectively located in the N pixels. A wall portion is on the transparent substrate and surrounding one of the N sets of the micro light-emitting diodes to form an enclosed region on the transparent substrate. A length of a periphery of the enclosed region is equal to or smaller than 85% of a length of an outer periphery of one of the N pixels in which said one of the N sets of the micro light-emitting diodes is located. An area of said one of the N pixels outside the enclosed region allows light to directly pass through the micro light-emitting diode transparent display.

Abstract: A micro light emitting diode display includes a display module and a hydrophobic layer. The display module includes a substrate, an electrode layer, and a micro light emitting diode device. The substrate has a first surface, a second surface opposite to the first surface and at least one air passage extending from the first surface to the second surface. The electrode layer is disposed on and in contact with the first surface of the substrate. The air passage has an opening on the first surface of the substrate, and the electrode layer is spaced apart from the opening. The micro light emitting diode device is disposed on the electrode layer and has a light emitting area that is less than or equal to 2500 ?m2. The hydrophobic layer at least partially covers a side of the display module.

Abstract: A method for rapidly gathering a sub-threshold swing from a thin film transistor is provided. The method includes: electrically connecting an operational amplifier and an anti-exponential component to a source terminal of the thin film transistor; performing a measuring process to the thin film transistor in which the measuring process is inputting multiple values of a gate voltage to a gate terminal, such that multiple values of an output voltage are correspondingly generated from the output terminal of the operational amplifier; and performing a fitting process to the output voltage corresponding to the thin film transistor in which the fitting process is fitting at least two of said multiple values of the output voltage to get the sub-threshold swing.

Abstract: A micro light emitting diode display includes a substrate, an electrode layer and a micro light emitting diode device. The substrate has a first surface, a second surface opposite to the first surface, and at least one air passage extending from the first surface to the second surface. The electrode layer is disposed on and in contact with the first surface of the substrate. The air passage has an opening on the first surface of the substrate, and the electrode layer is spaced apart from the opening. The micro light emitting diode device is disposed on the electrode layer and has a light emitting area that is less than or equal to 2500 ?m2.

Abstract: A method of forming a conductive area at a top surface of a light-emitting diode includes: preparing a substrate having a top surface with a conductive pad thereon; bonding a light-emitting diode having first and second type semiconductor layers and an active layer to the conductive pad; forming a polymer layer on the substrate such that a difference between a distance from a first surface of the polymer layer to the top surface of the substrate and a distance from a second surface of the polymer layer to a top surface of the light-emitting diode is greater than a distance from an interface between a second type semiconductor layer and an active layer to the top surface of the substrate; and etching the polymer layer till the second type semiconductor layer to expose the top surface of the light-emitting diode from the polymer layer.

Abstract: A method of transferring a plurality of micro devices is provided. The method includes: arranging the micro devices on a carrier substrate in a hexagonal manner; arranging a plurality of pick-up portions of a transfer head in a rectangular manner; and picking up the micro devices from the carrier substrate by the pick-up portions.

Abstract: An electrostatic chuck including a body, an electrode, a diffusion blocking layer, and a composite dielectric layer is provided. The electrode is present on the body. The diffusion blocking layer is present on the electrode. The composite dielectric layer is present on the diffusion blocking layer. The composite dielectric layer includes a polymer layer and a plurality of inorganic dielectric particles. The plurality of inorganic dielectric particles is distributed within the polymer layer, and a permittivity of the inorganic dielectric particles is greater than a permittivity of the polymer layer.

Abstract: A direct coupling fiber-device structure including an optical fiber and a micro device is provided. The optical fiber has a first end, a second end opposite to the first end, and an inner cavity recessed from the first end. The micro device is in the inner cavity. The micro device has a first surface and a second surface. The first surface is substantially facing away from the first end. The second surface is opposite to the first surface and facing toward the first end.

Abstract: A method of restricting a micro device on a conductive pad is provided. The method includes: forming the conductive pad having a first lateral length on a substrate; forming a liquid layer on the conductive pad; and placing the micro device having a second lateral length over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, the micro device comprising an electrode facing the conductive pad, wherein the first lateral length is less than or equal to twice of the second lateral length.

Abstract: A method of liquid assisted bonding includes: forming a structure with a liquid layer between an electrode of a device and a contact pad of a substrate, and two opposite surfaces of the liquid layer being respectively in contact with the electrode and the contact pad in which hydrogen bonds are formed between the liquid layer and at least one of the electrode and the contact pad; and evaporating the liquid layer to break said hydrogen bonds such that at least one of a surface of the electrode facing the contact pad and a surface of the contact pad facing the electrode is activated so as to assist a formation of a diffusion bonding between the electrode of the device and the contact pad in which a contact area between the electrode and the contact pad is smaller than or equal to about 1 square millimeter.

Abstract: A method of transferring a micro device is provided. The method includes: aligning a transfer plate with the micro device thereon with a receiving substrate having a contact pad thereon such that the micro device is above or in contact with the contact pad; moving a combination of the transfer plate with the micro device thereon and the receiving substrate into a confined space with a relative humidity greater than or equal to about 85% so as to condense some water between the micro device and the contact pad; and attaching the micro device to the contact pad.

Abstract: A method of liquid assisted binding is provided. The method includes: forming a conductive pad on the substrate; placing a micro device on the conductive pad, such that the micro device is in contact with the conductive pad in which the micro device comprises an electrode facing the conductive pad; forming a liquid layer on the micro device and the substrate after said placing, such that a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer; and evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad.

Abstract: A method for preventing crack extensions during a lift-off process is provided. The method includes forming an epitaxial layer on a wafer substrate; forming a guard trench in the epitaxial layer, wherein a depth of the guard trench in a thickness direction of the epitaxial layer is at least half of a thickness of the epitaxial layer, and a total length of the guard trench is greater than at least a quarter of a circumference of the epitaxial layer; and performing a lift-off process to separate the wafer substrate from the epitaxial layer.

Abstract: A method for transferring a micro device is provided. The method includes: preparing a carrier substrate with the micro device thereon, wherein an adhesive layer is between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head; forming a liquid layer on a receiving substrate; and placing the micro device over the receiving substrate by the transfer head such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.

Abstract: A method for transferring a micro device includes: preparing a carrier substrate with the micro device thereon in which an adhesive layer is present between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head comprising a force-adjustable glue layer thereon; forming a liquid layer on a receiving substrate; reducing the grip force of the force-adjustable glue layer of the transfer head to be smaller than a force attaching the micro device to the receiving substrate; placing the micro device over the receiving substrate such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.

Abstract: An electrical binding structure is provided, which includes a substrate, a contact pad set, and a combination of a micro device and an electrode. The contact pad set is on the substrate in which the contact pad set includes at least one contact pad, and the at least one contact pad is conductive. The combination is on the contact pad set. Opposite sides of the electrode are respectively in contact with the micro device and the contact pad set in which at least the contact pad set and the electrode define at least one volume space. A vertical projection of the at least one volume space on the substrate is overlapped with a vertical projection of one of the contact pad set and the electrode on the substrate, and is enclosed by a vertical projection of an outer periphery of the micro device on the substrate.