Abstract: A method of performing overlay error correction includes forming a photoresist layer over a substrate and exposing a first set of apertures to incident radiation. The method also includes determining an overlay error associated with the first set of apertures and determining an overlay correction as a function of the determined overlay error. The method further includes exposing a data area and a second set of apertures. The data area and the second set of apertures are exposed based, in part, on the determined overlay correction. Moreover, the method includes verifying the determined overlay correction.

Abstract: A high-resolution image is generated using multiple spatially offset lower-resolution digital micro-mirror device (DMD) panels. Multiple lower-resolution subframe signals for controlling the spatial light modulators are generated from a high-resolution image signal using a resolution reduction and interpolation algorithm. The spatial light modulators under control of the subframe signals are illuminated by a light source and light beams reflected from the spatial light modulators are combined and directed onto a screen for display.

Abstract: A method of fabricating a spatial light modulator. The method includes providing a first substrate including a first bonding surface, forming a first layer coupled to the bonding surface, wherein the first layer is characterized by a first set of material parameters, and forming a second layer coupled to the first layer, wherein the second layer is characterized by a second set of material parameters. The method also includes patterning the first layer and the second layer to form a plurality of landing structures extending to a first distance from the bonding surface of the first substrate. The method further includes providing a second substrate including a second bonding surface, joining the first bonding surface of the first substrate to the second bonding surface of the second substrate, and forming a plurality of moveable mirrors from the second substrate. During operation, the moveable mirrors make contact with the second layer.

Abstract: A system for hermetically sealing devices. The system includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.

Abstract: A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region.

Abstract: A system for hermetically sealing devices includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.

Abstract: One embodiment of an micromechanical device includes a first contact surface, a moveable component having a second contact surface, and a coating of liquid or solid lubricant on at least one of the contact surfaces, where the second contact surface interacts with the first contact surface during device operation, and a gas-phase lubricant is disposed between the first contact surface and the second contact surface, where the gas-phase lubricant is adapted to increase the usable lifetime of the liquid or solid lubricant coating on the contact surfaces. One advantage of the disclosed device is that a gas-phase lubricant has a high diffusion rate and, therefore, is self-replenishing, meaning that it can quickly move back into a contact region after being physically displaced from the region by the contacting surfaces of the device during operation.

Abstract: A system for hermetically sealing devices includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.

Abstract: A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.

Abstract: A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region.

Abstract: The contrast offered by a spatial light modulator device may be enhanced by positioning nonreflective elements such as supporting posts and moveable hinges, behind the reflecting surface of the pixel. In accordance with one embodiment, the reflecting surface is suspended over and underlying hinge-containing layer by integral ribs of the reflecting material defined by gaps in a sacrificial layer. In accordance with an alternative embodiment, the reflecting surface is separated from the underlying hinge by a gap formed in an intervening layer, such as oxide. In either embodiment, walls separating adjacent pixel regions may be recessed beneath the reflecting surface to further reduce unwanted scattering of incident light and thereby enhance contrast.

Abstract: A reflective spatial light modulator device features two pairs of electrodes formed on different metallization layers. Elevation of the upper electrode pair reduces its distance from the overlying reflecting surface, thereby requiring a smaller applied voltage to generate an equivalent electrostatic attractive force for altering or maintaining physical orientation of the reflecting surface relative to incident light. In one embodiment, the reduced distance between the electrode and reflecting surface allows operation at lower voltages, reducing the possibility of breakdown and avoiding the need for complex device designs to eliminate such breakdown. In another embodiment, the reduced distance between the electrode and the reflecting surface allows the use of stiffer hinges for the reflecting surface, thereby increasing the speed of device operation. Other embodiments can employ both reduced voltage operation and the use of stiffer hinge structures.

Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.

Abstract: A micro electro-mechanical (MEMS) device assembly is provided. The MEMS device assembly includes a first substrate that has a plurality of electronic devices, a plurality of first bonding regions, and a plurality of second bonding regions. The MEMS device assembly also includes a second substrate that is bonded to the first substrate at the plurality of first bonding regions. A third substrate having a recessed region and a plurality of standoff structures is disposed over the second substrate and bonded to the first substrate at the plurality of second bonding regions. The plurality of first bonding regions provide a conductive path between the first substrate and the second substrate and the plurality of the second bonding regions provide a conductive path between the first substrate and the third substrate.

Abstract: A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.

Abstract: A method of enhancing the gray scale resolution of a PWM system. The method includes defining an N-bit PWM sequence with a length of 2N?1 units. The N-bit PWM sequence includes a least significant bit (LSB) segment characterized by a temporal length of one unit. In some embodiments, the temporal length of one unit is referred to as a time t0. The method also includes defining a fractional PWM sequence. The fractional PWM sequence includes the N-bit PWM sequence and a fractional bit segment of temporal length F. The temporal length of the fractional PWM sequence is 2N?1+F units. In a particular embodiment, F=1 and the temporal length of the fractional PWM sequence is 2N.

Abstract: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member.

Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.

Abstract: A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal, such as a glass frit. The low temperature bonding agent may be B-stage cured after application to the capping layer, prior to any exposure to the substrate bearing the reflecting surfaces. In accordance with one embodiment of the present invention, the capping layer may comprise a glass wafer pre-bonded with an interposer spacer layer to provide sufficient stand-off between the capping layer and the underlying reflecting structures. In accordance with an alternative embodiment of the present invention, the capping layer may comprise a glass wafer alone, and the bonding agent may include additional materials such as beads or balls to provide the necessary stand-off between the capping layer and the underlying reflective structures.

Abstract: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member.